| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Sanyo Semiconductor/ON Semiconductor |
IC P1317MC-A6-R FILTER ESD |
0 |
|
|
ams |
NE2D_RGB_FOV90F6.0_NB_2M FT SE |
0 |
|
|
ams |
DR2X8K7_INVAR_B&W_V4 FT SE |
0 |
|
|
ams |
DR4K7_INVAR_B&W_BM_V4 FT SE |
0 |
|
|
ams |
DR16K3.5_INVAR_B&W_V5 FT SE |
0 |
|
|
ams |
NE_4.0_PATTERN_AWAIBA_12_350UM R |
0 |
|
|
ams |
NE2D_RGB_FOV120_F4.0_3M FT SE |
0 |
|
|
Lepton (FLIR Lepton) |
THERMAL IMAGE SENSOR 80X60 |
0 |
|
|
ams |
IMAGE SENSOR 250HX250V NO CABLE |
0 |
|
|
ams |
NE2D_RGB_FOV90F4.0_FT SE |
0 |
|
|
ams |
SENSOR B & W CERAMIC |
0 |
|
|
ams |
DR8K7_INVAR_B&W_BM_V5 FT SE |
0 |
|
|
OmniVision Technologies |
CAMERA CHIP SENSOR |
0 |
|
|
ams |
DR2X2K7_LCC_RGB_CERAMIC_V1.0 FT |
0 |
|
|
ams |
IMAGE SENSOR 250HX250V 3UMX3UM |
0 |
|
|
ams |
NE2D_RGB_FOV90_F6.0 CLOSERF FT S |
0 |
|
|
ams |
DR2K7_LCC_B&W_BM_CERAMIC_V1.0 FT |
0 |
|
|
ams |
IMAGE SENSOR 250HX250V LED RING |
0 |
|
|
ams |
DR4K3.5_LCC_B&W_CERAMIC_V1.0 FT |
0 |
|
|
ams |
NE2D_B&W_FOV160_F2.4_2M FT SE |
0 |
|
Camera modules are integrated optoelectronic devices that convert optical images into digital signals. As critical components in sensors and transducers systems, they combine image sensors, lenses, and signal processing circuits to enable visual data acquisition in modern electronics. Their miniaturization, high performance, and cost-effectiveness have driven advancements in automation, healthcare, security, and consumer electronics.
| Type | Functional Characteristics | Application Examples |
|---|---|---|
| CMOS Image Sensors | Low power consumption, high integration, cost-effective | Smartphones, webcams |
| CCD Sensors | Superior image quality, high light sensitivity | Industrial inspection, astronomy |
| Infrared Cameras | Capture non-visible infrared spectrum | Night vision, thermal monitoring |
| 3D Depth Sensors | Generate spatial depth information | AR/VR, robotics |
| Global Shutter Modules | Eliminate motion distortion | High-speed industrial imaging |
| Low-light Cameras | Enhanced sensitivity in dark environments | Surveillance, autonomous vehicles |
A typical camera module consists of: - Optical Lens System: Focuses light onto the sensor - Image Sensor (CMOS/CCD): Converts photons to electrical signals - Image Signal Processor (ISP): Performs color correction and noise reduction - Interface Circuitry: Supports data transmission (MIPI, USB, etc.) - Mechanical Housing: Protects components and ensures optical alignment Advanced modules may integrate autofocus actuators, IR filters, or AI acceleration cores.
| Parameter | Description | Importance |
|---|---|---|
| Resolution | Pixel count (e.g., 1920 1080) | Determines image detail level |
| Frame Rate | Images per second (fps) | Critical for motion capture |
| Sensor Size | Physical dimensions (inches) | Affects light gathering capability |
| Dynamic Range | Light-to-dark ratio (dB) | Measures detail retention in extremes |
| Signal-to-Noise Ratio | Image clarity vs. noise | Impacts low-light performance |
| Interface Type | MIPI CSI-2, USB 3.0, etc. | Dictates system compatibility |
| Power Consumption | Operating current (mA) | Battery life consideration |
| Operating Temperature | Functional range ( C) | Environment suitability |
| Manufacturer | Representative Product | Key Features |
|---|---|---|
| Sony Semiconductor | IMX586 | 48MP CMOS sensor with 0.8 m pixels |
| onsemi | AR0234CS | 2.3MP automotive image sensor |
| Microsoft | Kinect Azure | 3D depth sensing with time-of-flight |
| Intel RealSense | D455 | HD depth camera with RGB sensor |
| Himax Technologies | HX-6320 | Low-power driver IC for camera modules |
Key considerations include: - Match resolution/frame rate to application needs - Evaluate environmental requirements (temperature, vibration) - Verify interface compatibility with host system - Balance cost with required image quality - Assess long-term supply stability - Consider additional features (autofocus, EIS support) - Test under actual lighting conditions
Emerging trends include: - Stacked CMOS sensors with AI processing cores - Multi-spectral imaging integration - Event-based vision sensors with microsecond response - Wafer-level optics for further miniaturization - Increased adoption of computational photography - Automotive-grade modules with ASIL-D functional safety