RFI and EMI - Contacts, Fingerstock and Gaskets

Part Number	Description / PDF	Quantity
30206025 Würth Elektronik Midcom	WE-LT CONDUCTIVE SHIELDING GASKE	0
3851130 Würth Elektronik Midcom	WE-CSGS CONTACT SPRING GASKET	96
331236362553 Würth Elektronik Midcom	WE-SECF SMD EMI CONTACT FINGER 3	3751
38401407 Würth Elektronik Midcom	WE-EGS EMI ELASTOMER GASKET	5
302115105 Würth Elektronik Midcom	WE-LT CONDUCTIVE SHIELDING GASKE	0
331041402053 Würth Elektronik Midcom	CONTACT FINGER EMI SMD	401
3030604 Würth Elektronik Midcom	GASKET FABRIC/FOAM 6MMX1M DSHAPE	0
3020909 Würth Elektronik Midcom	WE-LT CONDUCTIVE SHIELDING GASKE	79
3020604 Würth Elektronik Midcom	WE-LT CONDUCTIVE SHIELDING GASKE	61
38401103 Würth Elektronik Midcom	WE-EGS EMI ELASTOMER GASKET	5
38401204 Würth Elektronik Midcom	WE-EGS EMI ELASTOMER GASKET	5
331276483050 Würth Elektronik Midcom	WE-SECF SMT EMI CONTACT FINGER	3810
3851030 Würth Elektronik Midcom	WE-CSGS CONTACT SPRING GASKET	50
3029080080100 Würth Elektronik Midcom	WE-SMGS SURFACE MOUNT SOLDERABLE	852
38401412 Würth Elektronik Midcom	WE-EGS EMI ELASTOMER GASKET	8
38401303 Würth Elektronik Midcom	WE-EGS EMI ELASTOMER GASKET	0
3021508 Würth Elektronik Midcom	GASKET FABRIC/FOAM 15MMX1M RECT	33
30364361 Würth Elektronik Midcom	WE-LT CONDUCTIVE SHIELDING GASKE	32
30504 Würth Elektronik Midcom	CONDUCTIVE NI/CU GLASS SLEEVE 1M	3
3091010 Würth Elektronik Midcom	CONDUCTIVE SHIELDING GASKET 1000	57

RFI and EMI - Contacts, Fingerstock and Gaskets

1. Overview

RF/IF (Radio Frequency/Intermediate Frequency) and RFID (Radio Frequency Identification) systems require effective electromagnetic interference (EMI) and radio frequency interference (RFI) shielding to maintain signal integrity. Contacts, fingerstock, and gaskets are critical components for ensuring electrical continuity and shielding performance in electronic enclosures. These components prevent electromagnetic leakage while maintaining mechanical functionality in connectors, housings, and assemblies.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Contacts	Conductive elements for maintaining electrical connections under compression	RF connectors, PCB grounding pads
Fingerstock	Resilient metal strips with finger-like projections for continuous shielding	Server chassis, military equipment
Gaskets	Conductive elastomers or mesh materials for sealing gaps	Automotive sensors, medical devices

3. Structure and Composition

Typical structures include:

Contacts: Beryllium copper or phosphor bronze cores with conductive platings (gold, silver, nickel)
Fingerstock: Canted coil springs or stamped metal fingers with corrosion-resistant coatings
Gaskets: Silicone rubber with embedded silver-aluminum particles or wire mesh

4. Key Technical Parameters

Parameter	Typical Range	Significance
Contact Resistance	0.1-10 m	Affects signal transmission efficiency
Shielding Effectiveness	60-120 dB (100 MHz-10 GHz)	Determines EMI/RFI attenuation
Compression Force	0.5-5 N/mm	Impacts mechanical durability
Temperature Range	-55 C to +150 C	Defines operational stability

5. Application Fields

Main industries include:

Telecommunications (5G base stations, microwave links)
Automotive (V2X communication systems, radar sensors)
Aerospace (avionics shielding compartments)
Medical (MRI shielding enclosures)

6. Leading Manufacturers and Products

Manufacturer	Representative Products
Parker Chomerics	CHO-SEAL conductive gaskets
Laird Performance Materials	Form-in-Place EMI gaskets
3M	EMI Shielding Tapes 9703/9706
Samtec	RFI/EMI shielded connectors

7. Selection Recommendations

Considerations include:

Frequency range of the application (higher frequencies require tighter tolerances)
Environmental conditions (temperature, humidity, chemical exposure)
Material compatibility (avoid galvanic corrosion between mating surfaces)
Cost-effectiveness (balance performance vs. budget constraints)

Case Study: In automotive radar systems, Parker Chomerics' silicone-based gaskets reduced EMI leakage by 40% compared to traditional metal fingerstock.

8. Industry Trends

Key development directions:

Miniaturization for 5G mmWave applications
Low-PIM (Passive Intermodulation) material formulations
Multi-functional integration with thermal management
RoHS-compliant plating processes (eliminating hexavalent chromium)