Motion Sensors - Accelerometers

Image Part Number Description / PDF Quantity Rfq
SX2530KVWT1

SX2530KVWT1

NXP Semiconductors

ACCELEROMETER

0

MMA1220KEGR2

MMA1220KEGR2

NXP Semiconductors

ACCELEROMETER 8G ANALOG 16SOIC

0

MMA2725W

MMA2725W

NXP Semiconductors

ACCELEROMETER 250G PCM/SPI 16QFN

0

MMA5248NPKGCWR2

MMA5248NPKGCWR2

NXP Semiconductors

ACCELEROMETER PSI5 16QFN

0

PMMA1252KEGR2

PMMA1252KEGR2

NXP Semiconductors

IC ACCEL 5G Z-AXIS

0

MMA5106NDKGCWR2

MMA5106NDKGCWR2

NXP Semiconductors

ACCELEROMETER DSI2.5 16QFN

0

MMA5112NPIKWR2

MMA5112NPIKWR2

NXP Semiconductors

ACCELEROMETER PSI5 16QFN

0

MMA5248NDIKGWR2

MMA5248NDIKGWR2

NXP Semiconductors

ACCELEROMETER PSI5 16QFN

0

MMA5124NDKGCWR2

MMA5124NDKGCWR2

NXP Semiconductors

ACCELEROMETER PSI5 16QFN

0

PMMA9553LT

PMMA9553LT

NXP Semiconductors

IC ACCEL PQ38K 8544 PB

0

SX1533KWT1

SX1533KWT1

NXP Semiconductors

ACCELEROMETER

0

MMA2702W

MMA2702W

NXP Semiconductors

ACCELEROMETER 25G PCM/SPI 16QFN

0

MMA5112NDKGWR2

MMA5112NDKGWR2

NXP Semiconductors

ACCELEROMETER PCM/SPI 16QFN

0

SX5148P1LCWT1

SX5148P1LCWT1

NXP Semiconductors

ACCELEROMETER

0

MMA5206NPKGWR2

MMA5206NPKGWR2

NXP Semiconductors

ACCELEROMETER PSI5 16QFN

0

PMMA3204KEG

PMMA3204KEG

NXP Semiconductors

IC ACCEL XY 100 / 30G SOIC-20

0

SX5101P4KT1

SX5101P4KT1

NXP Semiconductors

ACCELEROMETER

0

MMA5248W

MMA5248W

NXP Semiconductors

ACCELEROMETER 480G 16QFN

0

MMA2718W

MMA2718W

NXP Semiconductors

ACCELEROMETER 187G PCM/SPI 16QFN

0

MMA6828AKGWR2

MMA6828AKGWR2

NXP Semiconductors

ACCELEROMETER 10BIT SPI 16QFN

0

Motion Sensors - Accelerometers

1. Overview

Accelerometers are motion sensors that measure acceleration forces (static or dynamic) along one or multiple axes. These devices convert mechanical motion into electrical signals, enabling quantitative analysis of vibration, tilt, shock, and dynamic movement. As core components in modern sensing systems, accelerometers play critical roles in consumer electronics, industrial automation, automotive safety systems, and aerospace navigation.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Capacitive MEMSHigh sensitivity, low power consumption, digital outputSmartphones, wearable devices
PiezoelectricSelf-powered, excellent frequency responseVibration analysis, impact detection
PiezoresistiveHigh shock tolerance, analog outputAutomotive crash testing, industrial monitoring
Servo (Force-Balance)Ultra-high precision, low noiseInertial navigation, seismic monitoring
Optical MEMSImmune to electromagnetic interferenceHigh-precision scientific instruments

3. Structure and Components

Typical accelerometers consist of: - Seismic mass with specific inertial properties - Elastic suspension elements (springs or beams) - Displacement detection circuit (capacitive, piezoelectric, or resistive) - Temperature compensation circuitry - Signal conditioning electronics - Protective housing (metal/ceramic/polymer) Modern MEMS devices integrate microstructures on silicon substrates with digital interfaces (I2C/SPI).

4. Key Technical Specifications

ParameterDescriptionImportance
Measurement Range 2g to 500gDetermines application suitability
Resolution0.1mg to 10mgImpacts measurement precision
Frequency ResponseDC to 10kHzAffects dynamic signal capture
Nonlinearity 0.1% to 1% FSMeasurement accuracy indicator
Temperature Range-40 C to +150 CEnvironmental reliability
Power Consumption5 A to 10mABattery life consideration

5. Application Fields

  • Consumer Electronics: Smartphones (screen rotation), gaming controllers
  • Automotive: Airbag deployment, electronic stability control (ESC)
  • Industrial: Predictive maintenance systems, vibration monitoring
  • Healthcare: Fall detection devices, rehabilitation equipment
  • Aerospace: Flight control systems, structural health monitoring
  • Case Study: iPhone's ADXL345 MEMS accelerometer enables step counting and orientation detection

6. Leading Manufacturers

ManufacturerRepresentative ProductKey Features
Analog DevicesADXL3453-axis, 13-bit resolution, I2C interface
STMicroelectronicsLSM6DSO6-axis IMU, AI-enabled edge computing
Bosch SensortecBMI270Low-power wearable sensor, 16Hz noise
TE ConnectivityKX134-1211 400g high-shock measurement
HoneywellQA-750Tactical-grade servo accelerometer

7. Selection Guidelines

  • Determine required measurement axes (1D/2D/3D)
  • Match range/sensitivity with application requirements
  • Assess environmental conditions (temperature, vibration)
  • Select appropriate output interface (analog/digital)
  • Evaluate power consumption constraints
  • Consider calibration requirements and long-term stability

8. Industry Trends

Key development directions include: - MEMS technology advancement towards atomic-scale sensitivity - Integration with gyroscopes and AI processing (smart sensors) - Wireless sensor network compatibility - Increased adoption in autonomous vehicles and IoT edge devices - Development of ultra-low-power wake-up accelerometers - Fiber optic accelerometer systems for aerospace applications - Enhanced shock survivability for industrial harsh environments

RFQ BOM Call Skype Email
Top