| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
SICK |
SENSOR THROUGH-BEAM 20M PNP |
0 |
|
|
SICK |
SENSOR PROXIMITY 150MM PNP |
0 |
|
|
SICK |
SENSOR PROXIMITY 950MM NPN |
0 |
|
|
SICK |
SENSOR PROXIMITY 50MM PNP |
0 |
|
|
SICK |
SENSOR PROXIMITY 3.8M NPN/PNP |
0 |
|
|
SICK |
SENSOR RETROREFLECTIVE 15M NPN |
0 |
|
|
SICK |
SENSOR RETROREFLECTIVE 6.5M |
0 |
|
|
SICK |
SENSOR PROXIMITY 60MM NPN |
0 |
|
|
SICK |
SENSOR RETROREFL 10MM NPN DO/LO |
0 |
|
|
SICK |
SENSOR PROXIMITY 1.1M PNP |
0 |
|
|
SICK |
SENSOR PROXIMITY 50MM PNP |
0 |
|
|
SICK |
SENSOR THROUGH-BEAM 4M PNP |
0 |
|
|
SICK |
SENSOR PROXIMITY 100MM PNP |
0 |
|
|
SICK |
SENSOR RETROREFLECTIVE 5MM PNP |
0 |
|
|
SICK |
SENSOR RETROREFLECTIVE 1.2M PNP |
0 |
|
|
SICK |
SENSOR PROXIMITY 100MM PNP |
0 |
|
|
SICK |
SENSOR RETROREFLECTIVE 4.8M PNP |
0 |
|
|
SICK |
SENSOR RETROREFLECTIVE 15M NPN |
0 |
|
|
SICK |
SENSOR PROXIMITY 400MM PNP |
0 |
|
|
SICK |
SENSOR RETROREFLECTIVE 6.5M PNP |
0 |
|
Industrial photoelectric sensors are optoelectronic devices that detect the presence or absence of objects by emitting and receiving light beams. These sensors convert optical signals into electrical signals through photodetection mechanisms, enabling non-contact measurement and control in industrial environments. Their importance lies in enabling automation, improving production efficiency, and ensuring process reliability across various sectors including manufacturing, logistics, and quality control.
| Type | Functional Characteristics | Application Examples |
|---|---|---|
| Through-Beam Sensors | Separate emitter and receiver units for high detection accuracy | Conveyor belt object counting |
| Reflective Sensors | Single unit with reflector for compact installations | Packaging integrity verification |
| Diffuse Sensors | Object-reflective detection without separate reflector | Color contrast detection in sorting systems |
| Fiber Optic Sensors | Flexible light transmission for confined spaces | Semiconductor manufacturing equipment |
| Slot Sensors | U-shaped design for precise positional detection | Printed circuit board alignment systems |
Typical construction includes: 1) Light source (LED/Laser diode) emitting specific wavelengths (660nm-950nm) 2) Photodetector (photodiode/CCD array) for signal reception 3) Signal processing circuitry with amplification and threshold detection 4) Protective housing with optical window (IP65-IP69K ratings) 5) Electrical interface (2-wire/3-wire configurations) Advanced models integrate temperature compensation and digital communication protocols (IO-Link).
| Parameter | Significance |
|---|---|
| Detection Range | Determines maximum operational distance (20mm-50m) |
| Response Time | Measures detection speed (10 s-2ms) |
| Accuracy | Defines position detection precision ( 0.02mm) |
| Environmental Resistance | Specifies operating conditions (-40 C to +70 C, dust/water protection) |
| Output Type | Identifies electrical interface (NPN/PNP, analog/digital) |
Key industries include: - Automotive Manufacturing: Robotic welding verification - Logistics: Parcel dimension measurement systems - Food Processing: Fill-level detection in transparent containers - Electronics Assembly: Component presence verification - Medical Devices: Lab automation sample tracking Example: In automotive production lines, photoelectric sensors detect door panel alignment with 0.1mm precision at 2m/s conveyor speeds.
| Manufacturer | Country | Representative Product |
|---|---|---|
| Siemens | Germany | OBT1-16GM300-S91L |
| Omron | Japan | E3Z-T61 |
| Keyence | Japan | LKG50A-W15T |
| Pepperl+Fuchs | Germany | R2000-6 |
| Balluff | USA | BOS 18M |
Key considerations: 1. Detection requirements: Distance, object size, and speed 2. Environmental factors: Ambient light, temperature, and contamination 3. Installation constraints: Space limitations and mounting options 4. Output requirements: Digital/analog signal compatibility 5. Cost-benefit analysis: Balancing precision with operational budgets Example: Choose fiber optic sensors for high-temperature furnace applications exceeding 100 C.
Current development trends include: - Miniaturization through MEMS technology (sensor size reduction by 40% since 2015) - Integration of AI algorithms for adaptive threshold adjustment - Wireless communication capabilities (Bluetooth/Wi-Fi 6 adoption) - Increased sensitivity in visible light spectrum (enhanced color detection) - Growth in safety-rated sensors (SIL2/PLc compliance) Market projections indicate 8.2% CAGR through 2027 driven by Industry 4.0 adoption.