Evaluation, Development Board Enclosures

Image Part Number Description / PDF Quantity Rfq
FIT0604

FIT0604

DFRobot

ABS TRANSPARENT CASE FOR RASPBER

0

5606-B

5606-B

Kitronik

MI:PRO PROTECTOR CASE FOR THE BB

0

FIT0533

FIT0533

DFRobot

MICRO:BIT ENCLOSURE (LEGO COMPAT

0

FIT0460

FIT0460

DFRobot

BOX ALUMINUM BLACK 4.92"LX3.43"W

0

2280

2280

Adafruit

PI BOX PLUS ENCLOSURE MODEL A+

0

MIKROE-1351

MIKROE-1351

MikroElektronika

CASING GRAY READY FOR XMEGA BD

0

FIT0602

FIT0602

DFRobot

ABS TRANSPARENT CASE FOR RASPBER

0

1873428

1873428

OKdo

CLEAR 3-PIECE STANDARD CASE

0

JBM-029

JBM-029

Pi Supply

JUSTBOOM AMP ZERO CASE - RED

45

110991324

110991324

Seeed

RASPBERRY PI 9 LAYERS ACRYLIC CA

0

PIS-0911

PIS-0911

Pi Supply

SNESPI CASE FOR RASPBERRY PI 3 (

18

110991325

110991325

Seeed

RASPBERRY PI BROWN SINGLE LAYER

0

3931

3931

Adafruit

FLANGED WEATHERPROOF ENCLOSURE W

0

110991304

110991304

Seeed

ACRYLIC CASE FOR ROCK PI 4

0

JBM-026

JBM-026

Pi Supply

JUSTBOOM AMP HAT CASE - RED

45

FIT0631

FIT0631

DFRobot

ALUMINUM ALLOY PASSIVE COOLING C

8

JBM-028

JBM-028

Pi Supply

JUSTBOOM DIGI ZERO CASE - RED

40

AS7265XDEMOKITHOUSING

AS7265XDEMOKITHOUSING

ams

AS7265X DEMO KIT HOUSING

0

PIS-1442

PIS-1442

Pi Supply

RAKBOX-NTS TRACKER ENCLOSURE WIT

9

5606-G

5606-G

Kitronik

MI:PRO PROTECTOR CASE FOR THE BB

0

Evaluation, Development Board Enclosures

1. Overview

Development board enclosures are protective housings designed to safeguard electronic development boards while enabling functional access. These enclosures provide mechanical protection, electromagnetic interference (EMI) shielding, thermal management, and environmental resistance. They play a critical role in prototyping, industrial automation, IoT deployments, and educational platforms by ensuring reliable operation under various conditions.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Plastic EnclosuresLightweight, cost-effective, insulating propertiesEducational kits, hobbyist projects
Metal EnclosuresSuperior EMI shielding, thermal dissipationIndustrial control systems
Modular EnclosuresCustomizable compartments, tool-less assemblyRapid prototyping environments
IP-Rated EnclosuresWater/dust resistance (IP65-IP67)Outdoor IoT sensors

3. Structure and Components

Typical enclosures consist of: - Base chassis: Provides structural integrity and mounting points - Removable panels: Allow access to interfaces and expansion slots - Heat dissipation features: Ventilation grids or embedded heat sinks - EMI shielding: Conductive gaskets or metalized coatings - Cable management: Strain relief ports and routing channels

4. Key Technical Specifications

ParameterImportance
Material Type (ABS/Aluminum/Steel)Determines weight, durability, and shielding
Dimensional Range (50-500mm)Affects board compatibility
IP Rating (IP54-IP68)Defines environmental protection level
Thermal ResistanceImpacts sustained performance in enclosed spaces
Vibration ResistanceCritical for industrial/automotive applications

5. Application Fields

  • IoT Infrastructure: Smart city sensors (e.g., Raspberry Pi housed in IP67 enclosures)
  • Industrial Automation: PLC control panels with EMI-shielded aluminum cases
  • Medical Devices: Diagnostic equipment development platforms
  • Education: STEM kits with transparent plastic enclosures

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
Raspberry Pi FoundationOfficial Raspberry Pi 4 Enclosure with active cooling
Arduino SAArduino Uno Transparent Plastic Case
EbenIndustrial Metal Enclosure for Jetson Nano
RS ProModular DIN Rail Mount Enclosure

7. Selection Guidelines

Key considerations include: - Board form factor compatibility (e.g., HAT/Shield alignment) - Operating environment (temperature, humidity, vibration) - Required certifications (CE, RoHS) - Expandability for future hardware upgrades - Cost vs. performance trade-offs

8. Industry Trends Analysis

Emerging trends include: - Integration of thermal interface materials (TIMs) in plastic enclosures - Adoption of additive manufacturing for customized geometries - Increased demand for 5G-compatible EMI shielding solutions - Growth of edge computing driving ruggedized enclosure requirements - Sustainability focus driving bio-based polymer enclosures

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