Flux, Flux Remover

Image Part Number Description / PDF Quantity Rfq
CS-FX2

CS-FX2

American Beauty Tools

FLUX JAR

7

SMD29130CC

SMD29130CC

Chip Quik, Inc.

TACK FLUX 30CC W/HANDLE & TIP

0

760089

760089

LOCTITE / Henkel

MFR301 FLUX PENS (RMA) 10ML

1109

SMD291150G

SMD291150G

Chip Quik, Inc.

TACK FLUX 150 GRAM

10

835-100ML

835-100ML

MG Chemicals

LIQUID ROSIN FLUX

28

1631-16SB

1631-16SB

Techspray

G3 FLUX REMOVER W/BRUSH ATTACHME

0

FLS99-4G

FLS99-4G

SRA Soldering Products

SRA #99 ROSIN FLUX, TYPE RMA 4G

5

SMDLT75G

SMDLT75G

Chip Quik, Inc.

FLUX - NO CLEAN LF CAN 2.64 OZ

1

MCC-UFR10A

MCC-UFR10A

MicroCare

UNIVERSAL HFO-BASED FLUX REMOVER

24

SMD291ST2CC6

SMD291ST2CC6

Chip Quik, Inc.

TACK FLUX 6 PACK, 2CC TUBES

122

83-1000-0951

83-1000-0951

Kester

FLUX PEN FORMULA 951 NO CLEAN

849

83-1097-2331

83-1097-2331

Kester

FLUX PEN WATER SOLUBLE 2331-ZX

1145

CQ2LF-16

CQ2LF-16

Chip Quik, Inc.

LIQUID FLUX WATER-WASHABLE IN 16

1

8624

8624

ACL Staticide, Inc.

FLUX REMOVER CAN 12 OZ

41

CQ4LF-128

CQ4LF-128

Chip Quik, Inc.

LIQUID FLUX NO-CLEAN IN 1 GALLON

4

CQ4LF

CQ4LF

Chip Quik, Inc.

FLUX - NO CLEAN PEN 0.34 OZ

2066

ES1035

ES1035

ITW Chemtronics (Chemtronics)

FLUX REMOVER 10 OZ AEROSOL

0

FLS312-4G

FLS312-4G

SRA Soldering Products

#312 NC FLUX, SOLVENT BASED 2%

5

1631-5S

1631-5S

Techspray

G3 FLUX REMOVER

0

RA691

RA691

Chip Quik, Inc.

RA ROSIN PASTE FLUX IN 50 GRAM J

68

Flux, Flux Remover

1. Overview

Flux and flux remover are critical materials in electronic manufacturing processes. Flux is a chemical agent used to remove oxidation from metal surfaces during soldering, enabling better solder wetting and joint formation. Flux remover (or flux cleaner) is a chemical solution designed to eliminate flux residues and contaminants from printed circuit boards (PCBs) after soldering. These materials ensure reliable electrical connections, prevent corrosion, and maintain product quality in modern electronics manufacturing.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Rosin-based FluxNon-corrosive, low residue, compatible with lead-free and tin-lead solderConsumer electronics assembly
Water-soluble FluxHigh activity, easily removed with water-based cleaningAutomotive electronics with high reliability demands
No-clean FluxLow residue formulation eliminating post-soldering cleaningHigh-density PCB assembly
Organic Acid FluxStrong oxide removal capability for difficult-to-solder surfacesIndustrial control equipment manufacturing
Solvent-based RemoverFast evaporation, effective for rosin residuesAerospace component maintenance
Water-based RemoverEnvironmentally friendly, meets RoHS/REACH standardsLED lighting production

3. Structure and Composition

Flux Composition:

  • Activators (e.g., organic/inorganic acids): Enhance metal wetting by removing oxides
  • Solvents (e.g., glycols, esters): Control viscosity and evaporation rate
  • Resin (e.g., colophony): Form protective layer against re-oxidation
  • Additives (e.g., surfactants): Improve thermal stability

Flux Remover Composition:

  • Base solvents (e.g., hydrocarbons, alcohols): Dissolve flux residues
  • Surfactants: Reduce surface tension for better penetration
  • Corrosion inhibitors: Protect metal surfaces during cleaning

4. Key Technical Specifications

ParameterDescriptionImportance
Activation Temperature100-350 C rangeDetermines compatibility with soldering profiles
Residue Conductivity<1.56 S/cmImpacts electrical reliability
Flash Point30-80 CSafety handling consideration
Cleaning Efficiency>98% residue removalDirectly affects product yield
Material CompatibilityPass MIL-STD-883H testingEnsures no damage to sensitive components

5. Application Fields

  • Electronics Manufacturing: SMT/BGA assembly, wave soldering
  • Automotive Industry: Engine control units, sensor modules
  • Telecommunications: 5G base stations, fiber optic equipment
  • Aerospace: Avionics systems, satellite components
  • Medical Devices: Pacemakers, diagnostic equipment

Application Case: In smartphone PCB production, no-clean flux reduces cleaning costs by 40% while meeting IPC-J-STD-001 Class 3 requirements.

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Feature
Alpha AssemblyOM-350Halogen-free no-clean flux with 0.03% solids
Kester951CXWater-soluble flux for high-reliability military applications
HenkelRID810Low-odor solvent-based flux remover
ElectrolubeFS22Biodegradable water-based cleaner

7. Selection Recommendations

  • Match flux type with solder alloy composition
  • Consider cleaning method (spray, ultrasonic, vapor degreasing)
  • Evaluate environmental regulations (VOC limits, REACH compliance)
  • Analyze thermal profile compatibility
  • Test material compatibility with PCB substrates

8. Industry Trends

  • Growth in halogen-free and bio-based formulations
  • Increased demand for ultra-low residue materials (<=0.01% solids)
  • Development of smart cleaning solutions with IoT-enabled monitoring
  • Rising adoption of miniaturized component-compatible fluxes
  • Integration with Industry 4.0 automated dispensing systems
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