RFI and EMI - Shielding and Absorbing Materials

Image Part Number Description / PDF Quantity Rfq
IFL16-050RN1HRX300

IFL16-050RN1HRX300

TDK Corporation

EMI ABSORBER 100M X 300MM ROLL

0

IFL16-030NB300X200

IFL16-030NB300X200

TDK Corporation

EMI ABSORBER 300 X 200MM SHEET

6

IFL04-200NB300X200

IFL04-200NB300X200

TDK Corporation

NFC SHIELD 300 X 200MM SHEET

138

IRL02 200X200X2

IRL02 200X200X2

TDK Corporation

RF EMI ABSORB SHEET 7.874X7.874"

0

IRJ04 310X220X0.5

IRJ04 310X220X0.5

TDK Corporation

RF ABSORB SHEET 12.205"X8.661"

0

IRJ04 310X220X0.1

IRJ04 310X220X0.1

TDK Corporation

RF ABSORB SHEET 12.205"X8.661"

0

IBF15-100DD125X125B

IBF15-100DD125X125B

TDK Corporation

NFC SHIELD 125 X 125MM SHEET

0

IRL03AB 300X200X0.5

IRL03AB 300X200X0.5

TDK Corporation

RF ABSORB SHEET 11.811"X7.874"

0

IRJ17-200ND300X200

IRJ17-200ND300X200

TDK Corporation

RF ABSORB SHEET 11.811"X7.874"

0

IRJ17-300ND300X200

IRJ17-300ND300X200

TDK Corporation

RF ABSORB SHEET 11.811"X7.874"

0

IRB02A 300X300X1

IRB02A 300X300X1

TDK Corporation

RF ABSORB SHEET 11.811"X11.811"

0

IRJ09 310X220X0.1

IRJ09 310X220X0.1

TDK Corporation

RF ABSORB SHEET 12.205"X8.661"

0

IFL04AR 300X200XP1

IFL04AR 300X200XP1

TDK Corporation

NFC SHIELD 300 X 200MM SHEET

0

IRL02AB 300X200X0.05

IRL02AB 300X200X0.05

TDK Corporation

RF ABSORB SHEET 11.811"X7.874"

0

IRJ04AB 300X200X0.5

IRJ04AB 300X200X0.5

TDK Corporation

RF ABSORB SHEET 11.811"X7.874"

0

IRL04EAB 300X200X0.25

IRL04EAB 300X200X0.25

TDK Corporation

RF ABSORB SHEET 11.811"X7.874"

0

IRJ09AB 300X200X0.5

IRJ09AB 300X200X0.5

TDK Corporation

RF ABSORB SHEET 11.811"X7.874"

0

IRLG5 310X220X0.25

IRLG5 310X220X0.25

TDK Corporation

RF ABSORB SHEET 12.205"X8.661"

0

IRJ09AB 300X200X0.13

IRJ09AB 300X200X0.13

TDK Corporation

RF ABSORB SHEET 11.811"X7.874"

0

IRJ04-250ND300X200

IRJ04-250ND300X200

TDK Corporation

RF ABSORB SHEET 11.811"X7.874"

0

RFI and EMI - Shielding and Absorbing Materials

1. Overview

Radio Frequency Interference (RFI) and Electromagnetic Interference (EMI) are disruptive electromagnetic emissions that affect the performance of electronic devices. Shielding and absorbing materials mitigate these effects by blocking or dissipating electromagnetic energy. These materials are critical in RF/Intermediate Frequency (IF) circuits, RFID systems, and high-frequency electronics to ensure signal integrity, regulatory compliance, and operational reliability.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Metallic Shielding FoilsHigh conductivity, flexible, corrosion-resistant coatingsSmartphone enclosures, RFID tags
Conductive ElastomersElastomeric base with conductive fillers (e.g., silver, nickel)Aerospace connectors, medical devices
EMI Absorbing SheetsFlexible polymer matrices with magnetic particles (e.g., ferrite)5G base stations, radar systems
Conformal CoatingsThin-layer conductive paints or spraysPCB shielding, IoT device casings
Textile-Based ShieldsWoven fabrics with conductive yarns (e.g., silver-coated)Wearable electronics, flexible antennas

3. Structure and Composition

Typical products feature multi-layer architectures:

  • Base Substrate: Polymer films (PET, polyimide) or woven fabrics
  • Conductive Layer: Metal deposits (aluminum, copper) or conductive inks
  • Adhesive Interface: Acrylic or silicone-based adhesives for bonding
  • Protective Coating: Anti-oxidation layers (e.g., nickel-gold plating)
Absorbing materials often embed lossy magnetic particles (ferrite, carbonyl iron) in elastomeric matrices to convert EMI energy into heat.

4. Key Technical Specifications

ParameterDescriptionImportance
Shielding Effectiveness (SE)dB attenuation across 30 MHz 40 GHzDirectly impacts signal-to-noise ratio
Surface Resistivity0.01 100 /sqDetermines DC grounding performance
Relative Permeability1 1000 (absorbing materials)Influences magnetic field absorption
Temperature Stability-55 C to +150 C operational rangeEnsures reliability in harsh environments
Thickness0.05 5.0 mmAffects weight and flexibility

5. Application Areas

Primary industries include:

  • Telecommunications: 5G/6G infrastructure, fiber optic transceivers
  • Automotive: V2X communication modules, ADAS sensors
  • Healthcare: MRI-compatible devices, wireless patient monitors
  • Consumer Electronics: Foldable smartphones, AR/VR headsets
  • Defense: Electronic warfare systems, stealth coatings

6. Leading Manufacturers and Products

ManufacturerProductKey Features
3MScotch 9703LEAnisotropic conductive film for RF shielding
Laird Performance MaterialsHF Absorber 418 40 GHz broadband absorption
Saint-GobainTYGARD TC 1191Transparent conductive film for RFID antennas
Parker ChomericsCHO-SEAL 13350.05 mm thick EMI gasket material

7. Selection Guidelines

Key considerations:

  • Frequency Matching: Align SE performance with target bands (e.g., 2.4 GHz for Bluetooth)
  • Environmental Resistance: Chemical exposure, humidity, and vibration tolerance
  • Form Factor: Thin profiles for portable devices vs. rigid panels for infrastructure
  • Cost-Performance Balance: Silver-filled materials offer superior conductivity but higher cost
Case Study: Automotive radar systems use ferrite-loaded silicones to suppress 76 81 GHz interference while maintaining thermal stability.

8. Industry Trends

Emerging developments include:

  • 2D materials (graphene-enhanced composites) for sub-10 nm shielding layers
  • 4D-printed reconfigurable absorbers with tunable frequency response
  • RoHS-compliant alternatives to traditional heavy metal-based coatings
  • Integration with AI-driven EMI prediction models for optimized design
Market growth is driven by 5G expansion, with projected CAGR of 9.2% (2023 2030) according to Grand View Research.

RFQ BOM Call Skype Email
Top