| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Roving Networks / Microchip Technology |
THERMOSTAT PROG ACT HIGH 8SOIC |
0 |
|
 |
ABLIC U.S.A. Inc. |
THERMOSTAT OPEN DRAIN SNT4A |
0 |
|
 |
Roving Networks / Microchip Technology |
THERMOSTAT 45DEGC ACTV LOW 8MSOP |
0 |
|
 |
ABLIC U.S.A. Inc. |
THERMOSTAT 75DEGC ACT LO HSNT4-B |
100 |
|
 |
SINGLE TRIP POINT SWITCH/DIGITAL |
3000 |
|
|
 |
Roving Networks / Microchip Technology |
THERMOSTAT PROG ACT HIGH 8SOIC |
925 |
|
 |
ABLIC U.S.A. Inc. |
THERMOSTAT OPEN DRAIN HSNT4-B |
0 |
|
 |
Maxim Integrated |
THERMOSTAT 105DEG ACT LO SOT23-5 |
2066 |
|
 |
Roving Networks / Microchip Technology |
THERMOSTAT 25/35DEG ACT LO 8MSOP |
0 |
|
 |
Roving Networks / Microchip Technology |
THERMOSTAT 25/45DEG ACT LO 8MSOP |
262 |
|
 |
Maxim Integrated |
THERMOSTAT 70DEG ACT HI/LO 8SOIC |
2800 |
|
 |
ABLIC U.S.A. Inc. |
THERMOSTAT 60DEGC ACT LO SOT23-5 |
84 |
|
 |
Roving Networks / Microchip Technology |
THERMOSTAT 30/45DEG ACT LO 8MSOP |
0 |
|
 |
Roving Networks / Microchip Technology |
THERMOSTAT 65DEGC ACTV LOW 8MSOP |
420 |
|
 |
Texas Instruments |
THERMOSTAT 75DEGC ACT LO SOT23-5 |
11287 |
|
 |
ABLIC U.S.A. Inc. |
THERMOSTAT OPEN DRAIN HSNT4-B |
0 |
|
 |
ABLIC U.S.A. Inc. |
THERMOSTAT 55DEGC ACT LOW SNT4A |
11 |
|
 |
Texas Instruments |
THERMOSTAT 150DEGC OPN DRN 6WSON |
955 |
|
 |
Texas Instruments |
THERMOSTAT PROG OPEN COL 8TSSOP |
546 |
|
 |
ABLIC U.S.A. Inc. |
THERMOSTAT SNT-6A |
0 |
|
Solid state temperature sensors and thermostats are electronic devices that detect and regulate temperature using semiconductor-based sensing elements. Unlike mechanical thermostats, these solid state devices offer faster response times, higher precision, and enhanced reliability through electronic signal processing. They play critical roles in industrial automation, consumer electronics, automotive systems, and medical equipment by enabling precise thermal management and energy-efficient operations.
| Type | Functional Features | Application Examples |
|---|---|---|
| Semiconductor-based Sensors | Utilize silicon bandgap technology for linear output, high accuracy ( 0.5 C typical) | Computer CPU thermal protection |
| Thermistor Interface ICs | Digital output with integrated ADC, supports I2C/SPI protocols | Smart home thermostats |
| Thermal Switches | Programmable trip points, latching/non-latching modes | Industrial oven controllers |
| MEMS Thermal Sensors | Micromachined structures for miniaturized applications | Wearable health monitors |
Typical solid state devices consist of: (1) Semiconductor sensing element (silicon/germanium), (2) Signal conditioning circuitry (amplifiers, ADCs), (3) Protective packaging (epoxy/ ceramic encapsulation), (4) Interface connectors (wire leads/SMD pads). Advanced designs integrate microcontroller units for smart functionality, with temperature-to-digital conversion performed on-chip.
| Parameter | Importance |
|---|---|
| Temperature Range (-55 C to +150 C) | Determines operational environment suitability |
| Accuracy ( 0.1 C to 3 C) | Critical for precision applications like medical devices |
| Response Time (1ms-10s) | Affects system reaction speed |
| Output Type (Analog Voltage/PWM/Digital) | Dictates compatibility with control systems |
| Power Consumption (5 A-10mA) | Essential for battery-powered devices |
| Thermal Hysteresis (0.1 C-5 C) | Prevents oscillation in switching applications |
Key industries include: Industrial Process Control (chemical reactors), Medical Equipment (patient monitors), Automotive (battery management systems), Consumer Electronics (smartphones), HVAC systems, and Aerospace (avionics thermal regulation). Specific devices: semiconductor manufacturing tools, electric vehicle battery packs, and refrigeration systems.
| Manufacturer | Representative Product | Key Features |
|---|---|---|
| Texas Instruments | LM75B | Digital temperature sensor with 1 C accuracy |
| STMicroelectronics | L6281 | Thermal protector for motor drives |
| Honeywell | TSY01-B1 | Digital thermostat IC for HVAC |
| Omron Electronics | D6T-44L | MEMS-based thermal array sensor |
Key considerations: (1) Match temperature range to application environment, (2) Balance accuracy requirements with cost, (3) Verify packaging suitability (IP rating for harsh environments), (4) Check interface compatibility (analog/digital), (5) Evaluate power budget constraints, (6) Consider calibration requirements. For industrial applications, prioritize long-term stability; for consumer devices, focus on size and cost.
Current trends include: Development of wireless temperature nodes for IoT applications, integration with AI-based predictive maintenance systems, advancement of ultra-low-power wake-up sensors (<1 A consumption), adoption of wide bandgap semiconductors for high-temperature operation, and increased use of MEMS technology for flexible form factors. Market growth driven by electric vehicle thermal management and smart building automation demands.