Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
FFSD-17-D-11.00-01-N

FFSD-17-D-11.00-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

FFSD-20-D-16.53-01-N

FFSD-20-D-16.53-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

H3CKH-2036M

H3CKH-2036M

ASSMANN WSW Components

IDC CBL - HHKC20H/AE20G/HHPK20H

0

C3EEG-4006G

C3EEG-4006G

CW Industries

IDC CABLE - CCE40G/AE40G/CCE40G

0

M300-MC11005M1-0300L

M300-MC11005M1-0300L

Harwin

CBL ASS 3MM M 10POS DUAL 300MM

3

FFSD-05-D-05.50-01-N

FFSD-05-D-05.50-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

9

M3CKK-6040K

M3CKK-6040K

3M

IDC CABLE - MKC60K/MC60F/MPK60K

0

2153271103

2153271103

Woodhead - Molex

MINIFIT JR DR P-P 10 CIRCUIT 600

0

M3AMK-1660K

M3AMK-1660K

3M

IDC CABLE - MSC16K/MC16F/MCG16K

0

M3DFK-4006R

M3DFK-4006R

3M

IDC CABLE - MKR40K/MC40M/MCF40K

0

M3AFK-2018J

M3AFK-2018J

3M

IDC CABLE - MSC20K/MC20G/MCF20K

0

FFSD-17-D-02.40-01-N

FFSD-17-D-02.40-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

FFSD-10-D-05.75-01-N

FFSD-10-D-05.75-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

C8PPG-2436G

C8PPG-2436G

CW Industries

DIP CABLE - CDP24G/AE24G/CDP24G

0

H4PXS-1636M

H4PXS-1636M

ASSMANN WSW Components

DIP CABLE - HDP16S/AE16M/X

0

M3CWK-2618J

M3CWK-2618J

3M

IDC CABLE - MKC26K/MC26G/MPL26K

0

FFSD-05-D-06.70-01-N

FFSD-05-D-06.70-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

FFSD-15-D-03.25-01-N

FFSD-15-D-03.25-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

H3AAS-1436M

H3AAS-1436M

ASSMANN WSW Components

IDC CBL - HHSC14S/AE14M/HHSC14S

0

FFSD-15-D-06.20-01-N

FFSD-15-D-06.20-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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