Camera Modules

Part Number	Description / PDF	Quantity
MVBLUEFOX-MLC205C-7111 Balluff	SINGLE BOARD CAM,MANY HW OPTIONS	3
MVBLUEFOX-MLC205C Balluff	SINGLE BOARD CAM,MANY HW OPTIONS	3
82635DSPWGPRQ Intel	REALSENSE DEPTH MODULE D420	100
NE2D_CHIP_RGB_SGA ams	NANEYE 2D SENSOR	0
MVBLUEFOX3-M2124AC-1112 Balluff	BOARD LEVEL CAM, MANY HW OPTIONS	3
NE2D_RGB_V120F2.8_2M ams	IMAGE SENSOR 250HX250V 3UMX3UM	0
NE2D_RGB_V120F4.0_2M ams	IMAGE SENSOR 250HX250V 3UMX3UM	0
MVBLUEFOX3-M1012BC-2111 Balluff	SINGLE BOARD CAM,MANY HW OPTIONS	3
82635DSF450 Intel	CAMERA DEPTH MODULE ID F450	0
4LS15K-5CIA ams	4LS15K-5CIA FT SE	0
MVBLUEFOX3-M1013G-2111 Balluff	SINGLE BOARD CAM,MANY HW OPTIONS	3
MVBLUEFOX3-M1031C-2111 Balluff	SINGLE BOARD CAM,MANY HW OPTIONS	3
NE2D_FIB_RGB_FOV90 ams	NE_FIBER_OPTIC_BOX_DEMO_ENDOSCOP	0
82635DSD450 Intel	REALSENSE DEPTH MODULE D450	82
OVM6946-KJ1C-0B1A-Z OmniVision Technologies	CAMERA CUBE CHIP	0
NE2D_RGB_V90F4.0_2M ams	IMAGE SENSOR 250HX250V 2M CABLE	0
OVM6948-RALA OmniVision Technologies	CAMERA CUBE CHIP	0
TB-3DCAM-8060-USB	TERABEE 3DCAM 80X60	3
NE2D_RGB_V90F4.0_3M ams	IMAGE SENSOR 250HX250V 3M CABLE	0
DR16K3.5_INVAR_B&W_V4_NOVREFC FT SE ams	DR16K3.5_INVAR_B&W_V4_NOVREFC FT	0

Camera Modules

1. Overview

Camera modules are integrated optoelectronic devices that convert optical images into digital signals. As critical components in sensors and transducers systems, they combine image sensors, lenses, and signal processing circuits to enable visual data acquisition in modern electronics. Their miniaturization, high performance, and cost-effectiveness have driven advancements in automation, healthcare, security, and consumer electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
CMOS Image Sensors	Low power consumption, high integration, cost-effective	Smartphones, webcams
CCD Sensors	Superior image quality, high light sensitivity	Industrial inspection, astronomy
Infrared Cameras	Capture non-visible infrared spectrum	Night vision, thermal monitoring
3D Depth Sensors	Generate spatial depth information	AR/VR, robotics
Global Shutter Modules	Eliminate motion distortion	High-speed industrial imaging
Low-light Cameras	Enhanced sensitivity in dark environments	Surveillance, autonomous vehicles

3. Structure and Components

A typical camera module consists of: - Optical Lens System: Focuses light onto the sensor - Image Sensor (CMOS/CCD): Converts photons to electrical signals - Image Signal Processor (ISP): Performs color correction and noise reduction - Interface Circuitry: Supports data transmission (MIPI, USB, etc.) - Mechanical Housing: Protects components and ensures optical alignment Advanced modules may integrate autofocus actuators, IR filters, or AI acceleration cores.

4. Key Technical Specifications

Parameter	Description	Importance
Resolution	Pixel count (e.g., 1920 1080)	Determines image detail level
Frame Rate	Images per second (fps)	Critical for motion capture
Sensor Size	Physical dimensions (inches)	Affects light gathering capability
Dynamic Range	Light-to-dark ratio (dB)	Measures detail retention in extremes
Signal-to-Noise Ratio	Image clarity vs. noise	Impacts low-light performance
Interface Type	MIPI CSI-2, USB 3.0, etc.	Dictates system compatibility
Power Consumption	Operating current (mA)	Battery life consideration
Operating Temperature	Functional range ( C)	Environment suitability

5. Application Fields

Consumer Electronics: Smartphone cameras, action cameras
Security Systems: IP cameras, doorbell cameras
Medical Imaging: Endoscopes, dermatology scanners
Automotive: ADAS vision systems, dash cams
Industrial Automation: Machine vision inspection systems

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
Sony Semiconductor	IMX586	48MP CMOS sensor with 0.8 m pixels
onsemi	AR0234CS	2.3MP automotive image sensor
Microsoft	Kinect Azure	3D depth sensing with time-of-flight
Intel RealSense	D455	HD depth camera with RGB sensor
Himax Technologies	HX-6320	Low-power driver IC for camera modules

7. Selection Recommendations

Key considerations include: - Match resolution/frame rate to application needs - Evaluate environmental requirements (temperature, vibration) - Verify interface compatibility with host system - Balance cost with required image quality - Assess long-term supply stability - Consider additional features (autofocus, EIS support) - Test under actual lighting conditions

Industry Trends Analysis

Emerging trends include: - Stacked CMOS sensors with AI processing cores - Multi-spectral imaging integration - Event-based vision sensors with microsecond response - Wafer-level optics for further miniaturization - Increased adoption of computational photography - Automotive-grade modules with ASIL-D functional safety