| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
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EMIT |
CIRCUIT BD SHPR EECCOO 7X5X2-1/2 |
0 |
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EMIT |
CIRCUIT BD SHPR EECCOO 9X9X1-1/2 |
0 |
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EMIT |
ESD HANDLER 10-3/4X7-3/4X2-1/4 |
0 |
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EMIT |
ESD HANDLER 6-3/4X14-5/8X2-3/8 |
0 |
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EMIT |
ESD HANDLER 10-3/4X4-5/8X2-3/8 |
0 |
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EMIT |
ESD HANDLER 6-3/4X4-5/8X2-3/8 |
0 |
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EMIT |
ESD HANDLER 10-3/4X7-3/4X2-1/5 |
0 |
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EMIT |
BOX OPEN BIN 12X8X4-1/2 |
0 |
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EMIT |
CARRIER LEAD CHIP 4-5/16X 4-5/16 |
0 |
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EMIT |
ESD HANDLER 18-1/4X20X2-1/4 |
0 |
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EMIT |
ESD HANDLER 14-3/4X16X2-1/4 |
0 |
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EMIT |
ESD HANDLER 11-1/4X7-1/4X3/4 |
0 |
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EMIT |
CIRCUIT BD SHPR EECCOO 7X7X1-1/2 |
0 |
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EMIT |
CIRCUIT BD SHPR 27-3/8X24-3/8X4 |
0 |
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EMIT |
BOX OPEN BIN 18X12X4-1/2 |
0 |
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EMIT |
CIRC BD SHPR 20-1/2X15-1/2X1-1/2 |
0 |
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EMIT |
ESD HANDLER 10-3/4X7-1/8X1 |
0 |
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EMIT |
ESD HANDLER 6-3/4X7-3/4X1 |
0 |
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EMIT |
CIRC BD SHPR 15-1/2X12-1/2X1-1/2 |
0 |
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EMIT |
BOX OPEN BIN 5-3/4X3-3/4X2-11/16 |
0 |
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Static Control Device Containers are specialized enclosures designed to store, transport, or manage electrostatic discharge (ESD)-sensitive devices. They mitigate risks of ESD damage in environments like semiconductor manufacturing, electronics assembly, and cleanrooms. These containers integrate materials and designs that neutralize static charges, prevent particle contamination, and ensure compliance with international standards (e.g., IEC 61340-5-1). Their importance is critical in modern technologies where microelectronics and nanoscale components are vulnerable to sub-micron particulates and electrostatic fields.
| Type | Functional Features | Application Examples |
|---|---|---|
| Conductive Polymer Containers | Surface resistivity 10 10 , permanent charge dissipation | IC trays in SMT lines |
| Antistatic Coated Containers | Surface resistivity 10 10 , temporary ESD protection | PCB storage in R&D labs |
| Ionization-Integrated Units | Active neutralization of isolated charges via corona discharge | Wafer handling in Class 10 cleanrooms |
| Faraday Cage Containers | Electromagnetic shielding attenuation >60dB | Military/aerospace component storage |
Typical construction includes: - Base Material: Carbon-loaded polypropylene or dissipative ABS polymer - Shielding Layer: Sputtered aluminum coating (thickness 50 200nm) - ESD Mechanism: Embedded carbon nanotube networks or quaternary ammonium compounds - Containment Design: Interlocking lids with gasket seals (particulate retention >99.97% at 0.3 m) - Grounding Interface: 10mm diameter brass stud with <4 resistance
| Parameter | Value/Range | Significance |
|---|---|---|
| Surface Resistance | 10 10 /sq | Determines charge dissipation rate |
| Decay Time | 0.5 seconds @ 1kV | Measures static neutralization efficiency |
| Shielding Effectiveness | 30 100MHz: >40dB | Protects against electromagnetic interference |
| Particulate Emission | <10 particles/ft >0.5 m | Ensures cleanroom compliance |
Primary industries include: - Semiconductor manufacturing (e.g., AMAT Centura platforms) - Medical device assembly (ISO 14644-1 certified facilities) - Aerospace electronics (MIL-PRF-81705D compliant systems) - Data centers (server rack ESD control) - Precision optics (particle-sensitive lens handling)
| Manufacturer | Representative Product | Key Feature |
|---|---|---|
| 3M Electronic Solutions | SCD-450X | Self-ionizing polymer matrix |
| Omega Engineering | ESD-COMB2023 | Integrated humidity control |
| Snap-on Industrial | TST-7800PRO | Modular Faraday cage design |
| LPKF Laser Electronics | CAD-KIT2 | Customizable conductive dividers |
Key considerations: - Environmental operating range (-40 C to +125 C for automotive applications) - Load capacity (static vs. dynamic storage needs) - Regulatory compliance (JEDEC J-STD-033D, ANSI/ESD S541) - Integration with automated handling systems (SEMI E14-0703 compatibility) - Total cost of ownership (cleaning/maintenance intervals)
Current developments focus on: - Nanocomposite materials with graphene-enhanced conductivity - IoT-enabled containers with real-time ESD monitoring - Biodegradable antistatic polymers for RoHS compliance - AI-driven charge prediction algorithms - Miniaturization for 3nm process node component handling
A 12-inch wafer fabrication plant implemented ionization-integrated containers, achieving 99.3% reduction in ESD-related yield loss. The solution incorporated self-diagnostic sensors meeting SEMI E121-0602 standards, with automated reporting to the facility's MES system.