Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
A12KR12DA28W254B

A12KR12DA28W254B

JST

JUMPER 12DA-8M - 12KR-8M-P 10"

0

A06XAF06XAF22K203B

A06XAF06XAF22K203B

JST

JUMPER 06XAF-2S - 06XAF-2S 8"

928

A09ZR09ZR28H254A

A09ZR09ZR28H254A

JST

JUMPER 09ZR-8M-P - 09ZR-8M-P 10"

1000

A11ZR11ZR28H152A

A11ZR11ZR28H152A

JST

JUMPER 11ZR-8M-P - 11ZR-8M-P 6"

964

A02SR02SR30K203B

A02SR02SR30K203B

JST

JUMPER 02SR-3S -02SR-3S 8"

309

A10SR10SR30K152B

A10SR10SR30K152B

JST

JUMPER 10SR-3S - 10SR-3S 6"

943

A16KR16KR26E254A

A16KR16KR26E254A

JST

JUMPER 16KR-6S-P - 16KR-6S-P 10"

999

A03XAF03XAF22K254A

A03XAF03XAF22K254A

JST

JUMPER 03XAF-2S - 03XAF-2S 10"

995

A07KR07DA28W254B

A07KR07DA28W254B

JST

JUMPER 07DA-8M - 07KR-8M-P 10"

0

A01RSFP16K203K

A01RSFP16K203K

JST

JUMPER RSFP-LP-1V-R-250-K 8"

0

A09KR09KR26E152A

A09KR09KR26E152A

JST

JUMPER 0KR-6S-P - 09KR-6S-P 6"

736

A22SUR22SUR32W102B

A22SUR22SUR32W102B

JST

JUMPER 22SUR-32S - 22SUR-32S 4"

0

A10KR10KR26E203A

A10KR10KR26E203A

JST

JUMPER 10KR-6S-P - 10KR-6S-P 8"

863

A15KR15DA28W203B

A15KR15DA28W203B

JST

JUMPER 15DA-8M - 15KR-8M-P 8"

0

A14SUR14SUR32W102B

A14SUR14SUR32W102B

JST

JUMPER 14SUR-32S - 14SUR-32S 4"

0

A15KR15KR26E152B

A15KR15KR26E152B

JST

JUMPER 15KR-6S-P - 15KR-6S-P 6"

1000

A02ZR02ZR28H203B

A02ZR02ZR28H203B

JST

JUMPER 02ZR-8M-P - 02ZR-8M-P 8"

940

A10SR10SR30K254B

A10SR10SR30K254B

JST

JUMPER 10SR-3S - 10SR-3S 10"

981

A04XSR04XSR36R51B

A04XSR04XSR36R51B

JST

JUMPER 04XSR-36S - 04XSR-36S 2"

572

A14SR14SR30K203B

A14SR14SR30K203B

JST

JUMPER 14SR-3S - 14SR-3S 8"

996

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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