RFI and EMI - Contacts, Fingerstock and Gaskets

Image Part Number Description / PDF Quantity Rfq
4198ADH1K06900

4198ADH1K06900

Laird - Performance Materials

GK NICU NRS PU V0 CSH

0

4502AB51K04800

4502AB51K04800

Laird - Performance Materials

GK NICU NRS PU V0 JSH

0

4212AC51H01800

4212AC51H01800

Laird - Performance Materials

GK NICU PTAFG PU V0 SQ

0

1A0250R

1A0250R

Laird - Performance Materials

HF,NICU,NRS,CPSA,RL 25.0MM

0

0097055907

0097055907

Laird - Performance Materials

TWT,STR,SNPB,PSA.070X.305X.165X2

50

0097062217

0097062217

Laird - Performance Materials

CLO,STR,DLN,SNB

0

4502AB22100160

4502AB22100160

Laird - Performance Materials

GK NICU PTAF TPE HB JSH

0

4629AB51K01800

4629AB51K01800

Laird - Performance Materials

GK NICU NRS PU V0 REC

0

0098091302

0098091302

Laird - Performance Materials

S3,STR,BF,USF,RIV

0

0077001915

0077001915

Laird - Performance Materials

SLMT,4F,ZNC

0

4184PA51H01200

4184PA51H01200

Laird - Performance Materials

GK NICU PTAFG PU V0 DSH

0

4212PA51G02800

4212PA51G02800

Laird - Performance Materials

GK NICU NRSG PU V0 SQ

0

4R27PA51H01800

4R27PA51H01800

Laird - Performance Materials

GK,NICU,PTAFG,PU,V0,BELL

0

0097078200

0097078200

Laird - Performance Materials

DCON,50P,BF

0

4789PA51H00100

4789PA51H00100

Laird - Performance Materials

GK NICU PTAFG PU V0 DSH

0

4245AB51K09600

4245AB51K09600

Laird - Performance Materials

GK NICU NRS PU V0 REC

0

4056AB51K04800

4056AB51K04800

Laird - Performance Materials

GK NICU NRS PU V0 REC

0

0077001715

0077001715

Laird - Performance Materials

SLMT,2F,ZNC

0

4633AF51K00775

4633AF51K00775

Laird - Performance Materials

GK,NICU,NRS,PU,V0,BELL .100X.300

0

0098051517

0098051517

Laird - Performance Materials

NOSG,STR,SNB,USFT,PSA

0

RFI and EMI - Contacts, Fingerstock and Gaskets

1. Overview

RF/IF (Radio Frequency/Intermediate Frequency) and RFID (Radio Frequency Identification) systems require effective electromagnetic interference (EMI) and radio frequency interference (RFI) shielding to maintain signal integrity. Contacts, fingerstock, and gaskets are critical components for ensuring electrical continuity and shielding performance in electronic enclosures. These components prevent electromagnetic leakage while maintaining mechanical functionality in connectors, housings, and assemblies.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
ContactsConductive elements for maintaining electrical connections under compressionRF connectors, PCB grounding pads
FingerstockResilient metal strips with finger-like projections for continuous shieldingServer chassis, military equipment
GasketsConductive elastomers or mesh materials for sealing gapsAutomotive sensors, medical devices

3. Structure and Composition

Typical structures include:

  • Contacts: Beryllium copper or phosphor bronze cores with conductive platings (gold, silver, nickel)
  • Fingerstock: Canted coil springs or stamped metal fingers with corrosion-resistant coatings
  • Gaskets: Silicone rubber with embedded silver-aluminum particles or wire mesh

4. Key Technical Parameters

ParameterTypical RangeSignificance
Contact Resistance0.1-10 m Affects signal transmission efficiency
Shielding Effectiveness60-120 dB (100 MHz-10 GHz)Determines EMI/RFI attenuation
Compression Force0.5-5 N/mmImpacts mechanical durability
Temperature Range-55 C to +150 CDefines operational stability

5. Application Fields

Main industries include:

  • Telecommunications (5G base stations, microwave links)
  • Automotive (V2X communication systems, radar sensors)
  • Aerospace (avionics shielding compartments)
  • Medical (MRI shielding enclosures)

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
Parker ChomericsCHO-SEAL conductive gaskets
Laird Performance MaterialsForm-in-Place EMI gaskets
3MEMI Shielding Tapes 9703/9706
SamtecRFI/EMI shielded connectors

7. Selection Recommendations

Considerations include:

  • Frequency range of the application (higher frequencies require tighter tolerances)
  • Environmental conditions (temperature, humidity, chemical exposure)
  • Material compatibility (avoid galvanic corrosion between mating surfaces)
  • Cost-effectiveness (balance performance vs. budget constraints)

Case Study: In automotive radar systems, Parker Chomerics' silicone-based gaskets reduced EMI leakage by 40% compared to traditional metal fingerstock.

8. Industry Trends

Key development directions:

  • Miniaturization for 5G mmWave applications
  • Low-PIM (Passive Intermodulation) material formulations
  • Multi-functional integration with thermal management
  • RoHS-compliant plating processes (eliminating hexavalent chromium)
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