Backplane Connectors - Accessories

Part Number	Description / PDF	Quantity
039-0247-000 VEAM	DL3-60R COVER	13
039-0244-000 VEAM	DL2-96P COVER	58
204-0016-000 VEAM	CONN HANDLE DL1/2/3,DLM1/2/3	1220
127059-0069 VEAM	LEVER QLC	190
039-0242-000 VEAM	DL1-156P COVER	8
025-1158-001 VEAM	RP BKAD 2 AND 3 C RCPT DUST CAP	1
025-1122-001 VEAM	RP DUST CAP BKAD 1 C PLUG	106
DPXA-59 VEAM	RP CONDUCTIVE D/C 33 SHELL	0
025-1157-001 VEAM	RP BKAD 2&3 A&B RCPT DUST CAP	0
DLM6 HANDLE VEAM	DLM6 HANDLE	252
021-8757-000 VEAM	RP BKA SKT CAVITY REDUCER	9
226-0349-000 VEAM	RP DPK PIN FEMALE GUIDE	1
025-0774-001 VEAM	RP DPKB-60-1 CONDUCTIVE D/C	11
127000-2719 VEAM	DLP PLUG DUST CAP	0
DPX-22017 VEAM	RP DPX JUNCTION SHELL	0
DL2-J/S VEAM	PLASTIC BACKSHELL	549
990-0001-161 VEAM	RP #4-40 CLINCH NUT	36
225-0097-000 VEAM	RP BKAD FILLER PLUG 12 YELLOW	100
DL5 HANDLE VEAM	HANDLE FOR DL5 DLM5 & DLP408	654
320-1067-003 VEAM	RP BKA PLUG POST POL KIT	0

Backplane Connectors - Accessories

1. Overview

Backplane connectors are critical components in electronic systems, providing modular interconnection between printed circuit boards (PCBs) and supporting high-density signal/power transmission. Accessories enhance their functionality through mechanical support, environmental protection, and performance optimization. These components are essential in telecommunications, data centers, and industrial equipment for ensuring reliable system architecture.

2. Major Types & Functional Classification

Type	Functional Features	Application Examples
Alignment Pins	Precision-guided insertion, anti-misalignment design	Telecom backplanes
Grounding Clips	EMI shielding, 360 contact	Military radar systems
Dust Covers	IP67-rated contamination protection	Outdoor base stations
Mounting Brackets	Vibration damping, load distribution	Industrial control cabinets
Test Adapters	Hot-swappable diagnostics interface	Data center maintenance

3. Structural Composition

Typical construction includes:

Mechanical components: Precision-machined alignment guides and stress-relief brackets
Electrical elements: Gold-plated contact points and EMI gaskets
Material composition: LCP (Liquid Crystal Polymer) insulation with UL94 V-0 rating

4. Key Technical Specifications

Parameter	Typical Range	Importance
Current Rating	1-5A per contact	Power transmission capability
Dielectric Strength	1,000-2,500VAC	Electrical safety margin
Contact Resistance	<10m	Signal integrity maintenance
Insertion Force	20-80N	Usability and durability
Operating Temp	-55 C to +125 C	Environmental reliability

5. Application Fields

Primary industries:

Telecommunications: 5G base stations, optical switches
Data Centers: Server racks, storage arrays
Industrial Automation: PLC backplanes
Medical Imaging: MRI scanner chassis interconnects
Aerospace: Avionics modular systems

6. Leading Manufacturers & Products

Manufacturer	Key Product Series	Technical Highlights
TE Connectivity	ARINC 800H	100Gbps optical integration
Amphenol	CBGA Socket	Zero insertion force design
Molex	MX-SERIES	Self-aligning twinax contacts
Samtec	Raptor HD	25.4 m contact spacing

7. Selection Guidelines

Key considerations:

Signal integrity requirements (frequency & skew tolerance)
Environmental conditions (temperature/humidity/corrosion)
Mechanical durability (mating cycles & vibration resistance)
Thermal management (current carrying capacity)
Compliance standards (IPC, MIL-STD, RoHS)

Case Study: In hyper-scale data centers, Samtec's FireFly modular system reduced rack interconnect costs by 40% while maintaining 28Gbps performance.

8. Industry Trends

Emerging developments include:

High-speed protocols (PCIe 5.0, 112Gbps SerDes)
Miniaturization (sub-1mm contact pitch)
Smart monitoring integration (embedded sensors)
Advanced materials (graphene-enhanced contacts)
Sustainable manufacturing (lead-free plating processes)