RFI and EMI - Contacts, Fingerstock and Gaskets

Part Number	Description / PDF	Quantity
331081302025 Würth Elektronik Midcom	CONTACT FINGER EMI SMD	5490
3021007 Würth Elektronik Midcom	WE-LT CONDUCTIVE SHIELDING GASKE	44
38401402 Würth Elektronik Midcom	WE-EGS EMI ELASTOMER GASKET	10
30323231 Würth Elektronik Midcom	WE-LT CONDUCTIVE SHIELDING GASKE	147
3851080 Würth Elektronik Midcom	WE-CSGS CONTACT SPRING GASKET	50
331151722590 Würth Elektronik Midcom	WE-SECF SMT EMI CONTACT FINGER	1000
38401401 Würth Elektronik Midcom	WE-EGS EMI ELASTOMER GASKET	28
30304031 Würth Elektronik Midcom	GASKET FABRIC/FOAM 4MMX1M DSHAPE	6
3020303 Würth Elektronik Midcom	GASKET FABRIC/FOAM 3MMX1M SQ	17
3022104 Würth Elektronik Midcom	WE-LT CONDUCTIVE SHIELDING GASKE	150
3031313 Würth Elektronik Midcom	WE-LT CONDUCTIVE SHIELDING GASKE	94
302105115 Würth Elektronik Midcom	WE-LT CONDUCTIVE SHIELDING GASKE	0
331256381840 Würth Elektronik Midcom	WE-SECF SMT EMI CONTACT FINGER	4670
303045018 Würth Elektronik Midcom	WE-LT CONDUCTIVE SHIELDING GASKE	33
38401408 Würth Elektronik Midcom	WE-EGS EMI ELASTOMER GASKET	5
38401504 Würth Elektronik Midcom	WE-EGS EMI ELASTOMER GASKET	2
331171302030 Würth Elektronik Midcom	CONTACT FINGER EMI SMD	1245
331061603010 Würth Elektronik Midcom	CONTACT FINGER EMI SMD	1389
38401502 Würth Elektronik Midcom	WE-EGS EMI ELASTOMER GASKET	4
30506 Würth Elektronik Midcom	CONDUCTIVE NI/CU GLASS SLEEVE 1M	0

RFI and EMI - Contacts, Fingerstock and Gaskets

1. Overview

RF/IF (Radio Frequency/Intermediate Frequency) and RFID (Radio Frequency Identification) systems require effective electromagnetic interference (EMI) and radio frequency interference (RFI) shielding to maintain signal integrity. Contacts, fingerstock, and gaskets are critical components for ensuring electrical continuity and shielding performance in electronic enclosures. These components prevent electromagnetic leakage while maintaining mechanical functionality in connectors, housings, and assemblies.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Contacts	Conductive elements for maintaining electrical connections under compression	RF connectors, PCB grounding pads
Fingerstock	Resilient metal strips with finger-like projections for continuous shielding	Server chassis, military equipment
Gaskets	Conductive elastomers or mesh materials for sealing gaps	Automotive sensors, medical devices

3. Structure and Composition

Typical structures include:

Contacts: Beryllium copper or phosphor bronze cores with conductive platings (gold, silver, nickel)
Fingerstock: Canted coil springs or stamped metal fingers with corrosion-resistant coatings
Gaskets: Silicone rubber with embedded silver-aluminum particles or wire mesh

4. Key Technical Parameters

Parameter	Typical Range	Significance
Contact Resistance	0.1-10 m	Affects signal transmission efficiency
Shielding Effectiveness	60-120 dB (100 MHz-10 GHz)	Determines EMI/RFI attenuation
Compression Force	0.5-5 N/mm	Impacts mechanical durability
Temperature Range	-55 C to +150 C	Defines operational stability

5. Application Fields

Main industries include:

Telecommunications (5G base stations, microwave links)
Automotive (V2X communication systems, radar sensors)
Aerospace (avionics shielding compartments)
Medical (MRI shielding enclosures)

6. Leading Manufacturers and Products

Manufacturer	Representative Products
Parker Chomerics	CHO-SEAL conductive gaskets
Laird Performance Materials	Form-in-Place EMI gaskets
3M	EMI Shielding Tapes 9703/9706
Samtec	RFI/EMI shielded connectors

7. Selection Recommendations

Considerations include:

Frequency range of the application (higher frequencies require tighter tolerances)
Environmental conditions (temperature, humidity, chemical exposure)
Material compatibility (avoid galvanic corrosion between mating surfaces)
Cost-effectiveness (balance performance vs. budget constraints)

Case Study: In automotive radar systems, Parker Chomerics' silicone-based gaskets reduced EMI leakage by 40% compared to traditional metal fingerstock.

8. Industry Trends

Key development directions:

Miniaturization for 5G mmWave applications
Low-PIM (Passive Intermodulation) material formulations
Multi-functional integration with thermal management
RoHS-compliant plating processes (eliminating hexavalent chromium)