Clean Room Treatments, Cleaners, Wipes

Image Part Number Description / PDF Quantity Rfq
8243-W

8243-W

MG Chemicals

CLEANING CLOTH LENSES OPTICS

0

CP420E

CP420E

ITW Chemtronics (Chemtronics)

CLEANER LUBRICANT ELECT 50PCS

0

7001FFS

7001FFS

ACL Staticide, Inc.

HAND LOTION ESD DISSIPATE FF 1OZ

0

10444

10444

EMIT

FLOOR MAT CLEANER 2.5G BOX

0

4KDES500

4KDES500

SCS

4 U KRAFT DESI 500/DRUM

0

145284-3

145284-3

iFixit

MICROFIBER CLEANING CLOTHS / NEW

0

55656

55656

3M

EASY II HOLDER REPLACEMENT MATER

0

06839

06839

3M

3M BOOTH COATING IS A WATER-

0

8281-50

8281-50

MG Chemicals

CLEANING CLOTH GEN PURPOSE 50PCS

0

13842

13842

EMIT

DESICCANT PAK 500 UNIT

0

10434

10434

EMIT

CLEANER FLOOR MATS 16OX BOTTLE-4

0

1KDES300

1KDES300

SCS

1 UNIT KRAFT DESI 300/PAIL

0

10561

10561

EMIT

CLNR FLR NTRL STTGRD 2.5GAL BOX

0

8241-W

8241-W

MG Chemicals

WIPES PRE-SAT ELECTRONICS

0

06837

06837

3M

DUST CONTROL SPRAY 1GAL

0

81030

81030

EMIT

FINISH FLOOR STATFREE 55GAL

0

10601

10601

EMIT

WIPES ANTISTATC CAN OF 60, 12 CT

0

CL630

CL630

3M

CLEANER NOTEBOOK SCREEN CLEANING

0

81080

81080

EMIT

LOTION HAND REZTORE 12 8OZ

0

81071

81071

EMIT

PROTECT STATGUARD CARPET 1GAL

0

Clean Room Treatments, Cleaners, Wipes

1. Overview

Cleanroom products are specialized materials designed to maintain contamination control in controlled environments. Static control and ESD (Electrostatic Discharge) protection products prevent damage from static electricity, while cleanroom treatments, cleaners, and wipes ensure particulate and microbial contamination removal. These products are critical in semiconductor manufacturing, pharmaceuticals, aerospace, and biotechnology industries where nanoscale precision and sterility are required.

2. Main Types and Functional Classification

TypeFunctionalityApplications
ESD MatsDissipate static charges from personnel/equipmentElectronics assembly lines
IonizersNeutralize static charges in non-conductive materialsPhotolithography processes
Conductive WipesRemove particles while preventing static buildupOptical component cleaning
pH-Neutral CleanersRemove organic/inorganic contaminants without surface damageMedical device manufacturing

3. Structure and Composition

Cleanroom wipes typically use nonwoven synthetic fibers (e.g., polyester, nylon) with edge-binding technology to prevent fiber shedding. Cleaners contain deionized water, surfactants, and chelating agents. ESD products incorporate conductive polymers or carbon additives. Surface treatments often use perfluoropolyether (PFPE) coatings for low particle adhesion.

4. Key Technical Specifications

ParameterRequirementSignificance
Surface Resistivity10^6-10^9 /sqESD protection efficiency
Particle Release<1000 particles 0.5 m/cm Cleanroom classification compliance
Non-Volatile Residue<1mg/m Prevents optical/electronic interference
pH Range5.5-7.5Material compatibility assurance

5. Application Areas

  • Semiconductor: Wafer handling, photomask cleaning
  • Pharmaceutical: Aseptic filling line maintenance
  • Aerospace: Precision sensor contamination control
  • Medical Devices: ISO Class 7 cleanroom operations

6. Leading Manufacturers

ManufacturerKey ProductFeatures
3MScotch-Wel ESD WipesCarbon-impregnated polyester matrix
HoneywellMaxGuard Cleanroom CleanerLow VOC, fast-evaporating formula
Kimberly-ClarkKimWipes CR-TX10099.99% particle removal efficiency

7. Selection Guidelines

Consider chemical compatibility with target surfaces, required cleanliness class (ISO 14644-1), ESD protection level (IEC 61340-5-1), and regulatory certifications (FDA, REACH). For critical processes, perform particle extraction testing using scanning electron microscopy.

8. Industry Trends

Key developments include: - Nanoparticle-enhanced cleaning formulations - Self-diagnostics ESD materials with embedded sensors - Biodegradable wipes using polylactic acid (PLA) - AI-powered contamination monitoring systems integration

Case Study: In a 5nm semiconductor fab, implementation of PFPE-coated wipes reduced particle defects by 47% while maintaining surface resistivity below 10^8 /sq.

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