Optical Sensors - Photoelectric, Industrial

Image Part Number Description / PDF Quantity Rfq
WTB9M4L-3P2461

WTB9M4L-3P2461

SICK

SENSOR PROXIMITY 10MM NPN DO/LO

0

WTB2S-2N1175

WTB2S-2N1175

SICK

SENSOR PROXIMITY 90MM NPN

0

GL6G-P4211

GL6G-P4211

SICK

SENSOR RETROREFLECTIVE 6MM PNP

0

WSE4S-3E2130

WSE4S-3E2130

SICK

SENSOR THROUGH-BEAM 5M NPN

0

HTE18-F1G1BB

HTE18-F1G1BB

SICK

SENSOR PROXIMITY 1M PUSH/PULL

0

WSE12-3P2411T01

WSE12-3P2411T01

SICK

SENSOR THROUGH-BEAM 20M PNP

0

HTB18-P4A2BAD06

HTB18-P4A2BAD06

SICK

SENSOR PROXIMITY 150MM PNP

0

WLG4S-3F2434V

WLG4S-3F2434V

SICK

SENSOR RETROREFLECTIVE 5M PNP

0

WTV4-3P3222S60

WTV4-3P3222S60

SICK

SENSOR PROXIMITY 50MM PNP

0

EL3-N2828

EL3-N2828

SICK

SENSOR RETROREFLECTIVE 4.8M NPN

0

WLG4-3F3132

WLG4-3F3132

SICK

SENSOR RETROREFLECTIVE 4.5M PNP

0

HTE18-P3A1BB

HTE18-P3A1BB

SICK

SENSOR PROXIMITY 1M PNP

0

WTB9-3F3111

WTB9-3F3111

SICK

SENSOR PROXIMITY 500MM PNP

0

ET3-N4228

ET3-N4228

SICK

SENSOR PROXIMITY 10MM NPN DO/LO

0

GTB10-N1211

GTB10-N1211

SICK

SENSOR PROXIMITY 950MM NPN

0

WL4-3N3130

WL4-3N3130

SICK

SENSOR RETROREFL 10MM NPN DO/LO

0

WSE2S-2P3230

WSE2S-2P3230

SICK

SENSOR THROUGH-BEAM 2.5M PNP

0

WSE4-3E2130

WSE4-3E2130

SICK

SENSOR THRU-BEAM 10MM NPN DO/LO

0

WTB4S-3P2462V

WTB4S-3P2462V

SICK

SENSOR PROXIMITY 500MM PNP

0

HSE18-P4C2BA

HSE18-P4C2BA

SICK

SENSOR THROUGH-BEAM 25M PNP

0

Optical Sensors - Photoelectric, Industrial

1. Overview

Industrial photoelectric sensors are optoelectronic devices that detect the presence or absence of objects by emitting and receiving light beams. These sensors convert optical signals into electrical signals through photodetection mechanisms, enabling non-contact measurement and control in industrial environments. Their importance lies in enabling automation, improving production efficiency, and ensuring process reliability across various sectors including manufacturing, logistics, and quality control.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Through-Beam SensorsSeparate emitter and receiver units for high detection accuracyConveyor belt object counting
Reflective SensorsSingle unit with reflector for compact installationsPackaging integrity verification
Diffuse SensorsObject-reflective detection without separate reflectorColor contrast detection in sorting systems
Fiber Optic SensorsFlexible light transmission for confined spacesSemiconductor manufacturing equipment
Slot SensorsU-shaped design for precise positional detectionPrinted circuit board alignment systems

3. Structure and Components

Typical construction includes: 1) Light source (LED/Laser diode) emitting specific wavelengths (660nm-950nm) 2) Photodetector (photodiode/CCD array) for signal reception 3) Signal processing circuitry with amplification and threshold detection 4) Protective housing with optical window (IP65-IP69K ratings) 5) Electrical interface (2-wire/3-wire configurations) Advanced models integrate temperature compensation and digital communication protocols (IO-Link).

4. Key Technical Specifications

ParameterSignificance
Detection RangeDetermines maximum operational distance (20mm-50m)
Response TimeMeasures detection speed (10 s-2ms)
AccuracyDefines position detection precision ( 0.02mm)
Environmental ResistanceSpecifies operating conditions (-40 C to +70 C, dust/water protection)
Output TypeIdentifies electrical interface (NPN/PNP, analog/digital)

5. Application Fields

Key industries include: - Automotive Manufacturing: Robotic welding verification - Logistics: Parcel dimension measurement systems - Food Processing: Fill-level detection in transparent containers - Electronics Assembly: Component presence verification - Medical Devices: Lab automation sample tracking Example: In automotive production lines, photoelectric sensors detect door panel alignment with 0.1mm precision at 2m/s conveyor speeds.

6. Leading Manufacturers and Products

ManufacturerCountryRepresentative Product
SiemensGermanyOBT1-16GM300-S91L
OmronJapanE3Z-T61
KeyenceJapanLKG50A-W15T
Pepperl+FuchsGermanyR2000-6
BalluffUSABOS 18M

7. Selection Recommendations

Key considerations: 1. Detection requirements: Distance, object size, and speed 2. Environmental factors: Ambient light, temperature, and contamination 3. Installation constraints: Space limitations and mounting options 4. Output requirements: Digital/analog signal compatibility 5. Cost-benefit analysis: Balancing precision with operational budgets Example: Choose fiber optic sensors for high-temperature furnace applications exceeding 100 C.

8. Industry Trend Analysis

Current development trends include: - Miniaturization through MEMS technology (sensor size reduction by 40% since 2015) - Integration of AI algorithms for adaptive threshold adjustment - Wireless communication capabilities (Bluetooth/Wi-Fi 6 adoption) - Increased sensitivity in visible light spectrum (enhanced color detection) - Growth in safety-rated sensors (SIL2/PLc compliance) Market projections indicate 8.2% CAGR through 2027 driven by Industry 4.0 adoption.

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