Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
A08XAF08XAF22K254B

A08XAF08XAF22K254B

JST

JUMPER 08XAF-2S - 08XAF-2S 10"

980

A03KR03DS28W305B

A03KR03DS28W305B

JST

JUMPER 03DS-8E - 03KR-8M-P 12"

0

A12ZR12ZR28H203B

A12ZR12ZR28H203B

JST

JUMPER 12ZR-8M-P - 12ZR-8M-P 8"

990

A10SR10SR30K305B

A10SR10SR30K305B

JST

JUMPER 10SR-3S - 10SR-3S 12"

859

A05XAF05XAF22K254A

A05XAF05XAF22K254A

JST

JUMPER 05XAF-2S - 05XAF-2S 10"

976

A22XSR22XSR36R51A

A22XSR22XSR36R51A

JST

JUMPER 22XSR-36S - 22XSR-36S 2"

0

A02RSFR16K152K

A02RSFR16K152K

JST

JUMPER RSFR-2-LM 6"

0

A04XAF04XAF22K203B

A04XAF04XAF22K203B

JST

JUMPER 04XAF-2S - 04XAF-2S 8"

980

A22SUR22SUR32W203B

A22SUR22SUR32W203B

JST

JUMPER 22SUR-32S - 22SUR-32S 8"

0

A16KR16KR26E203A

A16KR16KR26E203A

JST

JUMPER 16KR-6S-P - 16KR-6S-P 8"

972

A16XSR16XSR36R295A

A16XSR16XSR36R295A

JST

JUMPER 16XSR-36S - 16XSR-36S 12"

0

A05KR05DA28W203B

A05KR05DA28W203B

JST

JUMPER 05DA-8M - 05KR-8M-P 8"

0

A13KR13KR26E203B

A13KR13KR26E203B

JST

JUMPER 13KR-6S-P - 13KR-6S-P 8"

1000

A09KR09DA28W254B

A09KR09DA28W254B

JST

JUMPER 09DA-8M - 09KR-8M-P 10"

0

A20XAF20XAF22K152B

A20XAF20XAF22K152B

JST

JUMPER 20XAF-2S - 20XAF-2S 6"

1000

A07ZR07ZR28H305A

A07ZR07ZR28H305A

JST

JUMPER 07ZR-8M-P - 07ZR-8M-P 12"

972

A10XAF10XAF22K152B

A10XAF10XAF22K152B

JST

JUMPER 10XAF-2S - 10XAF-2S 6"

988

A04XSR04XSR36R203B

A04XSR04XSR36R203B

JST

JUMPER 04XSR-36S - 04XSR-36S 8"

984

A12KR12KR26E254B

A12KR12KR26E254B

JST

JUMPER 12KR-6S-P - 12KR-6S-P 10"

943

A04ZR04ZR28H203B

A04ZR04ZR28H203B

JST

JUMPER 04ZR-8M-P - 04ZR-8M-P 8"

2869

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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