Optical Sensors - Photoelectric, Industrial

Image Part Number Description / PDF Quantity Rfq
WL4S-3P2230S02

WL4S-3P2230S02

SICK

SENSOR RETROREFLECTIVE 4M PNP

0

GRTE18S-F234X

GRTE18S-F234X

SICK

SENSOR PROXIMITY 550MM PNP

0

GRTE18S-P231Z

GRTE18S-P231Z

SICK

SENSOR PROXIMITY 115MM PNP

0

WLG4-3E1134

WLG4-3E1134

SICK

SENSOR RETROREFLECTIVE 4.5M NPN

0

HL18T-B2E3AB

HL18T-B2E3AB

SICK

SENSOR RETROREFLECTIVE 3M PNP

0

WTB2S-2N3210

WTB2S-2N3210

SICK

SENSOR PROXIMITY 18MM NPN

0

WTT12LC-B2533S02

WTT12LC-B2533S02

SICK

SENSOR PROXIMITY 1.3M NPN/PNP

0

HTE18-G4A2AA

HTE18-G4A2AA

SICK

SENSOR PROXIMITY 600MM PNP

0

HL18G-P4B3BL

HL18G-P4B3BL

SICK

SENSOR RETROREFLECTIVE 3M PNP

0

WL4S-3W1132

WL4S-3W1132

SICK

SENSOR RETROREFLECTIVE 5M NPN

0

WTV4-3N2221P04

WTV4-3N2221P04

SICK

SENSOR PROXIMITY 50MM NPN

0

WTF4S-3P3264H

WTF4S-3P3264H

SICK

SENSOR PROXIMITY 200MM NPN/PNP

0

ZT1-N2231

ZT1-N2231

SICK

SENSOR PROXIMITY 60MM NPN

0

WLG4S-3N1132V

WLG4S-3N1132V

SICK

SENSOR RETROREFLECTIVE 5M NPN

0

HL18-P3A3BA

HL18-P3A3BA

SICK

SENSOR RETROREFLECTIVE 6.5M PNP

0

WSE27-3P2430

WSE27-3P2430

SICK

SENSOR THROUGH-BEAM 35M PNP

0

HTB18-A4A2BB

HTB18-A4A2BB

SICK

SENSOR PROXIMITY 300MM NPN/PNP

0

GTE6-P1232

GTE6-P1232

SICK

SENSOR PROXIMITY 900MM PNP

0

ET4-P4228

ET4-P4228

SICK

SENSOR PROXIMITY 100MM PNP

0

WTB4-3P1161

WTB4-3P1161

SICK

SENSOR PROXIMITY 150MM PNP

0

Optical Sensors - Photoelectric, Industrial

1. Overview

Industrial photoelectric sensors are optoelectronic devices that detect the presence or absence of objects by emitting and receiving light beams. These sensors convert optical signals into electrical signals through photodetection mechanisms, enabling non-contact measurement and control in industrial environments. Their importance lies in enabling automation, improving production efficiency, and ensuring process reliability across various sectors including manufacturing, logistics, and quality control.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Through-Beam SensorsSeparate emitter and receiver units for high detection accuracyConveyor belt object counting
Reflective SensorsSingle unit with reflector for compact installationsPackaging integrity verification
Diffuse SensorsObject-reflective detection without separate reflectorColor contrast detection in sorting systems
Fiber Optic SensorsFlexible light transmission for confined spacesSemiconductor manufacturing equipment
Slot SensorsU-shaped design for precise positional detectionPrinted circuit board alignment systems

3. Structure and Components

Typical construction includes: 1) Light source (LED/Laser diode) emitting specific wavelengths (660nm-950nm) 2) Photodetector (photodiode/CCD array) for signal reception 3) Signal processing circuitry with amplification and threshold detection 4) Protective housing with optical window (IP65-IP69K ratings) 5) Electrical interface (2-wire/3-wire configurations) Advanced models integrate temperature compensation and digital communication protocols (IO-Link).

4. Key Technical Specifications

ParameterSignificance
Detection RangeDetermines maximum operational distance (20mm-50m)
Response TimeMeasures detection speed (10 s-2ms)
AccuracyDefines position detection precision ( 0.02mm)
Environmental ResistanceSpecifies operating conditions (-40 C to +70 C, dust/water protection)
Output TypeIdentifies electrical interface (NPN/PNP, analog/digital)

5. Application Fields

Key industries include: - Automotive Manufacturing: Robotic welding verification - Logistics: Parcel dimension measurement systems - Food Processing: Fill-level detection in transparent containers - Electronics Assembly: Component presence verification - Medical Devices: Lab automation sample tracking Example: In automotive production lines, photoelectric sensors detect door panel alignment with 0.1mm precision at 2m/s conveyor speeds.

6. Leading Manufacturers and Products

ManufacturerCountryRepresentative Product
SiemensGermanyOBT1-16GM300-S91L
OmronJapanE3Z-T61
KeyenceJapanLKG50A-W15T
Pepperl+FuchsGermanyR2000-6
BalluffUSABOS 18M

7. Selection Recommendations

Key considerations: 1. Detection requirements: Distance, object size, and speed 2. Environmental factors: Ambient light, temperature, and contamination 3. Installation constraints: Space limitations and mounting options 4. Output requirements: Digital/analog signal compatibility 5. Cost-benefit analysis: Balancing precision with operational budgets Example: Choose fiber optic sensors for high-temperature furnace applications exceeding 100 C.

8. Industry Trend Analysis

Current development trends include: - Miniaturization through MEMS technology (sensor size reduction by 40% since 2015) - Integration of AI algorithms for adaptive threshold adjustment - Wireless communication capabilities (Bluetooth/Wi-Fi 6 adoption) - Increased sensitivity in visible light spectrum (enhanced color detection) - Growth in safety-rated sensors (SIL2/PLc compliance) Market projections indicate 8.2% CAGR through 2027 driven by Industry 4.0 adoption.

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