Static Control Device Containers

Image	Part Number	Description / PDF	Quantity	Rfq
	37507 EMIT	STORAG CONT 22-7/8X12-7/8X18-1/4	0
	37792 EMIT	TUBE HANDLER ESD 12X12X20	0
	37168 EMIT	ESD HANDLER 11-1/4X4-3/4X1-3/4	0
	37166 EMIT	ESD HANDLER 11-1/4X14-3/4X1-3/4	0
	38519 EMIT	CIRCUIT BD SHPR EECCOO 19X19X3	0
	38554 EMIT	BOX OPEN BIN 12X6"X4-1/2	0
	37522 EMIT	STORAGE CONT 18-3/8X12-3/8X8-3/4	0
	38562 EMIT	BOX OPEN BIN 24-3/4X6-1/4X4-1/2	0
	37175 EMIT	ESD HANDLER 12-5/8X7-1/8X2-3/8	0
	37511 EMIT	STORAGE CONTAINER 17X13X6-3/4	0
	37178 EMIT	ESD HANDLER 12-5/8X7-1/8X1	0
	38567 EMIT	BOX OPEN BIN 24X12X6-3/8	0
	37770 EMIT	TEK-CABINET 30DRAWR 13-3/16X6X10	0
	38511 EMIT	CIRCUIT BD SHPR 16X12-1/4X3-1/2	0
	37510 EMIT	STORAGE CONTAINER 17X13X14-3/4	0
	37319 EMIT	ESD HANDLER 17-1/8X16X1	0
	37169 EMIT	ESD HANDLER 11-1/4X2-1/4X1-3/4	0
	37167 EMIT	ESD HANDLER 11-1/4X7-1/4X1-3/4	0
	37325 EMIT	ESD HANDLER 10-3/4X16X2-1/4	0
	37313 EMIT	ESD HANDLER 14-3/4X7-3/4X1	0

Static Control Device Containers

1. Overview

Static Control Device Containers are specialized enclosures designed to store, transport, or manage electrostatic discharge (ESD)-sensitive devices. They mitigate risks of ESD damage in environments like semiconductor manufacturing, electronics assembly, and cleanrooms. These containers integrate materials and designs that neutralize static charges, prevent particle contamination, and ensure compliance with international standards (e.g., IEC 61340-5-1). Their importance is critical in modern technologies where microelectronics and nanoscale components are vulnerable to sub-micron particulates and electrostatic fields.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Conductive Polymer Containers	Surface resistivity 10 10 , permanent charge dissipation	IC trays in SMT lines
Antistatic Coated Containers	Surface resistivity 10 10 , temporary ESD protection	PCB storage in R&D labs
Ionization-Integrated Units	Active neutralization of isolated charges via corona discharge	Wafer handling in Class 10 cleanrooms
Faraday Cage Containers	Electromagnetic shielding attenuation >60dB	Military/aerospace component storage

3. Structure and Components

Typical construction includes: - Base Material: Carbon-loaded polypropylene or dissipative ABS polymer - Shielding Layer: Sputtered aluminum coating (thickness 50 200nm) - ESD Mechanism: Embedded carbon nanotube networks or quaternary ammonium compounds - Containment Design: Interlocking lids with gasket seals (particulate retention >99.97% at 0.3 m) - Grounding Interface: 10mm diameter brass stud with <4 resistance

4. Key Technical Specifications

Parameter	Value/Range	Significance
Surface Resistance	10 10 /sq	Determines charge dissipation rate
Decay Time	0.5 seconds @ 1kV	Measures static neutralization efficiency
Shielding Effectiveness	30 100MHz: >40dB	Protects against electromagnetic interference
Particulate Emission	<10 particles/ft >0.5 m	Ensures cleanroom compliance

5. Application Fields

Primary industries include: - Semiconductor manufacturing (e.g., AMAT Centura platforms) - Medical device assembly (ISO 14644-1 certified facilities) - Aerospace electronics (MIL-PRF-81705D compliant systems) - Data centers (server rack ESD control) - Precision optics (particle-sensitive lens handling)

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Feature
3M Electronic Solutions	SCD-450X	Self-ionizing polymer matrix
Omega Engineering	ESD-COMB2023	Integrated humidity control
Snap-on Industrial	TST-7800PRO	Modular Faraday cage design
LPKF Laser Electronics	CAD-KIT2	Customizable conductive dividers

7. Selection Recommendations

Key considerations: - Environmental operating range (-40 C to +125 C for automotive applications) - Load capacity (static vs. dynamic storage needs) - Regulatory compliance (JEDEC J-STD-033D, ANSI/ESD S541) - Integration with automated handling systems (SEMI E14-0703 compatibility) - Total cost of ownership (cleaning/maintenance intervals)

8. Industry Trends

Current developments focus on: - Nanocomposite materials with graphene-enhanced conductivity - IoT-enabled containers with real-time ESD monitoring - Biodegradable antistatic polymers for RoHS compliance - AI-driven charge prediction algorithms - Miniaturization for 3nm process node component handling

9. Case Study: Semiconductor Production

A 12-inch wafer fabrication plant implemented ionization-integrated containers, achieving 99.3% reduction in ESD-related yield loss. The solution incorporated self-diagnostic sensors meeting SEMI E121-0602 standards, with automated reporting to the facility's MES system.