Backplane Connectors - Accessories

Image Part Number Description / PDF Quantity Rfq
248-1710-000

248-1710-000

VEAM

RP DPGM JUNCTION SHELL

0

204-0016-001

204-0016-001

VEAM

DL2 HANDLE ASSEMBLY

0

317-1368-001

317-1368-001

VEAM

DL1-BOOT BLACK

0

227-1294-002

227-1294-002

VEAM

RP BKA RET PLATE RED

0

021-0144-004

021-0144-004

VEAM

RP BK COAX BODY ASSY

0

317-4503-000

317-4503-000

VEAM

DL1 SPECIAL BOOT

0

DL2-3-C/C

DL2-3-C/C

VEAM

CABLE CLAMP

0

248-2781-000

248-2781-000

VEAM

RP SHELL BKAE 3 PLUG

0

039-0238-000

039-0238-000

VEAM

DL4-2496R COVER

0

249-2238-001

249-2238-001

VEAM

DL2-4-J/S JUNCTION SHELL KIT

57

320-1062-000

320-1062-000

VEAM

RP RG214 SOLDER TERM KIT

0

11457899 REV A

11457899 REV A

VEAM

RP COUPLING SCREW ASSY DPK

0

248-4500-000

248-4500-000

VEAM

DL5-260PLUG SHELL MELAL

0

DPD2-19941-3

DPD2-19941-3

VEAM

RP DPD2 BACKSHELL

0

317-1368-003

317-1368-003

VEAM

DL1-BOOT TRANSPARENT R/A

0

990-0000-334

990-0000-334

VEAM

RP SCREW FILH #4-40X3/8 LONG

0

021-0144-006

021-0144-006

VEAM

RP BKA COAX BODY ASSY

0

144-2945-002

144-2945-002

VEAM

RP BKA TCAS PLUG PLATE

0

305-0007-000

305-0007-000

VEAM

RP COUPLING SCREW ASSY DPK

0

05A251-01

05A251-01

VEAM

RP BK BLUE POL PLATE

0

Backplane Connectors - Accessories

1. Overview

Backplane connectors are critical components in electronic systems, providing modular interconnection between printed circuit boards (PCBs) and supporting high-density signal/power transmission. Accessories enhance their functionality through mechanical support, environmental protection, and performance optimization. These components are essential in telecommunications, data centers, and industrial equipment for ensuring reliable system architecture.

2. Major Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Alignment PinsPrecision-guided insertion, anti-misalignment designTelecom backplanes
Grounding ClipsEMI shielding, 360 contactMilitary radar systems
Dust CoversIP67-rated contamination protectionOutdoor base stations
Mounting BracketsVibration damping, load distributionIndustrial control cabinets
Test AdaptersHot-swappable diagnostics interfaceData center maintenance

3. Structural Composition

Typical construction includes:

  • Mechanical components: Precision-machined alignment guides and stress-relief brackets
  • Electrical elements: Gold-plated contact points and EMI gaskets
  • Material composition: LCP (Liquid Crystal Polymer) insulation with UL94 V-0 rating

4. Key Technical Specifications

ParameterTypical RangeImportance
Current Rating1-5A per contactPower transmission capability
Dielectric Strength1,000-2,500VACElectrical safety margin
Contact Resistance<10m Signal integrity maintenance
Insertion Force20-80NUsability and durability
Operating Temp-55 C to +125 CEnvironmental reliability

5. Application Fields

Primary industries:

  • Telecommunications: 5G base stations, optical switches
  • Data Centers: Server racks, storage arrays
  • Industrial Automation: PLC backplanes
  • Medical Imaging: MRI scanner chassis interconnects
  • Aerospace: Avionics modular systems

6. Leading Manufacturers & Products

ManufacturerKey Product SeriesTechnical Highlights
TE ConnectivityARINC 800H100Gbps optical integration
AmphenolCBGA SocketZero insertion force design
MolexMX-SERIESSelf-aligning twinax contacts
SamtecRaptor HD25.4 m contact spacing

7. Selection Guidelines

Key considerations:

  • Signal integrity requirements (frequency & skew tolerance)
  • Environmental conditions (temperature/humidity/corrosion)
  • Mechanical durability (mating cycles & vibration resistance)
  • Thermal management (current carrying capacity)
  • Compliance standards (IPC, MIL-STD, RoHS)

Case Study: In hyper-scale data centers, Samtec's FireFly modular system reduced rack interconnect costs by 40% while maintaining 28Gbps performance.

8. Industry Trends

Emerging developments include:

  • High-speed protocols (PCIe 5.0, 112Gbps SerDes)
  • Miniaturization (sub-1mm contact pitch)
  • Smart monitoring integration (embedded sensors)
  • Advanced materials (graphene-enhanced contacts)
  • Sustainable manufacturing (lead-free plating processes)
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