| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
ABLIC U.S.A. Inc. |
THERMOSTAT SOT23-5 |
0 |
|
 |
Roving Networks / Microchip Technology |
THERMOSTAT PROG ACT HIGH 8SOIC |
0 |
|
 |
ROHM Semiconductor |
THERMOSTAT 100DEGC ACT LOW 5SSOP |
2178 |
|
 |
ROHM Semiconductor |
THERMOSTAT 80DEGC ACT LOW 5SSOP |
797 |
|
 |
Texas Instruments |
THERMOSTAT 130DEGC OPN DRN 6WSON |
1000 |
|
 |
Roving Networks / Microchip Technology |
THERMOSTAT PROG ACTIVE LOW 8SOIC |
192 |
|
 |
ABLIC U.S.A. Inc. |
THERMOSTAT 50DEGC ACT LOW SNT-6A |
0 |
|
 |
ROHM Semiconductor |
THERMOSTAT 55DEGC ACT LOW HVSOF5 |
0 |
|
 |
Texas Instruments |
DUAL TRIP TEMPERATURE SWITCH |
316 |
|
 |
ABLIC U.S.A. Inc. |
THERMOSTAT 60DEGC ACT HI SNT-6A |
0 |
|
 |
Texas Instruments |
THERMOSTAT 50DEGC ACT LO SOT23-5 |
0 |
|
 |
Roving Networks / Microchip Technology |
THERMOSTAT 5DEGC ACT LOW SOT23-5 |
34 |
|
 |
ROHM Semiconductor |
THERMOSTAT 110DEGC ACT LOW 5SSOP |
2889 |
|
 |
Texas Instruments |
THERMOSTAT 70DEG ACT HI SOT563-6 |
0 |
|
 |
ABLIC U.S.A. Inc. |
THERMOSTAT 80DEGC ACT LOW SNT-6A |
60 |
|
 |
Roving Networks / Microchip Technology |
THERMOSTAT 25/35DEG ACT LO 8MSOP |
0 |
|
 |
ABLIC U.S.A. Inc. |
THERMOSTAT 60DEGC ACT LO SOT23-5 |
95 |
|
 |
LM26 FACTORY PRESET TRIP POINT T |
12936 |
|
|
 |
Analog Devices, Inc. |
THERMOSTAT 115DEG ACT LO SOT23-5 |
3200 |
|
 |
ABLIC U.S.A. Inc. |
THERMOSTAT OPEN DRAIN SOT23-5 |
0 |
|
Solid state temperature sensors and thermostats are electronic devices that detect and regulate temperature using semiconductor-based sensing elements. Unlike mechanical thermostats, these solid state devices offer faster response times, higher precision, and enhanced reliability through electronic signal processing. They play critical roles in industrial automation, consumer electronics, automotive systems, and medical equipment by enabling precise thermal management and energy-efficient operations.
| Type | Functional Features | Application Examples |
|---|---|---|
| Semiconductor-based Sensors | Utilize silicon bandgap technology for linear output, high accuracy ( 0.5 C typical) | Computer CPU thermal protection |
| Thermistor Interface ICs | Digital output with integrated ADC, supports I2C/SPI protocols | Smart home thermostats |
| Thermal Switches | Programmable trip points, latching/non-latching modes | Industrial oven controllers |
| MEMS Thermal Sensors | Micromachined structures for miniaturized applications | Wearable health monitors |
Typical solid state devices consist of: (1) Semiconductor sensing element (silicon/germanium), (2) Signal conditioning circuitry (amplifiers, ADCs), (3) Protective packaging (epoxy/ ceramic encapsulation), (4) Interface connectors (wire leads/SMD pads). Advanced designs integrate microcontroller units for smart functionality, with temperature-to-digital conversion performed on-chip.
| Parameter | Importance |
|---|---|
| Temperature Range (-55 C to +150 C) | Determines operational environment suitability |
| Accuracy ( 0.1 C to 3 C) | Critical for precision applications like medical devices |
| Response Time (1ms-10s) | Affects system reaction speed |
| Output Type (Analog Voltage/PWM/Digital) | Dictates compatibility with control systems |
| Power Consumption (5 A-10mA) | Essential for battery-powered devices |
| Thermal Hysteresis (0.1 C-5 C) | Prevents oscillation in switching applications |
Key industries include: Industrial Process Control (chemical reactors), Medical Equipment (patient monitors), Automotive (battery management systems), Consumer Electronics (smartphones), HVAC systems, and Aerospace (avionics thermal regulation). Specific devices: semiconductor manufacturing tools, electric vehicle battery packs, and refrigeration systems.
| Manufacturer | Representative Product | Key Features |
|---|---|---|
| Texas Instruments | LM75B | Digital temperature sensor with 1 C accuracy |
| STMicroelectronics | L6281 | Thermal protector for motor drives |
| Honeywell | TSY01-B1 | Digital thermostat IC for HVAC |
| Omron Electronics | D6T-44L | MEMS-based thermal array sensor |
Key considerations: (1) Match temperature range to application environment, (2) Balance accuracy requirements with cost, (3) Verify packaging suitability (IP rating for harsh environments), (4) Check interface compatibility (analog/digital), (5) Evaluate power budget constraints, (6) Consider calibration requirements. For industrial applications, prioritize long-term stability; for consumer devices, focus on size and cost.
Current trends include: Development of wireless temperature nodes for IoT applications, integration with AI-based predictive maintenance systems, advancement of ultra-low-power wake-up sensors (<1 A consumption), adoption of wide bandgap semiconductors for high-temperature operation, and increased use of MEMS technology for flexible form factors. Market growth driven by electric vehicle thermal management and smart building automation demands.