Clean Room Swabs and Brushes

Image Part Number Description / PDF Quantity Rfq
WA7HHG

WA7HHG

APPLICATOR: HH FILL; WOOD HNDL

0

869904HH

869904HH

BLOCK BRUSH; HH FILL; WOOD BASE

0

906501

906501

INSTR CLNR; STR SS FILL; PLAS HD

0

36060

36060

ITW Chemtronics (Chemtronics)

SWAB SGL HEAD POLY KNIT 2500PC

0

PTA610

PTA610

1" CHIP BRUSH; POLY FILL; PL HDL

0

44964

44964

SIZE 4 CON NY STRIP BRUSH, 3" HT

0

814-50

814-50

MG Chemicals

SWAB FOAM RECTANGULAR HEAD 50PCS

74

25123X

25123X

ITW Chemtronics (Chemtronics)

SWAB SGL HEAD 6" 5-100PC BAGS

0

403BG

403BG

SCRATCH BRUSH; BRASS FILL; WD HD

0

CS25

CS25

ITW Chemtronics (Chemtronics)

FOAM SWAB PRESATURATED 25 PCS

101

80998

80998

SIZE 7 CON NY STRIP BRUSH, 6" HT

0

0036-06000

0036-06000

SIZE 6 TAKLON RD ARTIST; WOOD HD

0

EB14TI

EB14TI

END BRUSH; TITAN FILL; STEEL BOD

0

900855HH

900855HH

5/8" FLOW-THRU; HH FILL; FEMALE

0

403SSE

403SSE

SCRATCH BRUSH; SS FILL; WOOD HDL

0

AB5

AB5

ACID BRUSH; HH; TIN HDL; 13/16"

0

0037-02000

0037-02000

SIZE 2 TAKLON FLAT ARTIST; WD HD

0

49285CLR

49285CLR

ITW Chemtronics (Chemtronics)

COVENTRY SEALED FOAM ESD 500/PK

22

901198

901198

1/4" FLOW-THRU; NYL FILL; FEMALE

0

11CKPG-12

11CKPG-12

HL TOOTHBRUSH; HOG FILL; PL HDLE

0

Clean Room Swabs and Brushes

1. Overview

Clean room swabs and brushes are specialized tools designed for contamination control in controlled environments. They play a critical role in removing particulate and electrostatic discharge (ESD) hazards from sensitive surfaces in semiconductor manufacturing, pharmaceutical production, and aerospace engineering. These products must meet stringent ISO 14644-1 and IEST standards for particle generation, chemical compatibility, and electrostatic dissipation.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Foam-Tip Swabs High absorbency, low particle generation, non-abrasive Optical lens cleaning, precision electronics assembly
Microfiber Brushes Split-fiber structure for superior particle capture HEPA filter maintenance, cleanroom wall cleaning
ESD-Neutral Swabs Conductive carbon fibers, static-dissipative handles Wafer processing equipment cleaning, PCB assembly
Ultrasonic Clean Brushes Engineered for compatibility with ultrasonic cleaning systems Medical device sterilization, semiconductor tooling maintenance

3. Structure and Composition

Typical swabs consist of three primary components: (1) Cleaning medium (foam, microfiber, or nonwoven fabric), (2) Handle material (polypropylene, conductive polymer, or stainless steel), and (3) Bonding agent (solvent-free adhesive for ISO Class 3 environments). Brushes feature filament arrays (nylon with PTFE coating, carbon-infused polypropylene) mounted on ESD-safe polymer bases. All materials undergo outgassing testing per ASTM E595 standards.

4. Key Technical Specifications

Parameter Acceptance Criteria Importance
Particle Shedding (0.5 m+) <10 particles/cm Maintains ISO Class 3 environment integrity
ESD Decay Time <1.0 second Protects ESD-sensitive electronics
Chemical Extractables <0.01% by weight Prevents process contamination
Thermal Stability Operable from -40 C to 121 C Enables sterilization compatibility

5. Application Fields

Primary industries include: semiconductor fabrication (ASML immersion lithography tools), biopharmaceutical manufacturing (Grade A/B isolators), aerospace (NASA JPL Class 100 cleanrooms), and precision optics (Zeiss electron microscopes). Critical applications involve photomask cleaning, aseptic filling line maintenance, and MEMS device calibration.

6. Leading Manufacturers and Products

Manufacturer Key Product Technical Highlights
Texwipe TX1010 Cleanroom Swabs Gamma-stable polyester foam, 10-6 particle count
Aero-Mist ESD-700 Brush Kit Carbon-loaded nylon filaments, 108 surface resistance
Bondline Ultraclean Swabs Single-bonded PU tip, <1ppm NVR
Kimberly-Clark KimWipes CR-TX 99.99% isopropyl alcohol compatibility

7. Selection Recommendations

Key considerations include: (1) Surface sensitivity (e.g., 10nm particle removal efficiency for EUV lithography mirrors), (2) Chemical compatibility (resistance to 5% HF acid solutions), (3) ESD requirements (IEC 61340-5-1 compliance), and (4) Lifecycle cost (sterilization reusability vs. single-use economics). For critical applications like 5nm node manufacturing, carbon-fiber reinforced swabs with sub-100nm particle retention are recommended.

8. Industry Trends

Current developments focus on: (1) Nanofiber-based cleaning media with 99.999% BFE efficiency, (2) Smart brushes with embedded sensors for real-time contamination monitoring, (3) Biodegradable polymer handles reducing environmental impact, and (4) Integration with robotic cleaning systems for ISO Class 1 environments. The market is projected to grow at 8.7% CAGR through 2027, driven by 3D NAND flash manufacturing and biopharma single-use systems.

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