RFI and EMI - Shielding and Absorbing Materials

Image Part Number Description / PDF Quantity Rfq
IFL10M-025NB300X200

IFL10M-025NB300X200

TDK Corporation

EMI ABSORBER 300 X 200MM SHEET

22

IFL04-100RN1HRX300

IFL04-100RN1HRX300

TDK Corporation

NFC SHIELD 100M X 300MM ROLL

0

IBF10GAB 115X115XP16

IBF10GAB 115X115XP16

TDK Corporation

NFC SHIELD 115 X 115MM SHEET

3

IFF08-100ND300X200

IFF08-100ND300X200

TDK Corporation

EMI ABSORBER 300 X 200MM SHEET

34

IFL12-100RN1HRX300

IFL12-100RN1HRX300

TDK Corporation

EMI ABSORBER 100M X 300MM ROLL

0

IFF08-050ND300X200

IFF08-050ND300X200

TDK Corporation

EMI ABSORBER 300 X 200MM SHEET

5

IFL04 100MX200XP1

IFL04 100MX200XP1

TDK Corporation

NFC SHIELD 100 X 200MM SHEET

0

IFL10M-050RN1HRX300

IFL10M-050RN1HRX300

TDK Corporation

EMI ABSORBER 100M X 300MM ROLL

0

IFL04-050RN1HRX300

IFL04-050RN1HRX300

TDK Corporation

NFC SHIELD 100M X 300MM ROLL

0

IFL16-050NB300X200

IFL16-050NB300X200

TDK Corporation

EMI ABSORBER 300 X 200MM SHEET

5

IFL10M-050NB300X200

IFL10M-050NB300X200

TDK Corporation

EMI ABSORBER 300 X 200MM SHEET

23

IFL04-100NB1HRX300

IFL04-100NB1HRX300

TDK Corporation

NFC SHIELD 100M X 300MM ROLL

0

IBF15-100DD125X125

IBF15-100DD125X125

TDK Corporation

NFC SHIELD 125 X 125MM SHEET

169

IFL16-100NB300X200

IFL16-100NB300X200

TDK Corporation

EMI ABSORBER 300 X 200MM SHEET

42

IFL10M-200NB300X200

IFL10M-200NB300X200

TDK Corporation

EMI ABSORBER 300 X 200MM SHEET

260

IFL04-100NB300X200

IFL04-100NB300X200

TDK Corporation

NFC SHIELD 300 X 200MM SHEET

252

IFL12-050RN1HRX300

IFL12-050RN1HRX300

TDK Corporation

EMI ABSORBER 100M X 300MM ROLL

0

IFL04-050NB300X200

IFL04-050NB300X200

TDK Corporation

NFC SHIELD 300 X 200MM SHEET

114

IFM16-030EB300X200

IFM16-030EB300X200

TDK Corporation

EMI ABSORBER 300 X 200MM SHEET

157

IFL10M-100NB300X200

IFL10M-100NB300X200

TDK Corporation

EMI ABSORBER 300 X 200MM SHEET

176

RFI and EMI - Shielding and Absorbing Materials

1. Overview

Radio Frequency Interference (RFI) and Electromagnetic Interference (EMI) are disruptive electromagnetic emissions that affect the performance of electronic devices. Shielding and absorbing materials mitigate these effects by blocking or dissipating electromagnetic energy. These materials are critical in RF/Intermediate Frequency (IF) circuits, RFID systems, and high-frequency electronics to ensure signal integrity, regulatory compliance, and operational reliability.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Metallic Shielding FoilsHigh conductivity, flexible, corrosion-resistant coatingsSmartphone enclosures, RFID tags
Conductive ElastomersElastomeric base with conductive fillers (e.g., silver, nickel)Aerospace connectors, medical devices
EMI Absorbing SheetsFlexible polymer matrices with magnetic particles (e.g., ferrite)5G base stations, radar systems
Conformal CoatingsThin-layer conductive paints or spraysPCB shielding, IoT device casings
Textile-Based ShieldsWoven fabrics with conductive yarns (e.g., silver-coated)Wearable electronics, flexible antennas

3. Structure and Composition

Typical products feature multi-layer architectures:

  • Base Substrate: Polymer films (PET, polyimide) or woven fabrics
  • Conductive Layer: Metal deposits (aluminum, copper) or conductive inks
  • Adhesive Interface: Acrylic or silicone-based adhesives for bonding
  • Protective Coating: Anti-oxidation layers (e.g., nickel-gold plating)
Absorbing materials often embed lossy magnetic particles (ferrite, carbonyl iron) in elastomeric matrices to convert EMI energy into heat.

4. Key Technical Specifications

ParameterDescriptionImportance
Shielding Effectiveness (SE)dB attenuation across 30 MHz 40 GHzDirectly impacts signal-to-noise ratio
Surface Resistivity0.01 100 /sqDetermines DC grounding performance
Relative Permeability1 1000 (absorbing materials)Influences magnetic field absorption
Temperature Stability-55 C to +150 C operational rangeEnsures reliability in harsh environments
Thickness0.05 5.0 mmAffects weight and flexibility

5. Application Areas

Primary industries include:

  • Telecommunications: 5G/6G infrastructure, fiber optic transceivers
  • Automotive: V2X communication modules, ADAS sensors
  • Healthcare: MRI-compatible devices, wireless patient monitors
  • Consumer Electronics: Foldable smartphones, AR/VR headsets
  • Defense: Electronic warfare systems, stealth coatings

6. Leading Manufacturers and Products

ManufacturerProductKey Features
3MScotch 9703LEAnisotropic conductive film for RF shielding
Laird Performance MaterialsHF Absorber 418 40 GHz broadband absorption
Saint-GobainTYGARD TC 1191Transparent conductive film for RFID antennas
Parker ChomericsCHO-SEAL 13350.05 mm thick EMI gasket material

7. Selection Guidelines

Key considerations:

  • Frequency Matching: Align SE performance with target bands (e.g., 2.4 GHz for Bluetooth)
  • Environmental Resistance: Chemical exposure, humidity, and vibration tolerance
  • Form Factor: Thin profiles for portable devices vs. rigid panels for infrastructure
  • Cost-Performance Balance: Silver-filled materials offer superior conductivity but higher cost
Case Study: Automotive radar systems use ferrite-loaded silicones to suppress 76 81 GHz interference while maintaining thermal stability.

8. Industry Trends

Emerging developments include:

  • 2D materials (graphene-enhanced composites) for sub-10 nm shielding layers
  • 4D-printed reconfigurable absorbers with tunable frequency response
  • RoHS-compliant alternatives to traditional heavy metal-based coatings
  • Integration with AI-driven EMI prediction models for optimized design
Market growth is driven by 5G expansion, with projected CAGR of 9.2% (2023 2030) according to Grand View Research.

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