Flux, Flux Remover

Image Part Number Description / PDF Quantity Rfq
1520-G

1520-G

Techspray

ECO-DFLUXER SMT200

0

CQ9LF-0.5

CQ9LF-0.5

Chip Quik, Inc.

LIQUID FLUX ROSIN MILDLY ACTIVAT

50

CQ7LF-1.0

CQ7LF-1.0

Chip Quik, Inc.

LIQUID FLUX ALCOHOL-BASED NO-CLE

13

817

817

Kester

SOLDER FLUX STAINLESS STEEL

0

FLS300-4G

FLS300-4G

SRA Soldering Products

SRA #300 ORGANIC ACID FLUX - 4 G

5

TF5000-30CC

TF5000-30CC

SRA Soldering Products

TF5000 NO CLEAN TACKY FLUX - 30C

22

1621-10S

1621-10S

Techspray

FLUX REMOVER 10 OZ

166

CQIRM

CQIRM

Chip Quik, Inc.

FLUX REMOVER (FOAM FREE) IN 10ML

36

8351-125ML

8351-125ML

MG Chemicals

NO CLEAN FLUX, HALOGEN FREE

21

413B-1L

413B-1L

MG Chemicals

HEAVY DUTY FLUX REMOVER

19

8351-1L

8351-1L

MG Chemicals

NO CLEAN, HALOGEN FREE FLUX

11

8342-50G

8342-50G

MG Chemicals

RA ROSIN FLUX PASTE 1.28OZ

350

413B-425G

413B-425G

MG Chemicals

HEAVY DUTY FLUX REMOVER

0

MCC-PROW

MCC-PROW

MicroCare

PRO-CLEAN LEAD-FREE PRE-SAT WIPE

11

PEN-NC

PEN-NC

SRA Soldering Products

#312 NO-CLEAN FLUX PEN - REFILL

42

CQNTRM

CQNTRM

Chip Quik, Inc.

FLUX REMOVER (NON-FLAMMABLE) IN

33

FLS912-1G

FLS912-1G

SRA Soldering Products

SRA #912 ROSIN FLUX, TYPE R - 1G

3

CQIRM-1.0

CQIRM-1.0

Chip Quik, Inc.

FLUX REMOVER (FOAM FREE) IN 30ML

10

PEN-NC-SET

PEN-NC-SET

SRA Soldering Products

#312 NO-CLEAN FLUX PEN AND 5 REF

32

SMDLT150G

SMDLT150G

Chip Quik, Inc.

FLUX - NO CLEAN LF CAN 5.29 OZ

2

Flux, Flux Remover

1. Overview

Flux and flux remover are critical materials in electronic manufacturing processes. Flux is a chemical agent used to remove oxidation from metal surfaces during soldering, enabling better solder wetting and joint formation. Flux remover (or flux cleaner) is a chemical solution designed to eliminate flux residues and contaminants from printed circuit boards (PCBs) after soldering. These materials ensure reliable electrical connections, prevent corrosion, and maintain product quality in modern electronics manufacturing.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Rosin-based FluxNon-corrosive, low residue, compatible with lead-free and tin-lead solderConsumer electronics assembly
Water-soluble FluxHigh activity, easily removed with water-based cleaningAutomotive electronics with high reliability demands
No-clean FluxLow residue formulation eliminating post-soldering cleaningHigh-density PCB assembly
Organic Acid FluxStrong oxide removal capability for difficult-to-solder surfacesIndustrial control equipment manufacturing
Solvent-based RemoverFast evaporation, effective for rosin residuesAerospace component maintenance
Water-based RemoverEnvironmentally friendly, meets RoHS/REACH standardsLED lighting production

3. Structure and Composition

Flux Composition:

  • Activators (e.g., organic/inorganic acids): Enhance metal wetting by removing oxides
  • Solvents (e.g., glycols, esters): Control viscosity and evaporation rate
  • Resin (e.g., colophony): Form protective layer against re-oxidation
  • Additives (e.g., surfactants): Improve thermal stability

Flux Remover Composition:

  • Base solvents (e.g., hydrocarbons, alcohols): Dissolve flux residues
  • Surfactants: Reduce surface tension for better penetration
  • Corrosion inhibitors: Protect metal surfaces during cleaning

4. Key Technical Specifications

ParameterDescriptionImportance
Activation Temperature100-350 C rangeDetermines compatibility with soldering profiles
Residue Conductivity<1.56 S/cmImpacts electrical reliability
Flash Point30-80 CSafety handling consideration
Cleaning Efficiency>98% residue removalDirectly affects product yield
Material CompatibilityPass MIL-STD-883H testingEnsures no damage to sensitive components

5. Application Fields

  • Electronics Manufacturing: SMT/BGA assembly, wave soldering
  • Automotive Industry: Engine control units, sensor modules
  • Telecommunications: 5G base stations, fiber optic equipment
  • Aerospace: Avionics systems, satellite components
  • Medical Devices: Pacemakers, diagnostic equipment

Application Case: In smartphone PCB production, no-clean flux reduces cleaning costs by 40% while meeting IPC-J-STD-001 Class 3 requirements.

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Feature
Alpha AssemblyOM-350Halogen-free no-clean flux with 0.03% solids
Kester951CXWater-soluble flux for high-reliability military applications
HenkelRID810Low-odor solvent-based flux remover
ElectrolubeFS22Biodegradable water-based cleaner

7. Selection Recommendations

  • Match flux type with solder alloy composition
  • Consider cleaning method (spray, ultrasonic, vapor degreasing)
  • Evaluate environmental regulations (VOC limits, REACH compliance)
  • Analyze thermal profile compatibility
  • Test material compatibility with PCB substrates

8. Industry Trends

  • Growth in halogen-free and bio-based formulations
  • Increased demand for ultra-low residue materials (<=0.01% solids)
  • Development of smart cleaning solutions with IoT-enabled monitoring
  • Rising adoption of miniaturized component-compatible fluxes
  • Integration with Industry 4.0 automated dispensing systems
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