Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
C8RRG-1636M

C8RRG-1636M

CW Industries

DIP CABLE - CDR16G/AE16M/CDR16G

0

FFMD-05-T-04.00-01-N

FFMD-05-T-04.00-01-N

Samtec, Inc.

.050 CABLE PLUG

32

M3UYK-1636J

M3UYK-1636J

3M

IDC CABLE - MKS16K/MC16G/MPD16K

0

A8MMS-1618G

A8MMS-1618G

TE Connectivity AMP Connectors

ADM16S/AE16G/ADM16S

0

A8MMS-1606M

A8MMS-1606M

TE Connectivity AMP Connectors

ADM16S/AE16M/ADM16S

0

C6RRS-4018G

C6RRS-4018G

CW Industries

DIP CABLE - CDR40S/AE40G/CDR40S

0

H6MMH-2018G

H6MMH-2018G

ASSMANN WSW Components

DIP CABLE - HDM20H/AE20G/HDM20H

0

M3URK-1036R

M3URK-1036R

3M

IDC CABLE - MKS10K/MC10M/MPR10K

0

0369220401

0369220401

Woodhead - Molex

DITTO 4 CIRCUIT WTW 100MM

98

HLCD-10-12.00-TD-TH-1

HLCD-10-12.00-TD-TH-1

Samtec, Inc.

CBL ASSM SELF-MATE 20POS 12" HDR

10

A3BBH-1006G

A3BBH-1006G

TE Connectivity AMP Connectors

IDC CABLE - ASR10H/AE10G/ASR10H

0

M3GGK-1636J

M3GGK-1636J

3M

IDC CABLE - MCS16K/MC16G/MCS16K

0

D89120-0101HK-3365/20-S-6

D89120-0101HK-3365/20-S-6

3M

SINGLE ENDED CABLE ASSEMBLY 20 P

63

M3TKK-2406J

M3TKK-2406J

3M

IDC CABLE - MSD24K/MC24G/MPK24K

0

2147572042

2147572042

Woodhead - Molex

MICRO-FIT3.0 P-P 4 CIRCUIT 300MM

0

2451300205

2451300205

Woodhead - Molex

2 CIRCUIT 500MM NANOFIT OVERMOLD

937

0923150408

0923150408

Woodhead - Molex

4CKT PICOFLEX 80MM LONG

0

C3AAG-3406G

C3AAG-3406G

CW Industries

IDC CABLE - CSC34G/AE34G/CSC34G

0

C3EES-5006M

C3EES-5006M

CW Industries

IDC CABLE - CCE50S/AE50M/CCE50S

0

1483352-3

1483352-3

TE Connectivity AMP Connectors

MICRO-MATCH LEAD 08P 250MM

2103

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
RFQ BOM Call Skype Email
Top