Optical Sensors - Photoelectric, Industrial

Image Part Number Description / PDF Quantity Rfq
GRTE18-N2417

GRTE18-N2417

SICK

SENSOR PROXIMITY 115MM NPN

0

WL12G-3B2531T01

WL12G-3B2531T01

SICK

SENSOR RETROREFLECTVE 4M NPN/PNP

0

EL4-E2428

EL4-E2428

SICK

SENSOR RETROREFLECTIVE 4.8M NPN

0

ZT1-P5215

ZT1-P5215

SICK

SENSOR PROXIMITY 10MM NPN DO/LO

0

WTT12L-B1543

WTT12L-B1543

SICK

SENSOR PROX 1.8M NPN/PNP 2M CBL

0

HTE18-B4A2BF

HTE18-B4A2BF

SICK

SENSOR PROXIMITY 600MM NPN/PNP

0

WTB9L-3N2461

WTB9L-3N2461

SICK

SENSOR PROXIMITY 300MM NPN

0

GRTE18S-P2317

GRTE18S-P2317

SICK

SENSOR PROXIMITY 115MM PNP

0

HSE18-A3A2BA

HSE18-A3A2BA

SICK

SENSOR THROUGH-BEAM 25M NPN/PNP

0

KT5G-2N1351

KT5G-2N1351

SICK

SENSOR CONT 40MM NPN

0

WSE4-3F3130

WSE4-3F3130

SICK

SENSOR THROUGH-BEAM 3.5M PNP

0

WSE4SC-3P2230

WSE4SC-3P2230

SICK

SENSOR THROUGH-BEAM 5M PNP

0

HL18-L1G3AA

HL18-L1G3AA

SICK

SENSOR RETROREFLECTIVE 6.5M

0

HTE18-P3A2BB

HTE18-P3A2BB

SICK

SENSOR PROXIMITY 600MM PNP

0

WT2F-P440

WT2F-P440

SICK

SENSOR PROXIMITY 18MM PNP

0

EL3-E2638

EL3-E2638

SICK

SENSOR RETROREFLECTIVE 4.8M NPN

0

HSE18L-P3A5AA

HSE18L-P3A5AA

SICK

SENSOR THROUGH-BEAM 60M PNP

0

GRL18-P2437

GRL18-P2437

SICK

SENSOR RETROREFLECTIVE 7.2M PNP

0

HL18G-B4A3AL

HL18G-B4A3AL

SICK

SENSOR RETROREFLECTVE 3M NPN/PNP

0

HSE18L-N4A5AA

HSE18L-N4A5AA

SICK

SENSOR THROUGH-BEAM 60M NPN

0

Optical Sensors - Photoelectric, Industrial

1. Overview

Industrial photoelectric sensors are optoelectronic devices that detect the presence or absence of objects by emitting and receiving light beams. These sensors convert optical signals into electrical signals through photodetection mechanisms, enabling non-contact measurement and control in industrial environments. Their importance lies in enabling automation, improving production efficiency, and ensuring process reliability across various sectors including manufacturing, logistics, and quality control.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Through-Beam SensorsSeparate emitter and receiver units for high detection accuracyConveyor belt object counting
Reflective SensorsSingle unit with reflector for compact installationsPackaging integrity verification
Diffuse SensorsObject-reflective detection without separate reflectorColor contrast detection in sorting systems
Fiber Optic SensorsFlexible light transmission for confined spacesSemiconductor manufacturing equipment
Slot SensorsU-shaped design for precise positional detectionPrinted circuit board alignment systems

3. Structure and Components

Typical construction includes: 1) Light source (LED/Laser diode) emitting specific wavelengths (660nm-950nm) 2) Photodetector (photodiode/CCD array) for signal reception 3) Signal processing circuitry with amplification and threshold detection 4) Protective housing with optical window (IP65-IP69K ratings) 5) Electrical interface (2-wire/3-wire configurations) Advanced models integrate temperature compensation and digital communication protocols (IO-Link).

4. Key Technical Specifications

ParameterSignificance
Detection RangeDetermines maximum operational distance (20mm-50m)
Response TimeMeasures detection speed (10 s-2ms)
AccuracyDefines position detection precision ( 0.02mm)
Environmental ResistanceSpecifies operating conditions (-40 C to +70 C, dust/water protection)
Output TypeIdentifies electrical interface (NPN/PNP, analog/digital)

5. Application Fields

Key industries include: - Automotive Manufacturing: Robotic welding verification - Logistics: Parcel dimension measurement systems - Food Processing: Fill-level detection in transparent containers - Electronics Assembly: Component presence verification - Medical Devices: Lab automation sample tracking Example: In automotive production lines, photoelectric sensors detect door panel alignment with 0.1mm precision at 2m/s conveyor speeds.

6. Leading Manufacturers and Products

ManufacturerCountryRepresentative Product
SiemensGermanyOBT1-16GM300-S91L
OmronJapanE3Z-T61
KeyenceJapanLKG50A-W15T
Pepperl+FuchsGermanyR2000-6
BalluffUSABOS 18M

7. Selection Recommendations

Key considerations: 1. Detection requirements: Distance, object size, and speed 2. Environmental factors: Ambient light, temperature, and contamination 3. Installation constraints: Space limitations and mounting options 4. Output requirements: Digital/analog signal compatibility 5. Cost-benefit analysis: Balancing precision with operational budgets Example: Choose fiber optic sensors for high-temperature furnace applications exceeding 100 C.

8. Industry Trend Analysis

Current development trends include: - Miniaturization through MEMS technology (sensor size reduction by 40% since 2015) - Integration of AI algorithms for adaptive threshold adjustment - Wireless communication capabilities (Bluetooth/Wi-Fi 6 adoption) - Increased sensitivity in visible light spectrum (enhanced color detection) - Growth in safety-rated sensors (SIL2/PLc compliance) Market projections indicate 8.2% CAGR through 2027 driven by Industry 4.0 adoption.

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