RFI and EMI - Contacts, Fingerstock and Gaskets

Image Part Number Description / PDF Quantity Rfq
4243ABH1K01310

4243ABH1K01310

Laird - Performance Materials

GK NICU NRS PU V0 CSH

0

8563-0315-93

8563-0315-93

Laird - Performance Materials

OSTRSDRNG ECE093

0

0078002615

0078002615

Laird - Performance Materials

SLMT,4F,ZNC,USFT.

0

0098091802

0098091802

Laird - Performance Materials

S3,STR,BF,USFT,PSA

0

67B5N4004005108R00

67B5N4004005108R00

Laird - Performance Materials

SP,CON,TNR 5.10X4.00X4.00MM

0

67BCG2003002508R00

67BCG2003002508R00

Laird - Performance Materials

SP,CON,C,AU,TNR

0

4D11EA51K00405

4D11EA51K00405

Laird - Performance Materials

IO NICU NRS PU V0 REC

0

4209PA51G03600

4209PA51G03600

Laird - Performance Materials

GK NICU NRSG PU V0 REC

0

0097060715

0097060715

Laird - Performance Materials

CLO,STR,ZNC,DLN .280X.330X.250X1

0

0078001019

0078001019

Laird - Performance Materials

SLMT,STR,NIB,USFT

0

4181AB51K02400

4181AB51K02400

Laird - Performance Materials

GK NICU NRS PU V0 DSH

0

4094PA51H01614

4094PA51H01614

Laird - Performance Materials

GK NICU PTAFG PU V0 REC

0

0097055015

0097055015

Laird - Performance Materials

TWT,STR,ZNC,PSA

0

0C97055008

0C97055008

Laird - Performance Materials

TWT COIL SNSAT PSA

0

4283PA51H00970

4283PA51H00970

Laird - Performance Materials

GK NICU PTAFG PU V0 DSH

0

0098095409

0098095409

Laird - Performance Materials

S3,STR,NID,USFT,PSA

0

4223PA51G01490

4223PA51G01490

Laird - Performance Materials

GK NICU NRSG PU V0 REC

0

0097013602

0097013602

Laird - Performance Materials

CSTR,STR,BF

0

4220AB51K02400

4220AB51K02400

Laird - Performance Materials

GK NICU NRS PU V0 REC

0

4202AB51K09600

4202AB51K09600

Laird - Performance Materials

GK NICU NRS PU V0 DSH

0

RFI and EMI - Contacts, Fingerstock and Gaskets

1. Overview

RF/IF (Radio Frequency/Intermediate Frequency) and RFID (Radio Frequency Identification) systems require effective electromagnetic interference (EMI) and radio frequency interference (RFI) shielding to maintain signal integrity. Contacts, fingerstock, and gaskets are critical components for ensuring electrical continuity and shielding performance in electronic enclosures. These components prevent electromagnetic leakage while maintaining mechanical functionality in connectors, housings, and assemblies.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
ContactsConductive elements for maintaining electrical connections under compressionRF connectors, PCB grounding pads
FingerstockResilient metal strips with finger-like projections for continuous shieldingServer chassis, military equipment
GasketsConductive elastomers or mesh materials for sealing gapsAutomotive sensors, medical devices

3. Structure and Composition

Typical structures include:

  • Contacts: Beryllium copper or phosphor bronze cores with conductive platings (gold, silver, nickel)
  • Fingerstock: Canted coil springs or stamped metal fingers with corrosion-resistant coatings
  • Gaskets: Silicone rubber with embedded silver-aluminum particles or wire mesh

4. Key Technical Parameters

ParameterTypical RangeSignificance
Contact Resistance0.1-10 m Affects signal transmission efficiency
Shielding Effectiveness60-120 dB (100 MHz-10 GHz)Determines EMI/RFI attenuation
Compression Force0.5-5 N/mmImpacts mechanical durability
Temperature Range-55 C to +150 CDefines operational stability

5. Application Fields

Main industries include:

  • Telecommunications (5G base stations, microwave links)
  • Automotive (V2X communication systems, radar sensors)
  • Aerospace (avionics shielding compartments)
  • Medical (MRI shielding enclosures)

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
Parker ChomericsCHO-SEAL conductive gaskets
Laird Performance MaterialsForm-in-Place EMI gaskets
3MEMI Shielding Tapes 9703/9706
SamtecRFI/EMI shielded connectors

7. Selection Recommendations

Considerations include:

  • Frequency range of the application (higher frequencies require tighter tolerances)
  • Environmental conditions (temperature, humidity, chemical exposure)
  • Material compatibility (avoid galvanic corrosion between mating surfaces)
  • Cost-effectiveness (balance performance vs. budget constraints)

Case Study: In automotive radar systems, Parker Chomerics' silicone-based gaskets reduced EMI leakage by 40% compared to traditional metal fingerstock.

8. Industry Trends

Key development directions:

  • Miniaturization for 5G mmWave applications
  • Low-PIM (Passive Intermodulation) material formulations
  • Multi-functional integration with thermal management
  • RoHS-compliant plating processes (eliminating hexavalent chromium)
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