| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Melexis |
SENSOR HALL EFFECT SPI 8SOIC |
0 |
|
 |
Silicon Labs |
SENSOR HALL EFFECT ANALOG SOT23 |
2989 |
|
 |
Asahi Kasei Microdevices / AKM Semiconductor |
SENSOR HALL I2C/SPI 14WLCSP |
6045 |
|
 |
TDK Micronas |
SENSOR HALL ANALOG TO226-3 |
0 |
|
 |
Allegro MicroSystems |
SENSOR HALL ANALOG 8TSSOP |
0 |
|
 |
NVE Corporation |
SENSOR MR WHEAT BRDG 8SOIC |
18085428 |
|
 |
Texas Instruments |
DRIVER |
0 |
|
 |
Melexis |
SENSOR HALL EFFECT SPI 8SOIC |
0 |
|
 |
Allegro MicroSystems |
SENSOR HALL ANALOG/PWM 8TSSOP |
953 |
|
 |
Texas Instruments |
DRV5053-Q1 AUTOMOTIVE, 2.7 V TO |
38687 |
|
 |
Allegro MicroSystems |
SENSOR HALL EFFECT ANALOG 3SSIP |
0 |
|
 |
Melexis |
SENSOR HALL I2C/SPI 16QFN |
19661 |
|
 |
Silicon Labs |
IC HALL SENSOR 0X31 DFN8 |
0 |
|
 |
IR (Infineon Technologies) |
TLE4998 - PROGRAMMABLE LINEAR HA |
26940 |
|
 |
Allegro MicroSystems |
SENSOR HALL EFFECT PWM 3SIP |
724 |
|
 |
Asahi Kasei Microdevices / AKM Semiconductor |
SENSOR HALL EFFECT ANALOG 4SIP |
0 |
|
 |
Texas Instruments |
DRIVER |
988 |
|
 |
Allegro MicroSystems |
SENSOR HALL ANALOG 6MLP/DFN |
16196 |
|
 |
Texas Instruments |
SENSOR HALL EFFECT ANALOG TO92-3 |
5368 |
|
 |
TDK Micronas |
SENSOR HALL EFFECT ANALOG 8SOIC |
0 |
|
Magnetic sensors - linear compass ICs are semiconductor devices that detect magnetic fields and convert them into electrical signals. These integrated circuits provide precise measurement of magnetic field direction and strength in linear axes, enabling 2D/3D orientation detection. Their importance spans multiple industries due to their ability to provide contactless position sensing, navigation capabilities, and magnetic field monitoring in compact form factors.
| Type | Functional Features | Application Examples |
|---|---|---|
| Hall Effect Sensors | Voltage output proportional to magnetic field strength, simple design | Current sensing, proximity detection |
| Anisotropic Magnetoresistance (AMR) Sensors | High sensitivity (0.1 accuracy), low power consumption | Electronic compasses, navigation systems |
| Giant Magnetoresistance (GMR) Sensors | Ultra-high sensitivity (nanotesla range), wide bandwidth | Biomedical devices, industrial position control |
| Tunneling Magnetoresistance (TMR) Sensors | Lowest power consumption, excellent thermal stability | IoT devices, automotive safety systems |
Typical construction includes: - Sensing element (Hall plate/AMR film/TMR junction) - Signal conditioning circuitry (amplifiers, ADCs) - Temperature compensation modules - Digital interface (I2C/SPI) Packaged in LGA/QFN formats (2-8mm sizes) with magnetic shielding layers. Advanced versions integrate sensor fusion algorithms for 3-axis measurement.
| Parameter | Description & Importance |
|---|---|
| Sensitivity (mV/Gauss) | Determines minimum detectable field strength |
| Resolution ( T/LSB) | Affects angle measurement precision (critical for navigation) |
| Operating Temperature (-40 to +125 C) | Defines environmental suitability |
| Power Consumption ( A/mA) | Crucial for battery-powered devices |
| Interface Type | I2C/SPI for digital output, analog for raw signals |
Main industries include: - Consumer Electronics: Smartphone compasses, AR/VR headsets - Automotive: EPS systems, vehicle detection - Industrial: Robotics, CNC machine tool positioning - Aerospace: Drone stabilization systems - Medical: Surgical tool tracking
| Manufacturer | Product Series | Key Specifications |
|---|---|---|
| STMicroelectronics | LIS3MDL | 50 Gauss range, 0.08 T/LSB, I2C/SPI |
| Honeywell | HMC5883L | 80 Hz bandwidth, 2-4 Gauss accuracy |
| NXP Semiconductors | MFX7755 | 3D sensing, 0.1 heading accuracy |
| TDK-InvenSense | ICM-20948 | 9-axis MEMS+mag, 0.15 mA operating current |
Key consideration factors: - Required measurement axis (2D vs 3D) - Environmental conditions (temperature, vibration) - Power budget constraints - Required accuracy vs cost trade-offs - Interface compatibility with host system - Calibration requirements (hard/soft iron compensation)
Current development directions: - Integration with MEMS IMUs for sensor fusion - AI-based self-calibration algorithms - Sub-10 A ultra-low power consumption - Increased radiation hardness for space applications - Development of 4D magnetic field-time sensors