Backplane Connectors - Accessories

Image Part Number Description / PDF Quantity Rfq
025-0767-001

025-0767-001

VEAM

RP CONDUCTIVE D/C 34 SHELL

1132

249-2238-000

249-2238-000

VEAM

DL2-2-J/S JUNCTION SHELL KIT

55

320-0021-005

320-0021-005

VEAM

DL1/2,DLM1/2 CENTER POL KIT X2

254

218-0179-000

218-0179-000

VEAM

DL1-C/C CABLE CLAMP KIT

0

DPKA-60-1

DPKA-60-1

VEAM

025-0773-001

21

320-4505-000

320-4505-000

VEAM

DLM1/2/3 CORNER POL KIT X4

181

320-4501-000

320-4501-000

VEAM

DL POLARIZING POSTS

0

025-1156-001

025-1156-001

VEAM

RP BKAD 1 C RCPT DUST CAP

136

320-0021-001

320-0021-001

VEAM

DL POL CORNER 4 PTS & SCRWS

0

DL2-96KIT

DL2-96KIT

VEAM

DL2-96KIT

254

227-1295-002

227-1295-002

VEAM

BKAD 2&3-1 CHAMFERED R/PLT

0

980-0009-223

980-0009-223

VEAM

RP FLOAT MT SCREW 4-40X1/4

2146

015-0343-000

015-0343-000

VEAM

RP BRACKET JCT SHELL MTG DPX2

0

250-0167-000

250-0167-000

VEAM

DLD1 SPRING MTG SCREW

0

039-0236-000

039-0236-000

VEAM

DL4-1248R COVER

0

980-0003-107

980-0003-107

VEAM

DL SCREW

0

021-8756-000

021-8756-000

VEAM

RP BKA PIN CAVITY REDUCER

0

025-0585-000

025-0585-000

VEAM

RP DPD 33 & 34 DUST CAP

0

DPA-60-1

DPA-60-1

VEAM

RP DPA 60 CONDUCTIVE DUST CAP

0

980-0003-272

980-0003-272

VEAM

DL #4-40 HEX NUT STEEL

0

Backplane Connectors - Accessories

1. Overview

Backplane connectors are critical components in electronic systems, providing modular interconnection between printed circuit boards (PCBs) and supporting high-density signal/power transmission. Accessories enhance their functionality through mechanical support, environmental protection, and performance optimization. These components are essential in telecommunications, data centers, and industrial equipment for ensuring reliable system architecture.

2. Major Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Alignment PinsPrecision-guided insertion, anti-misalignment designTelecom backplanes
Grounding ClipsEMI shielding, 360 contactMilitary radar systems
Dust CoversIP67-rated contamination protectionOutdoor base stations
Mounting BracketsVibration damping, load distributionIndustrial control cabinets
Test AdaptersHot-swappable diagnostics interfaceData center maintenance

3. Structural Composition

Typical construction includes:

  • Mechanical components: Precision-machined alignment guides and stress-relief brackets
  • Electrical elements: Gold-plated contact points and EMI gaskets
  • Material composition: LCP (Liquid Crystal Polymer) insulation with UL94 V-0 rating

4. Key Technical Specifications

ParameterTypical RangeImportance
Current Rating1-5A per contactPower transmission capability
Dielectric Strength1,000-2,500VACElectrical safety margin
Contact Resistance<10m Signal integrity maintenance
Insertion Force20-80NUsability and durability
Operating Temp-55 C to +125 CEnvironmental reliability

5. Application Fields

Primary industries:

  • Telecommunications: 5G base stations, optical switches
  • Data Centers: Server racks, storage arrays
  • Industrial Automation: PLC backplanes
  • Medical Imaging: MRI scanner chassis interconnects
  • Aerospace: Avionics modular systems

6. Leading Manufacturers & Products

ManufacturerKey Product SeriesTechnical Highlights
TE ConnectivityARINC 800H100Gbps optical integration
AmphenolCBGA SocketZero insertion force design
MolexMX-SERIESSelf-aligning twinax contacts
SamtecRaptor HD25.4 m contact spacing

7. Selection Guidelines

Key considerations:

  • Signal integrity requirements (frequency & skew tolerance)
  • Environmental conditions (temperature/humidity/corrosion)
  • Mechanical durability (mating cycles & vibration resistance)
  • Thermal management (current carrying capacity)
  • Compliance standards (IPC, MIL-STD, RoHS)

Case Study: In hyper-scale data centers, Samtec's FireFly modular system reduced rack interconnect costs by 40% while maintaining 28Gbps performance.

8. Industry Trends

Emerging developments include:

  • High-speed protocols (PCIe 5.0, 112Gbps SerDes)
  • Miniaturization (sub-1mm contact pitch)
  • Smart monitoring integration (embedded sensors)
  • Advanced materials (graphene-enhanced contacts)
  • Sustainable manufacturing (lead-free plating processes)
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