Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
M3BGK-2018R

M3BGK-2018R

3M

IDC CABLE - MSR20K/MC20M/MCS20K

0

M3UYK-4036R

M3UYK-4036R

3M

IDC CABLE - MKS40K/MC40M/MPD40K

0

M3DEK-2006R

M3DEK-2006R

3M

IDC CABLE - MKR20K/MC20M/MCE20K

0

M3AEK-2036J

M3AEK-2036J

3M

IDC CABLE - MSC20K/MC20G/MCE20K

0

M1CXK-2640K

M1CXK-2640K

3M

IDC CABLE - MKC26K/MC26F/X

0

M3TEK-5006J

M3TEK-5006J

3M

IDC CABLE - MSD50K/MC50G/MCE50K

0

M3DDK-1460K

M3DDK-1460K

3M

IDC CABLE - MKR14K/MC14F/MKR14K

0

M3DRK-2418J

M3DRK-2418J

3M

IDC CABLE - MKR24K/MC24G/MPR24K

0

M1CXA-1440K

M1CXA-1440K

3M

IDC CABLE - MKC14A/MC14F/X

0

M3UFK-1606R

M3UFK-1606R

3M

IDC CABLE - MKS16K/MC16M/MCF16K

0

M3KKK-2418R

M3KKK-2418R

3M

IDC CABLE - MPK24K/MC24M/MPK24K

0

M1MXK-6440K

M1MXK-6440K

3M

IDC CABLE - MCG64K/MC64F/X

0

M3CCA-3436R

M3CCA-3436R

3M

IDC CABLE - MKC34A/MC34M/MKC34A

0

M3UEK-6060K

M3UEK-6060K

3M

IDC CABLE - MKS60K/MC60F/MCE60K

0

M3CMK-5006R

M3CMK-5006R

3M

IDC CABLE - MKC50K/MC50M/MCG50K

0

M3URK-1006R

M3URK-1006R

3M

IDC CABLE - MKS10K/MC10M/MPR10K

0

M3BFK-6040K

M3BFK-6040K

3M

IDC CABLE - MSR60K/MC60F/MCF60K

0

M3DGK-6040K

M3DGK-6040K

3M

IDC CABLE - MKR60K/MC60F/MCS60K

0

M3TGK-5006R

M3TGK-5006R

3M

IDC CABLE - MSD50K/MC50M/MCS50K

0

M3AFK-1618R

M3AFK-1618R

3M

IDC CABLE - MSC16K/MC16M/MCF16K

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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