Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
FFSD-05-D-12.60-01-N-RW

FFSD-05-D-12.60-01-N-RW

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

M3BBA-2640K

M3BBA-2640K

3M

IDC CABLE - MSR26A/MC26F/MSR26A

0

M1WXK-2436J

M1WXK-2436J

3M

IDC CABLE - MPL24K/MC24G/X

0

M3AKK-2660K

M3AKK-2660K

3M

IDC CABLE - MSC26K/MC26F/MPK26K

0

M3TFK-1636J

M3TFK-1636J

3M

IDC CABLE - MSD16K/MC16G/MCF16K

0

HQCD-090-12.00-TTR-STR-1-B

HQCD-090-12.00-TTR-STR-1-B

Samtec, Inc.

CBL ASSM M-F 180POS 12" HDR

0

FFSD-10-D-32.51-01-N

FFSD-10-D-32.51-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

M1BXA-6036R

M1BXA-6036R

3M

IDC CABLE - MSR60A/MC60M/X

0

FFSD-08-D-06.40-01-N

FFSD-08-D-06.40-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

H6MMH-3418M

H6MMH-3418M

ASSMANN WSW Components

DIP CABLE - HDM34H/AE34M/HDM34H

0

FFSD-12-D-02.50-01-N

FFSD-12-D-02.50-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

M3AKK-2406J

M3AKK-2406J

3M

IDC CABLE - MSC24K/MC24G/MPK24K

0

M1FXK-1040K

M1FXK-1040K

3M

IDC CABLE - MCF10K/MC10F/X

0

M3DMK-1006J

M3DMK-1006J

3M

IDC CABLE - MKR10K/MC10G/MCG10K

0

H3WWH-1618G

H3WWH-1618G

ASSMANN WSW Components

IDC CBL - HHPL16H/AE16G/HHPL16H

0

M3GGK-2036R

M3GGK-2036R

3M

IDC CABLE - MCS20K/MC20M/MCS20K

0

903-0250-000

903-0250-000

ROBOTIS

CABLE ROBOT X3P 240MM 10PCS

32

A02SR02SR30K305A

A02SR02SR30K305A

JST

JUMPER 02SR-3S - 02SR-3S 12"

639

C3DPS-2018M

C3DPS-2018M

CW Industries

IDC CABLE - CKR20S/AE20M/CPC20S

25

M3AMK-2636R

M3AMK-2636R

3M

IDC CABLE - MSC26K/MC26M/MCG26K

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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