Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
FFSD-13-D-24.00-01-N-D12-M

FFSD-13-D-24.00-01-N-D12-M

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

FFSD-05-D-23.50-01-N

FFSD-05-D-23.50-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

M3BEK-2640K

M3BEK-2640K

3M

IDC CABLE - MSR26K/MC26F/MCE26K

0

2162701064

2162701064

Woodhead - Molex

SL POSITIVE LOCK R-R 6CKT 600MM

0

FFSD-06-D-03.50-01-N

FFSD-06-D-03.50-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

A02SR02SR30K203A

A02SR02SR30K203A

JST

JUMPER 02SR-3S -02SR-3S 8"

1120

A3BBB-1418M

A3BBB-1418M

TE Connectivity AMP Connectors

IDC CABLE- ASR14B/AE14M/ASR14B

0

0923150816

0923150816

Woodhead - Molex

8CCT PICOFLEX 160MM LONG

3700

H2MXS-5036G

H2MXS-5036G

ASSMANN WSW Components

DIP CBL - HHDM40S/AE50G/X

0

M3DFK-5020K

M3DFK-5020K

3M

IDC CABLE - MKR50K/MC50F/MCF50K

0

SFSD-20-28-H-05.00-SR

SFSD-20-28-H-05.00-SR

Samtec, Inc.

CABLE ASSY SOCKET 40POS 28AWG

1

T1PDT-07-28-GF-06.0-A-T3

T1PDT-07-28-GF-06.0-A-T3

Samtec, Inc.

CBL 1MM 14POS PNL MNT M TO F

0

FFSD-20-D-05.00-01-N

FFSD-20-D-05.00-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSY

22

M3CFK-4040K

M3CFK-4040K

3M

IDC CABLE - MKC40K/MC40F/MCF40K

0

0151360302

0151360302

Woodhead - Molex

MICROCLASP 3 CIRCUIT 150MM

2497

0151340700

0151340700

Woodhead - Molex

PICOBLADE 7 CIRCUIT 50MM

439

C3BBS-5036M

C3BBS-5036M

CW Industries

IDC CABLE - CSR50S/AE50M/CSR50S

0

FFSD-14-D-05.10-01-N

FFSD-14-D-05.10-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

T1PDT-08-28-GF-02.0-A-T3

T1PDT-08-28-GF-02.0-A-T3

Samtec, Inc.

CBL 1MM 16POS PNL MNT M TO F

0

FFSD-10-D-28.00-01-N-R

FFSD-10-D-28.00-01-N-R

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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