Backplane Connectors - Accessories

Image Part Number Description / PDF Quantity Rfq
980-0001-299

980-0001-299

VEAM

RP BKA SPLIT LOCK WASHER

0

127059-0055

127059-0055

VEAM

PROTECT COVER DLP408 (100PCS)

0

238-0138-000

238-0138-000

VEAM

RP BKA FLOAT MOUNT RIVIT

0

249-2060-001

249-2060-001

VEAM

DL3-2-J/S

1

DL3-60KIT

DL3-60KIT

VEAM

DL3-60KIT

33

980-0005-431

980-0005-431

VEAM

RP BK POWER O-RING SIZE 2

40

249-2237-000

249-2237-000

VEAM

DL3-3-J/S

39

349-1087-007

349-1087-007

VEAM

RP SHELL ASSY RECP SZ 8 COAX

0

DPXB-60-1

DPXB-60-1

VEAM

RP CONDUCTIVE D/C 34 SHELL

1132

201-0070-000

201-0070-000

VEAM

RP POL KEY DPX BKA

201

249-1985-001

249-1985-001

VEAM

DL2-1-J/S

0

990-0019-062

990-0019-062

VEAM

RP #4 LOCK WASHER A101 STEEL

3730

DL3-2-J/S

DL3-2-J/S

VEAM

249-2060-001

1

990-0020-974

990-0020-974

VEAM

RP SCREW #4-4X3/4 FL HD RECSD

1733

DL1-C/C

DL1-C/C

VEAM

CABLE CLAMP

0

DL2-1-J/S

DL2-1-J/S

VEAM

249-1985-001

0

320-4502-000

320-4502-000

VEAM

DL5,DLM5 CORNER POL KIT X4

1

320-0021-006

320-0021-006

VEAM

DL1/2/3,DLM6 CORNER POL KIT X2

1

025-1123-001

025-1123-001

VEAM

RP BKAD 2&3 A&B PLUG DUST CAP

1

025-1121-001

025-1121-001

VEAM

RP DUST CAP BKAD 1 A&B PLUG

68

Backplane Connectors - Accessories

1. Overview

Backplane connectors are critical components in electronic systems, providing modular interconnection between printed circuit boards (PCBs) and supporting high-density signal/power transmission. Accessories enhance their functionality through mechanical support, environmental protection, and performance optimization. These components are essential in telecommunications, data centers, and industrial equipment for ensuring reliable system architecture.

2. Major Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Alignment PinsPrecision-guided insertion, anti-misalignment designTelecom backplanes
Grounding ClipsEMI shielding, 360 contactMilitary radar systems
Dust CoversIP67-rated contamination protectionOutdoor base stations
Mounting BracketsVibration damping, load distributionIndustrial control cabinets
Test AdaptersHot-swappable diagnostics interfaceData center maintenance

3. Structural Composition

Typical construction includes:

  • Mechanical components: Precision-machined alignment guides and stress-relief brackets
  • Electrical elements: Gold-plated contact points and EMI gaskets
  • Material composition: LCP (Liquid Crystal Polymer) insulation with UL94 V-0 rating

4. Key Technical Specifications

ParameterTypical RangeImportance
Current Rating1-5A per contactPower transmission capability
Dielectric Strength1,000-2,500VACElectrical safety margin
Contact Resistance<10m Signal integrity maintenance
Insertion Force20-80NUsability and durability
Operating Temp-55 C to +125 CEnvironmental reliability

5. Application Fields

Primary industries:

  • Telecommunications: 5G base stations, optical switches
  • Data Centers: Server racks, storage arrays
  • Industrial Automation: PLC backplanes
  • Medical Imaging: MRI scanner chassis interconnects
  • Aerospace: Avionics modular systems

6. Leading Manufacturers & Products

ManufacturerKey Product SeriesTechnical Highlights
TE ConnectivityARINC 800H100Gbps optical integration
AmphenolCBGA SocketZero insertion force design
MolexMX-SERIESSelf-aligning twinax contacts
SamtecRaptor HD25.4 m contact spacing

7. Selection Guidelines

Key considerations:

  • Signal integrity requirements (frequency & skew tolerance)
  • Environmental conditions (temperature/humidity/corrosion)
  • Mechanical durability (mating cycles & vibration resistance)
  • Thermal management (current carrying capacity)
  • Compliance standards (IPC, MIL-STD, RoHS)

Case Study: In hyper-scale data centers, Samtec's FireFly modular system reduced rack interconnect costs by 40% while maintaining 28Gbps performance.

8. Industry Trends

Emerging developments include:

  • High-speed protocols (PCIe 5.0, 112Gbps SerDes)
  • Miniaturization (sub-1mm contact pitch)
  • Smart monitoring integration (embedded sensors)
  • Advanced materials (graphene-enhanced contacts)
  • Sustainable manufacturing (lead-free plating processes)
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