Evaluation, Development Board Enclosures

Image Part Number Description / PDF Quantity Rfq
1873429

1873429

OKdo

WHITE 2-PIECE SLIDE CASE

0

1873431

1873431

OKdo

WHITE 3-PIECE STANDARD CASE

0

1873795

1873795

OKdo

POWER HAT CASE

0

114991667

114991667

Seeed

KITTENBOT MICRO:BIT CASE - SILIC

0

PIS-0497

PIS-0497

Pi Supply

MODMYPI PI ZERO CASE - BLUE

101

PIS-0499

PIS-0499

Pi Supply

MODMYPI PI ZERO CASE - CLEAR

99

JBM-025

JBM-025

Pi Supply

JUSTBOOM DIGI HAT CASE - RED

42

PIS-1443

PIS-1443

Pi Supply

RAKBOX-GW OUTDOOR GATEWAY ENCLOS

11

1873797

1873797

OKdo

BLACK 3-PIECE STANDARD CASE

0

1873430

1873430

OKdo

CLEAR 2-PIECE SLIDE CASE

0

PIS-1441

PIS-1441

Pi Supply

RAKBOX-NT TRACKER ENCLOSURE

10

PRT-14680

PRT-14680

SparkFun

MI:PRO PROTECTOR CASE FOR MICRO:

0

114991668

114991668

Seeed

KITTENBOT MICRO:BIT CASE - SILIC

0

2281

2281

Adafruit

PI PROTECTOR FOR MODEL A+

0

JBM-024

JBM-024

Pi Supply

JUSTBOOM DAC HAT CASE - RED

36

5606-O

5606-O

Kitronik

MI:PRO PROTECTOR CASE FOR THE BB

77

JBM-030

JBM-030

Pi Supply

JUSTBOOM DAC AND AMP CASE - RED

44

FIT0655

FIT0655

DFRobot

COOLING CASE FOR JETSON NANO

28

PRT-15008

PRT-15008

SparkFun

RASPBERRY PI 3 B+ BASEPLATE

0

PIS-0908

PIS-0908

Pi Supply

NESPI CASE+ WITH COOLING FAN, HE

23

Evaluation, Development Board Enclosures

1. Overview

Development board enclosures are protective housings designed to safeguard electronic development boards while enabling functional access. These enclosures provide mechanical protection, electromagnetic interference (EMI) shielding, thermal management, and environmental resistance. They play a critical role in prototyping, industrial automation, IoT deployments, and educational platforms by ensuring reliable operation under various conditions.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Plastic EnclosuresLightweight, cost-effective, insulating propertiesEducational kits, hobbyist projects
Metal EnclosuresSuperior EMI shielding, thermal dissipationIndustrial control systems
Modular EnclosuresCustomizable compartments, tool-less assemblyRapid prototyping environments
IP-Rated EnclosuresWater/dust resistance (IP65-IP67)Outdoor IoT sensors

3. Structure and Components

Typical enclosures consist of: - Base chassis: Provides structural integrity and mounting points - Removable panels: Allow access to interfaces and expansion slots - Heat dissipation features: Ventilation grids or embedded heat sinks - EMI shielding: Conductive gaskets or metalized coatings - Cable management: Strain relief ports and routing channels

4. Key Technical Specifications

ParameterImportance
Material Type (ABS/Aluminum/Steel)Determines weight, durability, and shielding
Dimensional Range (50-500mm)Affects board compatibility
IP Rating (IP54-IP68)Defines environmental protection level
Thermal ResistanceImpacts sustained performance in enclosed spaces
Vibration ResistanceCritical for industrial/automotive applications

5. Application Fields

  • IoT Infrastructure: Smart city sensors (e.g., Raspberry Pi housed in IP67 enclosures)
  • Industrial Automation: PLC control panels with EMI-shielded aluminum cases
  • Medical Devices: Diagnostic equipment development platforms
  • Education: STEM kits with transparent plastic enclosures

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
Raspberry Pi FoundationOfficial Raspberry Pi 4 Enclosure with active cooling
Arduino SAArduino Uno Transparent Plastic Case
EbenIndustrial Metal Enclosure for Jetson Nano
RS ProModular DIN Rail Mount Enclosure

7. Selection Guidelines

Key considerations include: - Board form factor compatibility (e.g., HAT/Shield alignment) - Operating environment (temperature, humidity, vibration) - Required certifications (CE, RoHS) - Expandability for future hardware upgrades - Cost vs. performance trade-offs

8. Industry Trends Analysis

Emerging trends include: - Integration of thermal interface materials (TIMs) in plastic enclosures - Adoption of additive manufacturing for customized geometries - Increased demand for 5G-compatible EMI shielding solutions - Growth of edge computing driving ruggedized enclosure requirements - Sustainability focus driving bio-based polymer enclosures

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