Evaluation, Development Board Enclosures

Image Part Number Description / PDF Quantity Rfq
1593HAMUNOBK

1593HAMUNOBK

Hammond Manufacturing

BOX ABS BLACK 4.38"L X 2.95"W

0

PIS-0157

PIS-0157

Pi Supply

TOUCHSCREEN CASE 7INCH

0

1593HAMEGG1TBK

1593HAMEGG1TBK

Hammond Manufacturing

BOX ABS TRN BLK 5.71"L X 3.94"W

0

DEV-12997

DEV-12997

SparkFun

BOX PLASTIC BLK 3.68"L X 2.47"W

0

PIS-0495

PIS-0495

Pi Supply

MODMYPI PI ZERO CASE - GREEN

0

113070001

113070001

Seeed

CASE PLASTIC CLEAR 3.94"LX2.52"W

0

JBM-009

JBM-009

Pi Supply

JUSTBOOM DAC HAT CASE - BLACK

0

PIM324

PIM324

Pimoroni

HARD:CASE FOR MICRO:BIT

0

JBM-012

JBM-012

Pi Supply

JUSTBOOM DAC ZERO CASE - BLACK

0

1593HAMUNOTBU

1593HAMUNOTBU

Hammond Manufacturing

BOX ABS TRN BLUE 4.38"L X 2.95"W

0

110060037

110060037

Seeed

CASE PLASTIC BEIGE

0

1593HAMEGG1TBU

1593HAMEGG1TBU

Hammond Manufacturing

BOX ABS TRN BLUE 5.71"L X 3.94"W

0

2255

2255

Adafruit

BOX PLASTIC PINK 3.62" LX2.48" W

0

PIM189

PIM189

Pimoroni

CASE PLASTIC MULTIPLE

0

PIM149

PIM149

Pimoroni

CASE PLASTIC BLACK/CLEAR

0

1593HAMPI2CLR

1593HAMPI2CLR

Hammond Manufacturing

BOX ABS TRN CLR 3.88"L X 2.74"W

0

1593HAMPICLR

1593HAMPICLR

Hammond Manufacturing

BOX ABS TRN CLR 4.1"L X 2.59"W

0

114110004

114110004

Seeed

CASE PLASTIC RED

0

1593HAMFREE1BK

1593HAMFREE1BK

Hammond Manufacturing

BOX ABS BLACK 3.63"L X 2.61"W

0

MANGOHRED_ENCLOSURE

MANGOHRED_ENCLOSURE

Sierra Wireless by Talon

MANGOHRED ENCLOSURE

0

Evaluation, Development Board Enclosures

1. Overview

Development board enclosures are protective housings designed to safeguard electronic development boards while enabling functional access. These enclosures provide mechanical protection, electromagnetic interference (EMI) shielding, thermal management, and environmental resistance. They play a critical role in prototyping, industrial automation, IoT deployments, and educational platforms by ensuring reliable operation under various conditions.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Plastic EnclosuresLightweight, cost-effective, insulating propertiesEducational kits, hobbyist projects
Metal EnclosuresSuperior EMI shielding, thermal dissipationIndustrial control systems
Modular EnclosuresCustomizable compartments, tool-less assemblyRapid prototyping environments
IP-Rated EnclosuresWater/dust resistance (IP65-IP67)Outdoor IoT sensors

3. Structure and Components

Typical enclosures consist of: - Base chassis: Provides structural integrity and mounting points - Removable panels: Allow access to interfaces and expansion slots - Heat dissipation features: Ventilation grids or embedded heat sinks - EMI shielding: Conductive gaskets or metalized coatings - Cable management: Strain relief ports and routing channels

4. Key Technical Specifications

ParameterImportance
Material Type (ABS/Aluminum/Steel)Determines weight, durability, and shielding
Dimensional Range (50-500mm)Affects board compatibility
IP Rating (IP54-IP68)Defines environmental protection level
Thermal ResistanceImpacts sustained performance in enclosed spaces
Vibration ResistanceCritical for industrial/automotive applications

5. Application Fields

  • IoT Infrastructure: Smart city sensors (e.g., Raspberry Pi housed in IP67 enclosures)
  • Industrial Automation: PLC control panels with EMI-shielded aluminum cases
  • Medical Devices: Diagnostic equipment development platforms
  • Education: STEM kits with transparent plastic enclosures

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
Raspberry Pi FoundationOfficial Raspberry Pi 4 Enclosure with active cooling
Arduino SAArduino Uno Transparent Plastic Case
EbenIndustrial Metal Enclosure for Jetson Nano
RS ProModular DIN Rail Mount Enclosure

7. Selection Guidelines

Key considerations include: - Board form factor compatibility (e.g., HAT/Shield alignment) - Operating environment (temperature, humidity, vibration) - Required certifications (CE, RoHS) - Expandability for future hardware upgrades - Cost vs. performance trade-offs

8. Industry Trends Analysis

Emerging trends include: - Integration of thermal interface materials (TIMs) in plastic enclosures - Adoption of additive manufacturing for customized geometries - Increased demand for 5G-compatible EMI shielding solutions - Growth of edge computing driving ruggedized enclosure requirements - Sustainability focus driving bio-based polymer enclosures

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