Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
T1SD-04-28-GF-02.0-T3

T1SD-04-28-GF-02.0-T3

Samtec, Inc.

CBL ASSY 1MM 8POS M TO F

0

M1AXA-3036R

M1AXA-3036R

3M

IDC CABLE - MSC30A/MC34M/X

0

M3CCA-6060K

M3CCA-6060K

3M

IDC CABLE - MKC60A/MC60F/MKC60A

0

A3CCB-1606M

A3CCB-1606M

TE Connectivity AMP Connectors

IDC CABLE- AKC16B/AE16M/AKC16B

0

FFSD-05-D-04.50-01-N-R

FFSD-05-D-04.50-01-N-R

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

H1BXS-2636G

H1BXS-2636G

ASSMANN WSW Components

IDC CBL - HHSR26H/AE26G/X

0

A1CXB-4436M

A1CXB-4436M

TE Connectivity AMP Connectors

IDC CABLE- AKC44B/AE50M/X

0

H3DDS-1418G

H3DDS-1418G

ASSMANN WSW Components

IDC CBL - HHKR14S/AE14G/HHKR14S

0

FFSD-13-D-09.85-01-N

FFSD-13-D-09.85-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

FFSD-15-D-30.00-01-N

FFSD-15-D-30.00-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

M1CXA-6036R

M1CXA-6036R

3M

IDC CABLE - MKC60A/MC60M/X

0

M1BXK-2436R

M1BXK-2436R

3M

IDC CABLE - MSR24K/MC24M/X

0

M3TKK-4006R

M3TKK-4006R

3M

IDC CABLE - MSD40K/MC40M/MPK40K

0

M3TTK-4006R

M3TTK-4006R

3M

IDC CABLE - MSD40K/MC40M/MSD40K

0

FFSD-20-D-08.75-01-N

FFSD-20-D-08.75-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

A08SUR08SUR32W203B

A08SUR08SUR32W203B

JST

JUMPER 08SUR-32S - 08SUR-32S 8"

861

M3WWK-1606R

M3WWK-1606R

3M

IDC CABLE - MPL16K/MC16M/MPL16K

0

C3AAS-4036M

C3AAS-4036M

CW Industries

IDC CABLE - CSC40S/AE40M/CSC40S

0

M3BBA-3018J

M3BBA-3018J

3M

IDC CABLE - MSR30A/MC34G/MSR30A

0

FFSD-25-D-108.00-01-N

FFSD-25-D-108.00-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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