Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
M3AAK-1636R

M3AAK-1636R

3M

IDC CABLE - MSC16K/MC16M/MSC16K

0

M3CFK-2036R

M3CFK-2036R

3M

IDC CABLE - MKC20K/MC20M/MCF20K

0

M3AAA-6040K

M3AAA-6040K

3M

IDC CABLE - MSC60A/MC60F/MSC60A

0

M3AAA-6036J

M3AAA-6036J

3M

IDC CABLE - MSC60A/MC60G/MSC60A

0

M1MXK-5036J

M1MXK-5036J

3M

IDC CABLE - MCG50K/MC50G/X

0

M3GGK-3418J

M3GGK-3418J

3M

IDC CABLE - MCS34K/MC34G/MCS34K

0

M3BYK-1036J

M3BYK-1036J

3M

IDC CABLE - MSR10K/MC10G/MPD10K

0

M1FXK-1640K

M1FXK-1640K

3M

IDC CABLE - MCF16K/MC16F/X

0

M3BEK-3460K

M3BEK-3460K

3M

IDC CABLE - MSR34K/MC34F/MCE34K

0

M3AFK-6018J

M3AFK-6018J

3M

IDC CABLE - MSC60K/MC60G/MCF60K

0

M3AAK-2436J

M3AAK-2436J

3M

IDC CABLE - MSC24K/MC24G/MSC24K

0

M3DRK-2606R

M3DRK-2606R

3M

IDC CABLE - MKR26K/MC26M/MPR26K

0

M3UEK-3440K

M3UEK-3440K

3M

IDC CABLE - MKS34K/MC34F/MCE34K

0

M3CEK-4006J

M3CEK-4006J

3M

IDC CABLE - MKC40K/MC40G/MCE40K

0

D89110-0131HK-3365/10-D-6

D89110-0131HK-3365/10-D-6

3M

CABLE 10POS SOCKET TO SOCKET 6"

334

M3MMK-1060K

M3MMK-1060K

3M

IDC CABLE - MCG10K/MC10F/MCG10K

0

M1AXA-6036J

M1AXA-6036J

3M

IDC CABLE - MSC60A/MC60G/X

0

M3BBA-2040K

M3BBA-2040K

3M

IDC CABLE - MSR20A/MC20F/MSR20A

0

M3YYK-3018R

M3YYK-3018R

3M

IDC CABLE - MPD30K/MC34M/MPD30K

0

M3BYK-2020K

M3BYK-2020K

3M

IDC CABLE - MSR20K/MC20F/MPD20K

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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