Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
M3CWK-1660K

M3CWK-1660K

3M

IDC CABLE - MKC16K/MC16F/MPL16K

0

M3AAA-1640K

M3AAA-1640K

3M

IDC CABLE - MSC16A/MC16F/MSC16A

0

M3TFK-2636J

M3TFK-2636J

3M

IDC CABLE - MSD26K/MC26G/MCF26K

0

M3DDK-6006R

M3DDK-6006R

3M

IDC CABLE - MKR60K/MC60M/MKR60K

0

M3AEK-2620K

M3AEK-2620K

3M

IDC CABLE - MSC26K/MC26F/MCE26K

0

M3CCK-1618J

M3CCK-1618J

3M

IDC CABLE - MKC16K/MC16G/MKC16K

0

M3RRK-1406J

M3RRK-1406J

3M

IDC CABLE - MPR14K/MC14G/MPR14K

0

M3CEK-3436R

M3CEK-3436R

3M

IDC CABLE - MKC34K/MC34M/MCE34K

0

M3CCK-3418J

M3CCK-3418J

3M

IDC CABLE - MKC34K/MC34G/MKC34K

0

M3WWK-1418R

M3WWK-1418R

3M

IDC CABLE - MPL14K/MC14M/MPL14K

0

M3BBA-6006R

M3BBA-6006R

3M

IDC CABLE - MSR60A/MC60M/MSR60A

0

M3DEK-1636J

M3DEK-1636J

3M

IDC CABLE - MKR16K/MC16G/MCE16K

0

M1UXK-1436R

M1UXK-1436R

3M

IDC CABLE - MKS14K/MC14M/X

0

M3BBA-4036J

M3BBA-4036J

3M

IDC CABLE - MSR40A/MC40G/MSR40A

0

M3AKK-1636R

M3AKK-1636R

3M

IDC CABLE - MSC16K/MC16M/MPK16K

0

M3CCA-5018J

M3CCA-5018J

3M

IDC CABLE - MKC50A/MC50G/MKC50A

0

M3DDA-1406J

M3DDA-1406J

3M

IDC CABLE - MKR14A/MC14G/MKR14A

676

M3UMK-4020K

M3UMK-4020K

3M

IDC CABLE - MKS40K/MC40F/MCG40K

0

M3FFK-2606R

M3FFK-2606R

3M

IDC CABLE - MCF26K/MC26M/MCF26K

0

M1DXK-1036J

M1DXK-1036J

3M

IDC CABLE - MKR10K/MC10G/X

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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