Static Control Shielding Bags, Materials

Part Number	Description / PDF	Quantity
B13033 Botron Company Inc.	B13033 CLEAR SILVER SHIELD-IT ME	849
BG-0406 Bertech	4 INCH X 6 INCH ESD BAGS	15
13775 EMIT	MST BARRIER 18X20" 6.5MIL 100PK	8
48704 Protektive Pak	BG STTSHLD 8X10" 100EA	420
13768 EMIT	BAG EMI/RFI MVB 6MIL 15X18	95
817R 36X50 SCS	STAT SHIELD WRAP MTL IN 36"X50'	1
DY3650-628-2S-10X14IN-H127 Dou Yee Enterprises	BAG STATIC SHLD MTL 10X14" 1=100	279999
BG-1216 Bertech	12 INCH X 16 INCH ESD BAGS	25
13447 EMIT	BAG SHIELD METAL-IN 6X18	56
81744 SCS	STATIC SHIELD BAG 4X4 1=1EA	5540
B131014 Botron Company Inc.	B131014 CLEAR SILVER SHIELD-IT M	3590
2126R 24X125 SCS	WRAP SHIELD CUSHIONED 2X125 FT	6
13725 EMIT	BAG SHLD MET-IN ZIP 18X24	14
10098 SCS	BAG STATIC SHLD MTL IN 8"X9"	0
13205 EMIT	BAG SHLD METAL-OUT ZIP 3X5	342
10034 SCS	STATIC SHIELDING BAG IN 3"X4"	0
003-0012 E S D Control Centre Ltd.	Pink ESD Bags Grip Seal 6"X10"	92
MI1824 ACL Staticide, Inc.	OPEN METAL-IN STATIC SHIELDING B	30
48757 Protektive Pak	BG STTSHLD 12X18" 100EA	22
D271416 SCS	BAG MOIST BARR DUAL LAYER 16X14"	0

Static Control Shielding Bags, Materials

1. Overview

Static control shielding bags and materials are specialized packaging solutions designed to protect sensitive electronic components from electrostatic discharge (ESD), electromagnetic interference (EMI), and environmental contaminants. These products are critical in industries where electrostatic sensitive devices (ESDS) require protection during storage, handling, and transportation. Their importance has grown exponentially with the miniaturization of electronic circuits and the increasing prevalence of high-speed semiconductor devices.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
Metal-in-Film Shielding Bags	Multi-layer construction with aluminum/polymer layers for EMI/RFI shielding and ESD protection	IC packaging, PCB transport
Conductive Polyethylene Bags	Carbon-loaded plastic with surface resistance 10 -10	Low-voltage electronics packaging
Anti-Static Barrier Materials	Multi-layer films with static decay <2s and low particle emission	Medical device packaging
EMI/RFI Shielding Gaskets	Conductive elastomers with shielding effectiveness >60dB	Aerospace equipment enclosures

3. Structure and Composition

Typical shielding bags employ a 3-5 layer construction:

Outer layer: PET or nylon for mechanical protection
Conductive layer: Aluminum coating (0.02-0.05mm)
Dielectric layer: Polyethylene terephthalate (PET)
ESD dissipative inner layer: Carbon-loaded polymer or conductive adhesive

Advanced materials incorporate nanotechnology coatings (e.g., silver nanowires) for improved shielding performance while maintaining optical transparency.

4. Key Technical Parameters

Parameter	Typical Value	Importance
Shielding Effectiveness	30-100 dB (100kHz-10GHz)	Protects against EMI/RFI interference
Surface Resistance	10 -10 /sq	Determines ESD dissipation rate
Charge Decay Time	<2 seconds	Time to neutralize 1kV charge
Particle Emission	<10 particles/ft (ISO Class 4)	Cleanroom compatibility

5. Application Fields

Key industries include:

Semiconductor manufacturing (wafer transport, die packaging)
Aerospace (avionics component protection)
Medical devices (implantable electronics packaging)
Data centers (server hardware transportation)

Typical equipment protected: ICs (CSP/BGA packages), MEMS sensors, RF modules, optical transceivers.

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
Desco Industries	Alpha Shield III	3-layer metalized film, 50dB shielding
3M	ESD Shielding Bag 3600	Transparent EMI shielding, 10 surface resistance
Able Electropolish	EMI-STAT	Stainless steel fiber composite, 80dB performance

7. Selection Guidelines

Key selection factors:

ESDS sensitivity level (voltage tolerance of protected device)
Environmental conditions (temperature, humidity, contamination level)
Shielding frequency range requirements
Material compatibility (outgassing characteristics for vacuum environments)
Compliance with industry standards (ANSI/ESD S541, MIL-PRF-81705E)

Case study: A semiconductor fab achieved 98% defect reduction by switching to metal-in-film bags with <1s charge decay time for 28nm node wafer transport.

8. Industry Trends

Emerging trends include:

Development of resealable smart packaging with integrated ESD monitoring
Graphene-based composite materials for lighter weight shielding
Nano-coating technologies enabling transparent EMI protection
Increased adoption of IPC-J-STD-033D compliant moisture barrier packaging
Growth in demand for flexible hybrid shielding solutions combining conductive polymers with metal meshes

Market projections indicate 6.2% CAGR through 2027 driven by 5G infrastructure and automotive electronics growth.