Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
A03XAF03XAF22K152A

A03XAF03XAF22K152A

JST

JUMPER 03XAF-2S - 03XAF-2S 6"

962

A16SUR16SUR32W254A

A16SUR16SUR32W254A

JST

JUMPER 15SUR-32S - 16SUR-32S 10"

0

A09KR09KR26E51B

A09KR09KR26E51B

JST

JUMPER 0KR-6S-P - 09KR-6S-P 2"

1000

A03KR03KR26E102B

A03KR03KR26E102B

JST

JUMPER 03KR-6S-P - 03KR-6S-P 4"

20

A01RSFR16K254K

A01RSFR16K254K

JST

JUMPER RSFR-1VF-K 10"

0

A10ZR10ZR28H51B

A10ZR10ZR28H51B

JST

JUMPER 10ZR-8M-P - 10ZR-8M-P 2"

954

A03SR03SR30K305A

A03SR03SR30K305A

JST

JUMPER 03SR-3S - 03SR-3S 12"

300

A08KR08DA28W203B

A08KR08DA28W203B

JST

JUMPER 08DA-8M - 08KR-8M-P 8"

0

A10KR10KR26E51A

A10KR10KR26E51A

JST

JUMPER 10KR-6S-P - 10KR-6S-P 2"

767

A15SUR15SUR32W102B

A15SUR15SUR32W102B

JST

JUMPER 15SUR-32S - 15SUR-32S 4"

0

A02RSFP16K102K

A02RSFP16K102K

JST

JUMPER RSFP-2-LM 4"

0

A02SYP22KR102SS

A02SYP22KR102SS

JST

JUMPER SYP-02T-1 RCY CONN 4"

0

A10KR10KR26E305A

A10KR10KR26E305A

JST

JUMPER 10KR-6S-P - 10KR-6S-P 12"

864

A20SUR20SUR32W102B

A20SUR20SUR32W102B

JST

JUMPER 20SUR-32S - 20SUR-32S 4"

0

A04XSR04XSR36R254B

A04XSR04XSR36R254B

JST

JUMPER 04XSR-36S - 04XSR-36S 10"

1000

A12SUR12SUR32W305A

A12SUR12SUR32W305A

JST

JUMPER 12SUR-32S - 12SUR-32S 12"

944

A03ZR03ZR28H203A

A03ZR03ZR28H203A

JST

JUMPER 03ZR-8M-P - 03ZR-8M-P 8"

953

A11KR11KR26E254A

A11KR11KR26E254A

JST

JUMPER 11KR-6S-P - 11KR-6S-P 10"

1000

A10XAF10XAF22K305B

A10XAF10XAF22K305B

JST

JUMPER 10XAF-2S - 10XAF-2S 12"

0

A10ZR10ZR28H254B

A10ZR10ZR28H254B

JST

JUMPER 10ZR-8M-P - 10ZR-8M-P 10"

432

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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