Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
H8MMS-5036G

H8MMS-5036G

ASSMANN WSW Components

DIP CBL - HHDM40S/AE50G/HHDM50S

0

H3CKH-4006M

H3CKH-4006M

ASSMANN WSW Components

IDC CBL - HHKC40H/AE40M/HHPK40H

0

1451300801

1451300801

Woodhead - Molex

NANO-FIT-TO-NANO-FIT OFF-THE-SHE

80

H3CKH-2006M

H3CKH-2006M

ASSMANN WSW Components

IDC CBL - HHKC20H/AE20G/HHPK20H

0

FFSD-10-D-08.00-01-S-N

FFSD-10-D-08.00-01-S-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

M55-8008042-0300A

M55-8008042-0300A

Harwin

CBL ASSEM 1.27MM 80POS F-F 300MM

15

2153232032

2153232032

Woodhead - Molex

MINIFIT JR SR M-S 3 CIRCUIT 300M

69

M1TXK-4040K

M1TXK-4040K

3M

IDC CABLE - MSD40K/MC40F/X

0

FFSD-10-D-09.00-01-N-RW-R

FFSD-10-D-09.00-01-N-RW-R

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

C0PPS-1606G

C0PPS-1606G

CW Industries

DIP CABLE - CDP16S/AE16G/CDP16S

0

903-0080-000

903-0080-000

ROBOTIS

CABLE ROBOT 4P 100MM 10PCS

27

FFSD-05-D-12.20-01-N

FFSD-05-D-12.20-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

M3AMK-3420K

M3AMK-3420K

3M

IDC CABLE - MSC34K/MC34F/MCG34K

0

FFSD-10-D-06.00-01-F-N

FFSD-10-D-06.00-01-F-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

M3TFK-1006R

M3TFK-1006R

3M

IDC CABLE - MSD10K/MC10M/MCF10K

0

A3DDB-2618M

A3DDB-2618M

TE Connectivity AMP Connectors

IDC CABLE- AKR26B/AE26M/AKR26B

0

C3CPS-1036G

C3CPS-1036G

CW Industries

IDC CABLE - CKC10S/AE10G/CPC10S

0

0151320801

0151320801

Woodhead - Molex

CABLE ASSY PICOLOCK 8 POS 100MM

1945

M3DEK-2618R

M3DEK-2618R

3M

IDC CABLE - MKR26K/MC26M/MCE26K

0

M3TTK-2620K

M3TTK-2620K

3M

IDC CABLE - MSD26K/MC26F/MSD26K

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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