Clean Room Swabs and Brushes

Image Part Number Description / PDF Quantity Rfq
CX50

CX50

ITW Chemtronics (Chemtronics)

SWAB FLEXTIP FOAM 4.45" 50/PK

484

FTN-18

FTN-18

18GAUGE; FT LUER LOCK; NYL FILL

0

403PBG

403PBG

SCRATCH BRUSH; PB FILL; WOOD HDL

0

6021-06000

6021-06000

SIZE 6 HH ROUND ARTIST; WOOD HDL

0

811-100

811-100

MG Chemicals

SWAB COTTON DOUBLE ENDED 100PCS

233

1501-10000

1501-10000

SIZE 10 WHT ARTIST STEN; WOOD HD

0

LBF-9SS

LBF-9SS

1-1/8" FLOW-THRU; SS FILL; FMALE

0

6999-00400

6999-00400

SIZE 4/0 PUR RED SABL RND; WD HD

0

901716G

901716G

1" FLOW-THRU; GOAT FILL; FEMALE

0

0770-08000

0770-08000

SIZE 8 SABLE ROUND ARTIST; WD HD

0

1010HHG-12

1010HHG-12

APPLICATOR: HH FILL; STL HNDL

0

902984CS

902984CS

SCRATCH BRUSH; CS FILL; WOOD HDL

0

23209

23209

SIZE 7 HH STRIP BRUSH, 2" HT

0

813-10

813-10

MG Chemicals

SWAB FOAM SINGLE ENDED 10PCS

83

6020-11000

6020-11000

SIZE 11 CAMEL RND ARTIST; WD HDL

0

15HHLG-12

15HHLG-12

HL TOOTHBRUSH; HH FILL; WOOD HDL

0

6206-04000

6206-04000

SIZE 4 BLACK HOG MARKING; WD HDL

0

21N-020W-BLUG-12

21N-020W-BLUG-12

TOOTHBRUSH; NYL FILL; PLAS HNDLE

0

9162N

9162N

BLOCK BRUSH; NYL FILL; WOOD BASE

0

0987-00037

0987-00037

SIZ 3/8" BK HOG FITCH ART; WD HD

0

Clean Room Swabs and Brushes

1. Overview

Clean room swabs and brushes are specialized tools designed for contamination control in controlled environments. They play a critical role in removing particulate and electrostatic discharge (ESD) hazards from sensitive surfaces in semiconductor manufacturing, pharmaceutical production, and aerospace engineering. These products must meet stringent ISO 14644-1 and IEST standards for particle generation, chemical compatibility, and electrostatic dissipation.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Foam-Tip Swabs High absorbency, low particle generation, non-abrasive Optical lens cleaning, precision electronics assembly
Microfiber Brushes Split-fiber structure for superior particle capture HEPA filter maintenance, cleanroom wall cleaning
ESD-Neutral Swabs Conductive carbon fibers, static-dissipative handles Wafer processing equipment cleaning, PCB assembly
Ultrasonic Clean Brushes Engineered for compatibility with ultrasonic cleaning systems Medical device sterilization, semiconductor tooling maintenance

3. Structure and Composition

Typical swabs consist of three primary components: (1) Cleaning medium (foam, microfiber, or nonwoven fabric), (2) Handle material (polypropylene, conductive polymer, or stainless steel), and (3) Bonding agent (solvent-free adhesive for ISO Class 3 environments). Brushes feature filament arrays (nylon with PTFE coating, carbon-infused polypropylene) mounted on ESD-safe polymer bases. All materials undergo outgassing testing per ASTM E595 standards.

4. Key Technical Specifications

Parameter Acceptance Criteria Importance
Particle Shedding (0.5 m+) <10 particles/cm Maintains ISO Class 3 environment integrity
ESD Decay Time <1.0 second Protects ESD-sensitive electronics
Chemical Extractables <0.01% by weight Prevents process contamination
Thermal Stability Operable from -40 C to 121 C Enables sterilization compatibility

5. Application Fields

Primary industries include: semiconductor fabrication (ASML immersion lithography tools), biopharmaceutical manufacturing (Grade A/B isolators), aerospace (NASA JPL Class 100 cleanrooms), and precision optics (Zeiss electron microscopes). Critical applications involve photomask cleaning, aseptic filling line maintenance, and MEMS device calibration.

6. Leading Manufacturers and Products

Manufacturer Key Product Technical Highlights
Texwipe TX1010 Cleanroom Swabs Gamma-stable polyester foam, 10-6 particle count
Aero-Mist ESD-700 Brush Kit Carbon-loaded nylon filaments, 108 surface resistance
Bondline Ultraclean Swabs Single-bonded PU tip, <1ppm NVR
Kimberly-Clark KimWipes CR-TX 99.99% isopropyl alcohol compatibility

7. Selection Recommendations

Key considerations include: (1) Surface sensitivity (e.g., 10nm particle removal efficiency for EUV lithography mirrors), (2) Chemical compatibility (resistance to 5% HF acid solutions), (3) ESD requirements (IEC 61340-5-1 compliance), and (4) Lifecycle cost (sterilization reusability vs. single-use economics). For critical applications like 5nm node manufacturing, carbon-fiber reinforced swabs with sub-100nm particle retention are recommended.

8. Industry Trends

Current developments focus on: (1) Nanofiber-based cleaning media with 99.999% BFE efficiency, (2) Smart brushes with embedded sensors for real-time contamination monitoring, (3) Biodegradable polymer handles reducing environmental impact, and (4) Integration with robotic cleaning systems for ISO Class 1 environments. The market is projected to grow at 8.7% CAGR through 2027, driven by 3D NAND flash manufacturing and biopharma single-use systems.

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