Clean Room Treatments, Cleaners, Wipes

Image Part Number Description / PDF Quantity Rfq
HANDPAD

HANDPAD

Panduit Corporation

CLOTH ELECTRONICS

0

10445

10445

EMIT

FLOOR MAT CLEANER 5G BOX

0

8242-RTF

8242-RTF

MG Chemicals

WIPES PRE-SAT SCREENS 50 PIECES

0

16KDES150

16KDES150

SCS

16 UNIT KRAFT DESI 150/DRUM

0

829-50

829-50

MG Chemicals

TWILLWIPES 9X9" 100% COTTON

0

2KDES800

2KDES800

SCS

2 U KRAFT DESI 800/DRUM

0

830-33390

830-33390

MG Chemicals

CLEANROOM WIPES CL4 9X9 100CT

0

830-34623

830-34623

MG Chemicals

WIPES ELECTRONICS 560 PIECES

0

46030

46030

EMIT

CLNR FLR NTRL STTGRD 2.5GAL BOX

0

830-06179

830-06179

MG Chemicals

CLEANROOM WIPES CL5 9X9 100CT

0

81070

81070

EMIT

PROTECT STATGUARD CARPET 1QT

0

81081

81081

EMIT

LOTION HAND REZTORE 1 GAL PUMP

0

830-41048

830-41048

MG Chemicals

WIPES ELECTRONICS 80 PIECES

0

13852

13852

EMIT

DESICCANT 1 UNIT PAIL OF 300PCS

0

ES567

ES567

ITW Chemtronics (Chemtronics)

FLOOR FINISH ANISTATIC 5 GAL

0

6259BESD

6259BESD

ITW Chemtronics (Chemtronics)

WIPES DRY CRITICAL TASKS 4 BAGS

0

830-91371

830-91371

MG Chemicals

WIPES PRE-SAT ELECTRONICS 75PCS

0

60929

60929

3M

HE FLTR MRCY VAPOR CHLORINE CART

0

2KDES150

2KDES150

SCS

DESICCANT 2 UNIT 150/PAIL

0

8072

8072

ACL Staticide, Inc.

CLEANER FOAM FOR GLASS&PLASTIC

0

Clean Room Treatments, Cleaners, Wipes

1. Overview

Cleanroom products are specialized materials designed to maintain contamination control in controlled environments. Static control and ESD (Electrostatic Discharge) protection products prevent damage from static electricity, while cleanroom treatments, cleaners, and wipes ensure particulate and microbial contamination removal. These products are critical in semiconductor manufacturing, pharmaceuticals, aerospace, and biotechnology industries where nanoscale precision and sterility are required.

2. Main Types and Functional Classification

TypeFunctionalityApplications
ESD MatsDissipate static charges from personnel/equipmentElectronics assembly lines
IonizersNeutralize static charges in non-conductive materialsPhotolithography processes
Conductive WipesRemove particles while preventing static buildupOptical component cleaning
pH-Neutral CleanersRemove organic/inorganic contaminants without surface damageMedical device manufacturing

3. Structure and Composition

Cleanroom wipes typically use nonwoven synthetic fibers (e.g., polyester, nylon) with edge-binding technology to prevent fiber shedding. Cleaners contain deionized water, surfactants, and chelating agents. ESD products incorporate conductive polymers or carbon additives. Surface treatments often use perfluoropolyether (PFPE) coatings for low particle adhesion.

4. Key Technical Specifications

ParameterRequirementSignificance
Surface Resistivity10^6-10^9 /sqESD protection efficiency
Particle Release<1000 particles 0.5 m/cm Cleanroom classification compliance
Non-Volatile Residue<1mg/m Prevents optical/electronic interference
pH Range5.5-7.5Material compatibility assurance

5. Application Areas

  • Semiconductor: Wafer handling, photomask cleaning
  • Pharmaceutical: Aseptic filling line maintenance
  • Aerospace: Precision sensor contamination control
  • Medical Devices: ISO Class 7 cleanroom operations

6. Leading Manufacturers

ManufacturerKey ProductFeatures
3MScotch-Wel ESD WipesCarbon-impregnated polyester matrix
HoneywellMaxGuard Cleanroom CleanerLow VOC, fast-evaporating formula
Kimberly-ClarkKimWipes CR-TX10099.99% particle removal efficiency

7. Selection Guidelines

Consider chemical compatibility with target surfaces, required cleanliness class (ISO 14644-1), ESD protection level (IEC 61340-5-1), and regulatory certifications (FDA, REACH). For critical processes, perform particle extraction testing using scanning electron microscopy.

8. Industry Trends

Key developments include: - Nanoparticle-enhanced cleaning formulations - Self-diagnostics ESD materials with embedded sensors - Biodegradable wipes using polylactic acid (PLA) - AI-powered contamination monitoring systems integration

Case Study: In a 5nm semiconductor fab, implementation of PFPE-coated wipes reduced particle defects by 47% while maintaining surface resistivity below 10^8 /sq.

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