| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Ideal-tek |
PRINTED CIRCUIT HOLDER PCSA-4N - |
1 |
|
 |
Hakko |
CLEANING PIN |
16 |
|
 |
EDSYN Inc. |
RETAINING SLEEVE AND COLLAR FOR |
50 |
|
 |
EDSYN Inc. |
SOLDAVAC AIR & VACUUM PICK-UP SY |
2 |
|
 |
SRA Soldering Products |
FAST CHIP REMOVAL ALLOY FOR SMD |
9 |
|
 |
Hakko |
N2 STATION,GENERATOR,HIGH CAPACI |
0 |
|
 |
EMIT |
PRE-FILTER - PLEATED BAG, 5000I |
0 |
|
 |
Tronex (Menda/EasyBraid/Tronex) |
TABLE BRACKET/CLAMPS |
0 |
|
 |
EMIT |
PRE-FILTER - LABYRINTH F6, 1500I |
0 |
|
 |
Master Appliance Corp. |
EJECTOR & BURNER ASSEMBLY (SERIA |
0 |
|
 |
Xcelite |
SOLDER BATH 200W |
1 |
|
 |
Hakko |
CLEANING PIN |
5 |
|
 |
Xcelite |
PUMP FOR WFE E/2P/P |
0 |
|
 |
Xcelite |
ADAPTER 5CC |
0 |
|
 |
Kurtz Ersa, Inc. |
TABLE CLAMP, FILTER 0CA10-001 |
1 |
|
 |
Xcelite |
ASSY BARREL NUT FOR PES51&50 |
69 |
|
 |
Tronex (Menda/EasyBraid/Tronex) |
UNDER STENCIL WIPE 18"X18" |
0 |
|
 |
Ideal-tek |
STRAIGHT NEEDLE, ESD 6 MM CUP |
0 |
|
 |
EDSYN Inc. |
RETAINING SLEEVE FOR STANDARD TI |
100 |
|
 |
SRA Soldering Products |
HEPA FILTER FOR FEK-01 |
10 |
|
Soldering, desoldering, and rework accessories are essential tools for electronic assembly, repair, and maintenance. These accessories enable precise joining, removal, and modification of electronic components on printed circuit boards (PCBs). Modern electronics manufacturing relies on these tools for high-precision operations in industries ranging from consumer electronics to aerospace.
| Type | Functional Features | Application Examples |
|---|---|---|
| Soldering Iron Tips | High thermal conductivity, corrosion-resistant coatings, multiple geometries | PCB assembly, fine-pitch component soldering |
| Soldering Stations | Temperature-controlled systems with modular tool integration | Mass production lines, R&D prototyping |
| Desoldering Pumps | Manual/electric vacuum systems for solder removal | Component replacement, PCB repair |
| Hot Air Rework Stations | Precise airflow and temperature control for SMD components | BGA reballing, QFN package replacement |
| Flux Applicators | Controlled application of chemical flux for solderability enhancement | Pre-soldering preparation, rework processes |
Typical accessories consist of: - Heating Elements: Ceramic or carbon heating systems for rapid thermal response - Temperature Sensors: PID-controlled thermocouples for 1 C accuracy - Material Construction: Anodized aluminum housings, ESD-safe plastics - Interface Modules: Digital displays, interchangeable tool connectors - Safety Features: Overheat protection, sleep mode functions
| Parameter | Importance |
|---|---|
| Operating Temperature Range (100-450 C) | Determines material compatibility and process window |
| Temperature Stability ( 2 C) | Critical for solder joint quality and component safety |
| Heating Time (30-90s) | Impacts production efficiency and thermal shock prevention |
| Power Consumption (20-200W) | Affects operating costs and thermal management requirements |
| Tip Lifetime (200-2000h) | Influences maintenance frequency and total ownership cost |
Major industries include: - Consumer Electronics Manufacturing (smartphones, laptops) - Automotive Electronics (ECUs, sensors) - Aerospace & Defense (avionics, guidance systems) - Medical Devices (diagnostic equipment, implants) - Telecommunications Infrastructure (5G base stations, routers)
| Manufacturer | Representative Product |
|---|---|
| Metcal | HX-100 SmartHeat Soldering System |
| Weller | WSD81 Digital Soldering Station |
| JBC | CD-2B Advanced Rework Station |
| Hakko | FR-301 Hot Air Rework Tool |
| Electro-Tech Systems | APS 925HV Selective Soldering System |
Key considerations: - Application type (precision vs. industrial-scale) - Compatibility with existing tooling - Temperature control requirements - ESD protection specifications - Maintenance cost and spare parts availability - Calibration requirements and traceability
Current developments include: - Increasing adoption of AI-driven thermal profiling - Miniaturization for 01005 component handling - IoT-enabled tool monitoring systems - Lead-free soldering process optimization - Eco-friendly flux formulations - Integration with automated optical inspection (AOI)