Static Control Shielding Bags, Materials

Part Number	Description / PDF	Quantity
003-0004 E S D Control Centre Ltd.	Pink ESD Bags Grip Seal 10"X12"	58
8171212 SCS	STAT SHLD BAG MTL IN 12X12 1=1EA	180
1002.53 SCS	BAG STATIC SHLD MTL IN 3"X2.5"	0
001-0028 E S D Control Centre Ltd.	PINK ESD BAG OPEN TOP 12"X18"	25
13080 EMIT	BAG SHIELD METAL-OUT 10X14	151
DY3700-628-ZB-10X12IN-H128 Dou Yee Enterprises	BAG STATIC SHLD MTL 10X12" 1=100	14399
300810 SCS	BAG STATIC ZIP-TOP 8X10" 1=1EA	10286525
1003338 SCS	BAG STATIC SHLD MTL IN 38"X33"	0
7001820 SCS	BAG MOIST BARR DUAL LAYER 20X18"	0
817Z44 SCS	STATIC SHIELD BAG ZIP 4X4 1=1EA	4255
1501818 SCS	STATIC BAG MET-OUT 18"X18" 1=1EA	0
2301823 SCS	BAG STATIC SHLD MTL OUT 23"X18"	5
13446 EMIT	BAG SHIELD METAL-IN 6X16	106
D302620 SCS	BAG MOISTURE BARR MTL IN 20"X26"	0
1502424 SCS	BAG STAT SHLD MTLOUT 24X24"1=1EA	99
13879 EMIT	BAG STATIC DISSIPATIVE 3X5	100777
2301415 SCS	BAG STATIC CUSH METAL IN 15"X14"	909
13520 EMIT	BAG SHIELD METAL-IN 18X18	18
7001216 SCS	BAG STATIC/MOISTURE 12X16" 1=1EA	247083
B13810 Botron Company Inc.	B13810 CLEAR SILVER SHIELD-IT ME	2090

Static Control Shielding Bags, Materials

1. Overview

Static control shielding bags and materials are specialized packaging solutions designed to protect sensitive electronic components from electrostatic discharge (ESD), electromagnetic interference (EMI), and environmental contaminants. These products are critical in industries where electrostatic sensitive devices (ESDS) require protection during storage, handling, and transportation. Their importance has grown exponentially with the miniaturization of electronic circuits and the increasing prevalence of high-speed semiconductor devices.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
Metal-in-Film Shielding Bags	Multi-layer construction with aluminum/polymer layers for EMI/RFI shielding and ESD protection	IC packaging, PCB transport
Conductive Polyethylene Bags	Carbon-loaded plastic with surface resistance 10 -10	Low-voltage electronics packaging
Anti-Static Barrier Materials	Multi-layer films with static decay <2s and low particle emission	Medical device packaging
EMI/RFI Shielding Gaskets	Conductive elastomers with shielding effectiveness >60dB	Aerospace equipment enclosures

3. Structure and Composition

Typical shielding bags employ a 3-5 layer construction:

Outer layer: PET or nylon for mechanical protection
Conductive layer: Aluminum coating (0.02-0.05mm)
Dielectric layer: Polyethylene terephthalate (PET)
ESD dissipative inner layer: Carbon-loaded polymer or conductive adhesive

Advanced materials incorporate nanotechnology coatings (e.g., silver nanowires) for improved shielding performance while maintaining optical transparency.

4. Key Technical Parameters

Parameter	Typical Value	Importance
Shielding Effectiveness	30-100 dB (100kHz-10GHz)	Protects against EMI/RFI interference
Surface Resistance	10 -10 /sq	Determines ESD dissipation rate
Charge Decay Time	<2 seconds	Time to neutralize 1kV charge
Particle Emission	<10 particles/ft (ISO Class 4)	Cleanroom compatibility

5. Application Fields

Key industries include:

Semiconductor manufacturing (wafer transport, die packaging)
Aerospace (avionics component protection)
Medical devices (implantable electronics packaging)
Data centers (server hardware transportation)

Typical equipment protected: ICs (CSP/BGA packages), MEMS sensors, RF modules, optical transceivers.

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
Desco Industries	Alpha Shield III	3-layer metalized film, 50dB shielding
3M	ESD Shielding Bag 3600	Transparent EMI shielding, 10 surface resistance
Able Electropolish	EMI-STAT	Stainless steel fiber composite, 80dB performance

7. Selection Guidelines

Key selection factors:

ESDS sensitivity level (voltage tolerance of protected device)
Environmental conditions (temperature, humidity, contamination level)
Shielding frequency range requirements
Material compatibility (outgassing characteristics for vacuum environments)
Compliance with industry standards (ANSI/ESD S541, MIL-PRF-81705E)

Case study: A semiconductor fab achieved 98% defect reduction by switching to metal-in-film bags with <1s charge decay time for 28nm node wafer transport.

8. Industry Trends

Emerging trends include:

Development of resealable smart packaging with integrated ESD monitoring
Graphene-based composite materials for lighter weight shielding
Nano-coating technologies enabling transparent EMI protection
Increased adoption of IPC-J-STD-033D compliant moisture barrier packaging
Growth in demand for flexible hybrid shielding solutions combining conductive polymers with metal meshes

Market projections indicate 6.2% CAGR through 2027 driven by 5G infrastructure and automotive electronics growth.