Pressure Sensors, Transducers

Image Part Number Description / PDF Quantity Rfq
MPXA4250A6T1

MPXA4250A6T1

NXP Semiconductors

PRESSURE SENS 36.3PSI MAX 8-SOP

0

MPVZ12GC7U

MPVZ12GC7U

NXP Semiconductors

PRESSURE SENSOR AXIAL 8-DIP

0

MPXV5004G6U

MPXV5004G6U

NXP Semiconductors

SENSOR GAUGE PRESS .57PSI MAX

0

MPL115A1T2

MPL115A1T2

NXP Semiconductors

IC BAROMETER SPI DGTL MINI 8LGA

0

MP3V5010GP

MP3V5010GP

NXP Semiconductors

IC PRESSURE SENSOR 8-SOP

0

MPX5100GSX

MPX5100GSX

NXP Semiconductors

SENSOR PRESSURE GAUGE PC AXIAL

0

MPXH6400A6T1

MPXH6400A6T1

NXP Semiconductors

SENSOR PRESSURE ABSOLUTE 8-SSOP

0

MP3H6115AC6U

MP3H6115AC6U

NXP Semiconductors

IC PRESSURE SENSOR 16.7PSI 8SSOP

0

MPXAZ4115A6U

MPXAZ4115A6U

NXP Semiconductors

PRESSURE SENS 16.7PSI MAX 8-SOP

0

MPXAZ4100A6U

MPXAZ4100A6U

NXP Semiconductors

PRESSURE SENS 15.2PSI MAX 8-SOP

0

MPX2100GVP

MPX2100GVP

NXP Semiconductors

SENSOR PRESSURE COMP 4-PIN

0

MPXV4006G6U

MPXV4006G6U

NXP Semiconductors

SENSOR PRESSURE BASIC SMD 8-SOP

0

MPXAZ4250AC6T1

MPXAZ4250AC6T1

NXP Semiconductors

SENSOR PRESSURE 36.3PSI MAX 8SOP

0

MPXV5004G7U

MPXV5004G7U

NXP Semiconductors

SENSOR GAUGE PRESS .57PSI MAX

0

MPX10GS

MPX10GS

NXP Semiconductors

PRESSURE SENSOR GAUGE 4-SIP

0

MPXA4100A6U

MPXA4100A6U

NXP Semiconductors

PRESSURE SENS 16.7PSI MAX 8-SOP

0

PFXPQ3115BVT1

PFXPQ3115BVT1

NXP Semiconductors

PRESSURE SENSOR, 2.5V, 20/110KPA

0

FXPQ3115BV

FXPQ3115BV

NXP Semiconductors

PRESS SENSOR 2.5V 20/110KPA TSON

0

PNPS3001DVT1

PNPS3001DVT1

NXP Semiconductors

DIFFP 0 - 1KPA

0

PFXPS7140D4T1

PFXPS7140D4T1

NXP Semiconductors

PRESSURE SATELLITE, 40-140 KPA,

0

Pressure Sensors, Transducers

1. Overview

Pressure sensors and transducers are devices that convert mechanical pressure signals into electrical outputs. They serve as critical components in monitoring and controlling pressure in various systems. Modern industrial automation, medical diagnostics, and automotive safety systems rely on their precise measurements to ensure operational efficiency and safety.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Strain GaugeHigh accuracy, stable output, requires bridge circuitIndustrial machinery, load cells
PiezoresistiveMiniaturized design, high sensitivity, temperature-dependentMedical blood pressure monitors
CapacitiveLow power consumption, corrosion-resistant, nonlinear outputAerospace altitude sensors
PiezoelectricSelf-generating, dynamic pressure measurementEngine combustion analysis
Optical FiberImmune to EMI, suitable for harsh environmentsOil well downhole monitoring

3. Structure and Components

Typical components include:

  • Pressure port (stainless steel/ceramic diaphragm)
  • Sensing element (MEMS silicon chip, strain gauge)
  • Signal conditioning circuit (amplifier, ADC)
  • Output interface (4-20mA, I2C, CANbus)
  • Environmental sealing (IP67 rating standard)

4. Key Technical Specifications

ParameterImportance
Measurement Range (0-10kPa to 0-100MPa)Determines operational limits
Accuracy ( 0.1% FS to 2% FS)Impacts system reliability
Output Signal (Analog/digital)Affects compatibility with control systems
Temperature Range (-40 C to +150 C)Defines environmental adaptability
Response Time (1ms to 100ms)Critical for dynamic pressure monitoring

5. Application Fields

Major industries:

  • Industrial Automation (hydraulic system monitoring)
  • Automotive (engine MAP sensors, TPMS)
  • Medical (ventilator pressure control)
  • Aerospace (flight control surface pressure)
  • Consumer Electronics (smartwatches for altitude tracking)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
HoneywellPPT0010 (0-10psi MEMS sensor)
Bosch SensortecBMP580 (barometric pressure sensor)
TE ConnectivityPPT0001NN1A3 (high-temperature sensor)
WIKAA-1100.75 (industrial process sensor)
OmronD6F-PH (low-pressure airflow sensor)

7. Selection Guidelines

Key considerations:

  • Pressure range with 20% safety margin
  • Environmental factors (temperature, vibration)
  • Signal compatibility (analog/digital requirements)
  • Material selection for corrosive environments
  • Cost vs. long-term stability trade-offs

8. Industry Trends

Emerging developments:

  • MEMS integration for miniaturization
  • Wireless pressure sensing nodes
  • AI-enabled predictive maintenance systems
  • New materials like graphene for ultra-sensitive detection
  • Energy-harvesting self-powered sensors

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