Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
M80-FC305F1-04-0300F1

M80-FC305F1-04-0300F1

Harwin

CBL ASSEM RG178 F-F 300MM 4POS

8

FFSD-05-D-03.94-01-N-R

FFSD-05-D-03.94-01-N-R

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

STM015PC2DC020Q

STM015PC2DC020Q

TE Connectivity Aerospace Defense and Marine

WDUALOBE CONNECTOR

0

FFSD-13-D-07.70-01-N

FFSD-13-D-07.70-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

T1PST-07-28-GF-12.0-A-T3

T1PST-07-28-GF-12.0-A-T3

Samtec, Inc.

CBL 1MM 7POS PNL MNT M TO F

0

M3DGK-2020K

M3DGK-2020K

3M

IDC CABLE - MKR20K/MC20F/MCS20K

0

M3BRK-1018R

M3BRK-1018R

3M

IDC CABLE - MSR10K/MC10M/MPR10K

0

M3BGK-1618R

M3BGK-1618R

3M

IDC CABLE - MSR16K/MC16M/MCS16K

0

H3CKH-4018G

H3CKH-4018G

ASSMANN WSW Components

IDC CBL - HHKC40H/AE40G/HHPK40H

0

M3FFK-5040K

M3FFK-5040K

3M

IDC CABLE - MCF50K/MC50F/MCF50K

0

A05ZR05ZR28H152A

A05ZR05ZR28H152A

JST

JUMPER 05ZR-8M-P - 05ZR-8M-P 6"

862

C3CES-1006M

C3CES-1006M

CW Industries

IDC CABLE - CKC10S/AE10M/CCE10S

0

FFSD-20-D-04.70-01-N

FFSD-20-D-04.70-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

C3CES-2606G

C3CES-2606G

CW Industries

IDC CABLE - CKC26S/AE26G/CCE26S

0

FFSD-25-D-04.01-01-N-R

FFSD-25-D-04.01-01-N-R

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

FFSD-13-D-23.00-01-N

FFSD-13-D-23.00-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

FFSD-25-D-119.00-01-N

FFSD-25-D-119.00-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

FFSD-10-D-120.00-01-N-R

FFSD-10-D-120.00-01-N-R

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

M3CCA-3006R

M3CCA-3006R

3M

IDC CABLE - MKC30A/MC34M/MKC30A

0

M50-9102042

M50-9102042

Harwin

CBL ASSY 1.27MM 40POS F-F 150MM

160

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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