Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
H4PXS-4036G

H4PXS-4036G

ASSMANN WSW Components

DIP CABLE - HDP40S/AE40G/X

0

M3DEK-1036J

M3DEK-1036J

3M

IDC CABLE - MKR10K/MC10G/MCE10K

0

A3AKB-1606G

A3AKB-1606G

TE Connectivity AMP Connectors

IDC CABLE - ASC16B/AE16G/APK16B

0

FFSD-20-D-06.14-01-N

FFSD-20-D-06.14-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

H6PPS-2418M

H6PPS-2418M

ASSMANN WSW Components

DIP CABLE - HDP24S/AE24M/HDP24S

0

M3BEK-1060K

M3BEK-1060K

3M

IDC CABLE - MSR10K/MC10F/MCE10K

0

H3CCH-6036M

H3CCH-6036M

ASSMANN WSW Components

IDC CBL - HHKC60H/AE60M/HHKC60H

0

A3DDH-1018G

A3DDH-1018G

TE Connectivity AMP Connectors

IDC CABLE - AKR10H/AE10G/AKR10H

0

2153202052

2153202052

Woodhead - Molex

MINIFIT JR SR R-R 5 CIRCUIT 300M

50

M3TTK-2040K

M3TTK-2040K

3M

IDC CABLE - MSD20K/MC20F/MSD20K

0

H0PPH-1418G

H0PPH-1418G

ASSMANN WSW Components

DIP CABLE - HDP14H/AE14G/HDP14H

0

2153222042

2153222042

Woodhead - Molex

MINIFIT JR SR M-M 4 CIRCUIT 300M

50

FFSD-12-D-03.50-01-N

FFSD-12-D-03.50-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

A13KR13KR26E51A

A13KR13KR26E51A

JST

JUMPER 13KR-6S-P - 13KR-6S-P 2"

997

0369220806

0369220806

Woodhead - Molex

DITTO 8 CIRCUIT WTW 600MM

130

FFSD-15-D-09.85-01-N

FFSD-15-D-09.85-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

H3CCH-1036M

H3CCH-1036M

ASSMANN WSW Components

IDC CBL - HHKC10H/AE10M/HHKC10H

0

C3CCS-1036G

C3CCS-1036G

CW Industries

IDC CABLE - CKC10S/AE10G/CKC10S

0

2147582061

2147582061

Woodhead - Molex

MICRO-FIT3.0 P-S 6 CIRCUIT 150MM

0

M3TEK-3460K

M3TEK-3460K

3M

IDC CABLE - MSD34K/MC34F/MCE34K

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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