Motion Sensors - Accelerometers

Image Part Number Description / PDF Quantity Rfq
MMA1251KEG

MMA1251KEG

NXP Semiconductors

ACCELEROMETER 5G ANALOG 16SOIC

0

MMA6811AKGCWR2

MMA6811AKGCWR2

NXP Semiconductors

ACCELEROMETER 10BIT SPI 16QFN

0

MMA1631NKW

MMA1631NKW

NXP Semiconductors

IC SENSOR ACCELEROMETER 16QFN

0

PMMA9550LT

PMMA9550LT

NXP Semiconductors

IC ACCEL 3-AXIS LOW G

0

MMA5248NPKGWR2

MMA5248NPKGWR2

NXP Semiconductors

ACCELEROMETER PSI5 16QFN

0

PMMA3204KEGR2

PMMA3204KEGR2

NXP Semiconductors

IC ACCEL XY 100 / 30G SOIC-20

0

SX5100P1T1

SX5100P1T1

NXP Semiconductors

ACCELEROMETER

0

SX5100P1KT1

SX5100P1KT1

NXP Semiconductors

ACCELEROMETER

0

MMA5224NPKWR2

MMA5224NPKWR2

NXP Semiconductors

ACCELEROMETER PSI5 16QFN

0

MMA5106KWR2

MMA5106KWR2

NXP Semiconductors

ACCELEROMETER 60G PCM/SPI 16QFN

0

PMMA9553LR1

PMMA9553LR1

NXP Semiconductors

IC ACCEL 3-AXIS LOW G PEDOMETER

0

MMA6811LKCWR2

MMA6811LKCWR2

NXP Semiconductors

ACCELEROMETER 10BIT SPI 16QFN

0

PMMA8205KEGR2

PMMA8205KEGR2

NXP Semiconductors

IC ACCEL X- AXIS 50G SOIC 16

0

MMA6821AKGCWR2

MMA6821AKGCWR2

NXP Semiconductors

ACCELEROMETER 10BIT SPI 16QFN

0

MMA5148NDKGWR2

MMA5148NDKGWR2

NXP Semiconductors

ACCELEROMETER PSI5 16QFN

0

MMA6210KVWR2

MMA6210KVWR2

NXP Semiconductors

ACCELEROMETER PSI5 16QFN

0

PMMA1254KEGR2

PMMA1254KEGR2

NXP Semiconductors

IC ACCEL 5G Z-AXIS

0

MMA5148NPIKGWR2

MMA5148NPIKGWR2

NXP Semiconductors

ACCELEROMETER PSI5 16QFN

0

MMA2201KEG

MMA2201KEG

NXP Semiconductors

ACCELEROMETER 40G ANALOG 16SOIC

0

MMA5224NDKGWR2

MMA5224NDKGWR2

NXP Semiconductors

ACCELEROMETER PSI5 16QFN

0

Motion Sensors - Accelerometers

1. Overview

Accelerometers are motion sensors that measure acceleration forces (static or dynamic) along one or multiple axes. These devices convert mechanical motion into electrical signals, enabling quantitative analysis of vibration, tilt, shock, and dynamic movement. As core components in modern sensing systems, accelerometers play critical roles in consumer electronics, industrial automation, automotive safety systems, and aerospace navigation.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Capacitive MEMSHigh sensitivity, low power consumption, digital outputSmartphones, wearable devices
PiezoelectricSelf-powered, excellent frequency responseVibration analysis, impact detection
PiezoresistiveHigh shock tolerance, analog outputAutomotive crash testing, industrial monitoring
Servo (Force-Balance)Ultra-high precision, low noiseInertial navigation, seismic monitoring
Optical MEMSImmune to electromagnetic interferenceHigh-precision scientific instruments

3. Structure and Components

Typical accelerometers consist of: - Seismic mass with specific inertial properties - Elastic suspension elements (springs or beams) - Displacement detection circuit (capacitive, piezoelectric, or resistive) - Temperature compensation circuitry - Signal conditioning electronics - Protective housing (metal/ceramic/polymer) Modern MEMS devices integrate microstructures on silicon substrates with digital interfaces (I2C/SPI).

4. Key Technical Specifications

ParameterDescriptionImportance
Measurement Range 2g to 500gDetermines application suitability
Resolution0.1mg to 10mgImpacts measurement precision
Frequency ResponseDC to 10kHzAffects dynamic signal capture
Nonlinearity 0.1% to 1% FSMeasurement accuracy indicator
Temperature Range-40 C to +150 CEnvironmental reliability
Power Consumption5 A to 10mABattery life consideration

5. Application Fields

  • Consumer Electronics: Smartphones (screen rotation), gaming controllers
  • Automotive: Airbag deployment, electronic stability control (ESC)
  • Industrial: Predictive maintenance systems, vibration monitoring
  • Healthcare: Fall detection devices, rehabilitation equipment
  • Aerospace: Flight control systems, structural health monitoring
  • Case Study: iPhone's ADXL345 MEMS accelerometer enables step counting and orientation detection

6. Leading Manufacturers

ManufacturerRepresentative ProductKey Features
Analog DevicesADXL3453-axis, 13-bit resolution, I2C interface
STMicroelectronicsLSM6DSO6-axis IMU, AI-enabled edge computing
Bosch SensortecBMI270Low-power wearable sensor, 16Hz noise
TE ConnectivityKX134-1211 400g high-shock measurement
HoneywellQA-750Tactical-grade servo accelerometer

7. Selection Guidelines

  • Determine required measurement axes (1D/2D/3D)
  • Match range/sensitivity with application requirements
  • Assess environmental conditions (temperature, vibration)
  • Select appropriate output interface (analog/digital)
  • Evaluate power consumption constraints
  • Consider calibration requirements and long-term stability

8. Industry Trends

Key development directions include: - MEMS technology advancement towards atomic-scale sensitivity - Integration with gyroscopes and AI processing (smart sensors) - Wireless sensor network compatibility - Increased adoption in autonomous vehicles and IoT edge devices - Development of ultra-low-power wake-up accelerometers - Fiber optic accelerometer systems for aerospace applications - Enhanced shock survivability for industrial harsh environments

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